JPH01127393A - Thin type electronic equipment and manufacture thereof - Google Patents
Thin type electronic equipment and manufacture thereofInfo
- Publication number
- JPH01127393A JPH01127393A JP62284204A JP28420487A JPH01127393A JP H01127393 A JPH01127393 A JP H01127393A JP 62284204 A JP62284204 A JP 62284204A JP 28420487 A JP28420487 A JP 28420487A JP H01127393 A JPH01127393 A JP H01127393A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- printed
- anisotropic conductive
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims 3
- 239000003990 capacitor Substances 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000007639 printing Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は薄型電子機器及びその製造方法に係り、特にＣ
ＰＵを搭載するＩＣカード等の薄型電子機器及びその製
造方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to a thin electronic device and a method for manufacturing the same, and particularly relates to a thin electronic device and a manufacturing method thereof.
The present invention relates to a thin electronic device such as an IC card equipped with a PU and a method for manufacturing the same.
（従来の技術）
ＣＰＵを搭載するＩＣカード（以下、多機能カードと称
する）は、ＬＳＩ、液晶表示板、電池・水晶振動子・抵
抗・コンデンサ等の電子部品をプリント配線板に接続す
るために、それぞれワイヤボンディング又はＴＡＢ、ヒ
ートシール又は異方性導電膜、はんだ付は等で接続され
ていた。(Prior art) IC cards (hereinafter referred to as multifunction cards) equipped with a CPU are used to connect electronic components such as LSIs, liquid crystal display boards, batteries, crystal oscillators, resistors, and capacitors to printed wiring boards. , respectively, were connected by wire bonding, TAB, heat sealing, anisotropic conductive film, soldering, etc.
（発明が解決しようとする問題点）
上述のような接続方法を用いて製造された薄型電子機器
は、その接合方法が複数あったため製造工程に時間がか
かていた。さらに、ＬＳＩや液晶表示板に用いられる接
続方法は工程が複雑なうえ接続用材料が高価であるなど
の欠点があった。(Problems to be Solved by the Invention) Thin electronic devices manufactured using the above-mentioned connection method take a long time to manufacture because there are multiple joining methods. Furthermore, the connection methods used for LSIs and liquid crystal display boards have drawbacks such as complicated processes and expensive connection materials.
また、はんだ付けにおいては、はんだボールや残留フラ
ックスが生じ、薄型電子機器の信頼性を低下させる要因
の一つになっていた。Furthermore, during soldering, solder balls and residual flux are generated, which is one of the factors that reduce the reliability of thin electronic devices.
また、近頃の薄型電子機器はＩＤカード等を兼ねるよう
に設計されており厚さの均一性が非常に重要になってき
ている。上述のようにはんだ付けによって電子部品を実
装した薄型電子機器ははんだ量やはんだ付は条件が厚さ
に大きく影響し、薄型電子機器が−様な厚さになるよう
に制御することが大変であった。Furthermore, recent thin electronic devices are designed to double as ID cards and the like, and uniformity in thickness has become very important. As mentioned above, the thickness of thin electronic devices with electronic components mounted by soldering is greatly influenced by the amount of solder and soldering conditions, and it is difficult to control the thickness of thin electronic devices so that they have various thicknesses. there were.
本発明は上述のような問題点を解決し、プリント配線基
板と電子部品との接続において、自動化が容易な接続方
法と薄型電子機器を提供する。The present invention solves the above-mentioned problems and provides a connection method and thin electronic device that can be easily automated in connection between a printed wiring board and an electronic component.
［発明の構成］
（問題点を解決するための手段）
薄型電子機器内部のプリント配線基板と電子部品の接合
において、プリント配線基板の電子部品接合部に異方性
導電膜等の異方性導電接着剤をスクリーン印刷により塗
布する。次にプリント配線基板上の異方性導電接着剤を
乾燥させる。続いてプリント配線基板上に電子部品を載
置し熱圧着することにより電子部品を実装させる薄型電
子機器の製造方法と、この製造方法によって製造された
薄型電子機器を提供する。[Structure of the Invention] (Means for Solving the Problems) When bonding a printed wiring board and an electronic component inside a thin electronic device, an anisotropic conductive film such as an anisotropic conductive film is applied to the electronic component bonding portion of the printed wiring board. Apply the adhesive by screen printing. Next, the anisotropic conductive adhesive on the printed wiring board is dried. Next, a method for manufacturing a thin electronic device in which the electronic component is mounted on a printed wiring board and thermocompression bonding is provided, and a thin electronic device manufactured by this manufacturing method is provided.
このとき、プリント配線基板はスクリーン印刷を行うた
めに片面のみに電子部品を実装させる必要がある。At this time, it is necessary to mount electronic components on only one side of the printed wiring board in order to perform screen printing.
