JPH01127688U - - Google Patents
Info
- Publication number
- JPH01127688U JPH01127688U JP1988019185U JP1918588U JPH01127688U JP H01127688 U JPH01127688 U JP H01127688U JP 1988019185 U JP1988019185 U JP 1988019185U JP 1918588 U JP1918588 U JP 1918588U JP H01127688 U JPH01127688 U JP H01127688U
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser light
- workpiece
- processing device
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Lasers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
第１図は本考案の一実施例によるレーザ加工装
置の概略側面図、第２図は本考案の他の実施例を
示す概略側面図である。第３図は従来のレーザ加
工装置を示す概略側面図である。
１……レーザ発振器、２……レーザ光学系、３
……レーザ放射口、４……ワーク台、５……加工
駆動部、６……レーザ強度測定センサー、７……
レーザ強度計測器、１０……レーザ発振体、１１
……Ｋｒ―アークランプ、１２，１３……反射鏡
、１４……被加工物。
FIG. 1 is a schematic side view of a laser processing apparatus according to one embodiment of the present invention, and FIG. 2 is a schematic side view showing another embodiment of the present invention. FIG. 3 is a schematic side view showing a conventional laser processing device. 1... Laser oscillator, 2... Laser optical system, 3
... Laser emission port, 4 ... Work table, 5 ... Processing drive unit, 6 ... Laser intensity measurement sensor, 7 ...
Laser intensity measuring device, 10... Laser oscillator, 11
...Kr--arc lamp, 12, 13... Reflector, 14... Workpiece.
Claims (1)
ザ加工装置において、レーザ光強度を測定するセ
ンサーを被加工物をのせて固定する加工物固定部
に取りつけたことを特徴とするレーザ加工装置。 A laser processing device for processing semiconductor substrates and the like using laser light, characterized in that a sensor for measuring laser light intensity is attached to a workpiece fixing part on which a workpiece is placed and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019185U JPH01127688U (en) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019185U JPH01127688U (en) | 1988-02-15 | 1988-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127688U true JPH01127688U (en) | 1989-08-31 |
Family
ID=31234474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019185U Pending JPH01127688U (en) | 1988-02-15 | 1988-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127688U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016206085A (en) * | 2015-04-27 | 2016-12-08 | パナソニックＩｐマネジメント株式会社 | Laser output measurement device and laser machining method |
-
1988
- 1988-02-15 JP JP1988019185U patent/JPH01127688U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016206085A (en) * | 2015-04-27 | 2016-12-08 | パナソニックＩｐマネジメント株式会社 | Laser output measurement device and laser machining method |