（作用）
プリント配線基板と電子部品との接合を異方性導電接着
剤を用いることでスクリーン印刷により一括して電子部
品の実装工程を簡略化できる。(Function) By using an anisotropic conductive adhesive to bond the printed wiring board and electronic components, the process of mounting the electronic components can be simplified by screen printing.
また、各電子部品を同一の方法により接合できるので、
従来の複雑な設備を複数必要とする必要がない。In addition, since each electronic component can be joined using the same method,
There is no need for multiple conventional complex equipment.
また、このようにして製造された薄型電子機器は異方性
導電接着剤により接合した部分の厚さのばらつきが小さ
いので厚さを均一にすることが容易に行なうことができ
る。Furthermore, since the thickness of the thin electronic device manufactured in this manner has small variations in the thickness of the portion bonded using the anisotropic conductive adhesive, the thickness can be easily made uniform.
（実施例）
以下に本発明の方法を用いて製造された電子部品とその
製造工程の一実施例を第１図乃至第４図を参照にして示
す。(Example) An example of an electronic component manufactured using the method of the present invention and its manufacturing process will be shown below with reference to FIGS. 1 to 4.
第１図に本発明の方法のフローチャートを示す。FIG. 1 shows a flowchart of the method of the invention.
このフローチャートに基づき第４図に示した多機能カー
ド（１０）が製造されていく過程を第２図乃至第４図に
示す。第２図は多機能カードのプリント配線基板（１）
である。第３図に示した各種電子部品（順次液晶表示板
、ＬＳＩ、水晶振動子、抵抗、コンデンサ、電池） （
３）、（４）、（５）、（６）、（７）、（８）が接続
される電極（２）を有している。この電極（２）部分に
スクリーン印刷を用いて第４図に砂目で示した部分に異
方性導電膜（９）を印刷する。続いて、印刷を終えたプ
リント配線基板（１）をｔｏｏ’ｃで２分間加熱し、乾
燥させる。この後、第３図に示したプリント配線基板（
１）上の所定の位置に電子部品（３） 、 （４） 、
（５） 、 （６） 、 （７） 、 （８）を順次
載置し、これを図示しない熱圧着装置で熱圧着し接続す
る。The process of manufacturing the multifunction card (10) shown in FIG. 4 based on this flowchart is shown in FIGS. 2 to 4. Figure 2 shows the printed wiring board (1) of the multi-function card.
It is. Various electronic components shown in Figure 3 (liquid crystal display board, LSI, crystal resonator, resistor, capacitor, battery) (
It has an electrode (2) to which 3), (4), (5), (6), (7), and (8) are connected. An anisotropic conductive film (9) is printed on this electrode (2) portion using screen printing in the portion shown with grain in FIG. 4. Subsequently, the printed wiring board (1) that has been printed is heated with too'c for 2 minutes to dry it. After this, the printed wiring board (
1) Place electronic components (3), (4),
(5), (6), (7), and (8) are sequentially placed and connected by thermocompression bonding using a thermocompression bonding device (not shown).
このとき熱圧着装置の加圧力とヒータの温度は、異方性
導電膜（９）で１４０℃、３０ｋｇ／ｃ＋？になるよう
に各電子部品（３） 、 （４） 、 （５） 、 （
Ｂ） 、 （７）、 （８）毎に設定されている。また
、このときの電子部品（３） 、 （４） 。At this time, the pressure of the thermocompression bonding device and the temperature of the heater were 140°C and 30kg/c+ for the anisotropic conductive film (9). Each electronic component (3), (4), (5), (
B), (7), and (8). Also, electronic components (3) and (4) at this time.
（５） 、 （６）、 （７） 、 （８）の載置と、
熱圧着は各電子部品（３） 、 （４） 、 （５）
、 （８） 、 （７） 、 （８）毎に行ってもよい
。Placement of (5), (6), (7), and (8),
Thermocompression bonding is applied to each electronic component (3), (4), (5)
, (8), (7), and (8).
また、載置後に一括して熱圧着を行ってもよい”もので
ある。さらに、このときのプリント配線基板（１）は熱
圧着に際して、−面のみに部品実装を行うようにして作
業の能率を上げるように工夫されている。In addition, after mounting, thermocompression bonding may be performed all at once.Furthermore, during thermocompression bonding of the printed wiring board (1) at this time, parts are mounted only on the - side to improve work efficiency. It is designed to increase the
このように製造されたプリント配線基、［（１）を用い
て図示しない多機能カードを構成する。A multifunctional card (not shown) is constructed using the printed wiring board manufactured in this manner (1).
なお、本実施例では異方性導電接着剤として異方性導電
膜を用いたが、本発明はこれに限定されるものではない
。Note that although an anisotropic conductive film was used as the anisotropic conductive adhesive in this example, the present invention is not limited thereto.
［発明の効果コ
上述のような薄型電子機器の製造方法は、従来の接合方
法より簡単な設備でプリント配線基板と電子部品とを接
合できる。また、接合工程の大幅な簡略化を実現できる
ものである。[Effects of the Invention] The method for manufacturing thin electronic devices as described above can bond printed wiring boards and electronic components with simpler equipment than conventional bonding methods. Furthermore, it is possible to significantly simplify the bonding process.
また、異方性導電膜で接合を行った場合、接合部の厚さ
のばらつきを小さくできるので電子機器の厚みが均一な
薄型電子機器を構成できる。Further, when bonding is performed using an anisotropic conductive film, variations in the thickness of the bonded portion can be reduced, so that a thin electronic device with a uniform thickness can be constructed.
第１図は本発明の方法を示すフローチャート、第２図は
一実施例に用いた多機能カードのプリント配線基板を示
す斜視図、第３図は同じく電子部品を実装したプリント
配線基板を示す斜視図、第４図は同じく電極に異方性導
電膜を塗布したプリント配線基板を示す斜視図である。
１・・・プリント配線基板、 ２・・・電極、３．４，
５，６，７．８・・・電子部品、９・・・異方性導電膜FIG. 1 is a flowchart showing the method of the present invention, FIG. 2 is a perspective view showing a printed wiring board of a multifunctional card used in one embodiment, and FIG. 3 is a perspective view showing a printed wiring board on which electronic components are mounted. FIG. 4 is a perspective view showing a printed wiring board having electrodes coated with an anisotropic conductive film. 1... Printed wiring board, 2... Electrode, 3.4,
5,6,7.8...Electronic component, 9...Anisotropic conductive film
Claims (3)
の接合部において、プリント配線基板と電子部品との間
をスクリーン印刷により塗布された異方性導電接着剤で
接合したことを特徴とした薄型電子機器。(1) Thin type characterized by the fact that at the joint between the printed wiring board and electronic components inside the thin electronic device, the printed wiring board and electronic components are bonded using an anisotropic conductive adhesive applied by screen printing. Electronics.
の接合部をプリント配線基板片面のみに形成したことを
特徴とする特許請求の範囲第１項記載の薄型電子機器。(2) The thin electronic device according to claim 1, wherein the connecting portion between the printed wiring board and the electronic component inside the thin electronic device is formed only on one side of the printed wiring board.
の接合方法において、プリント配線基板の電子部品接合
部に異方性導電接着剤をスクリーン印刷により塗布する
異方性導電接着剤塗布工程と、この異方性導電接着剤塗
布工程より得たプリント配線基板上の異方性導電接着剤
を乾燥させる接着剤乾燥工程と、接着剤乾燥工程より得
たプリント配線基板上に電子部品を載置し熱圧着するこ
とにより電子部品を実装させる電子部品実装工程とを具
備することを特徴とする薄型電子機器の製造方法。(3) In the method for joining a printed wiring board and electronic components inside a thin electronic device, an anisotropic conductive adhesive application step of applying an anisotropic conductive adhesive to the electronic component joining portion of the printed wiring board by screen printing; There is an adhesive drying step of drying the anisotropic conductive adhesive on the printed wiring board obtained from this anisotropic conductive adhesive application step, and an electronic component is placed on the printed wiring board obtained from the adhesive drying step. 1. A method for manufacturing a thin electronic device, comprising an electronic component mounting step of mounting an electronic component by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62284204A JPH01127393A (en) | 1987-11-12 | 1987-11-12 | Thin type electronic equipment and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62284204A JPH01127393A (en) | 1987-11-12 | 1987-11-12 | Thin type electronic equipment and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127393A true JPH01127393A (en) | 1989-05-19 |
Family
ID=17675506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62284204A Pending JPH01127393A (en) | 1987-11-12 | 1987-11-12 | Thin type electronic equipment and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127393A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480123U (en) * | 1990-11-23 | 1992-07-13 | ||
| JPH08287208A (en) * | 1995-04-13 | 1996-11-01 | Sony Chem Corp | Noncontact ic card and its manufacture |
| WO1999008192A1 (en) * | 1997-08-07 | 1999-02-18 | Hitachi, Ltd. | Semiconductor device |
| WO2001001342A1 (en) * | 1999-06-29 | 2001-01-04 | Sony Chemicals Corp. | Ic card |
-
1987
- 1987-11-12 JP JP62284204A patent/JPH01127393A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480123U (en) * | 1990-11-23 | 1992-07-13 | ||
| JPH08287208A (en) * | 1995-04-13 | 1996-11-01 | Sony Chem Corp | Noncontact ic card and its manufacture |
| WO1999008192A1 (en) * | 1997-08-07 | 1999-02-18 | Hitachi, Ltd. | Semiconductor device |
| WO2001001342A1 (en) * | 1999-06-29 | 2001-01-04 | Sony Chemicals Corp. | Ic card |
| US6585165B1 (en) | 1999-06-29 | 2003-07-01 | Sony Chemicals Corp. | IC card having a mica capacitor |
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