JPH01126344A - Production of laminated board - Google Patents
Production of laminated boardInfo
- Publication number
- JPH01126344A JPH01126344A JP28366587A JP28366587A JPH01126344A JP H01126344 A JPH01126344 A JP H01126344A JP 28366587 A JP28366587 A JP 28366587A JP 28366587 A JP28366587 A JP 28366587A JP H01126344 A JPH01126344 A JP H01126344A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- water
- prepreg
- sheets
- resin emulsion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- 239000000839 emulsion Substances 0.000 claims abstract description 11
- 239000002966 varnish Substances 0.000 claims abstract description 9
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002612 dispersion medium Substances 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 abstract 2
- 238000007731 hot pressing Methods 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- DQYBDCGIPTYXML-UHFFFAOYSA-N ethoxyethane;hydrate Chemical compound O.CCOCC DQYBDCGIPTYXML-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐熱性、耐水性および耐電食性に優れた積層
板に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a laminate having excellent heat resistance, water resistance and electrolytic corrosion resistance.
（従来技術とその問題点）
近年、電子機器工業の著しい発展に伴い、回路の高密度
化が進み、ざらに耐熱性にも優れた積層板が求められて
いる。(Prior art and its problems) In recent years, with the remarkable development of the electronic equipment industry, the density of circuits has increased, and there is a demand for laminates with excellent heat resistance.
一方、上記の如き回路の高密度化により、隣接する回路
間において、電位差により銅が溶は出し、これにより両
電極間にブリッジを形成し、短絡を生じさせるいわゆる
デンドライト（電食）も問題となってきている。On the other hand, due to the high density of circuits as described above, copper is dissolved due to the potential difference between adjacent circuits, and this causes a bridge between the two electrodes, causing a short circuit, which is called dendrite (electrolytic corrosion). It has become to.
そこで、電気的特性、化学的特性に優れた、紙エポキシ
基材よりなる積層板が、上記要求に対応すべく開発、研
究されている。Therefore, a laminate made of a paper epoxy base material with excellent electrical and chemical properties has been developed and researched to meet the above requirements.
ところで上記紙エポキシ基材は、エポキシ樹脂が紙への
含浸性が悪いため、従来フェノール樹脂等水系ワニスで
下塗りされている。しかし、上記フェノール樹脂は、耐
熱性、耐水性の点でエポキシ樹脂より劣っており、絶縁
性もエポキシ樹脂と比べて悪い。そのため、上記フェノ
ール樹脂を下塗り樹脂に用いた積層板は、耐熱性、耐水
性、絶縁性特性に劣るという問題点がある。By the way, the paper epoxy base material is conventionally undercoated with a water-based varnish such as phenol resin because epoxy resin has poor impregnating properties into paper. However, the above-mentioned phenol resin is inferior to epoxy resin in terms of heat resistance and water resistance, and its insulation properties are also inferior to epoxy resin. Therefore, a laminate using the above-mentioned phenol resin as an undercoat resin has a problem in that it is inferior in heat resistance, water resistance, and insulation properties.
（発明の目的） 本発明は、上記問題点に鑑み、耐熱性、耐水性。(Purpose of the invention) In view of the above problems, the present invention provides heat resistance and water resistance.
絶縁特性等に優れた積層板の製造方法を提供することを
目的とする。The purpose of the present invention is to provide a method for manufacturing a laminate with excellent insulation properties.
（問題点を解決するための手段）
本発明は、紙基材に水を分散媒とするエポキシ樹脂エマ
ルジョンを含浸、乾燥させた後、エポキシ樹脂ワニスを
含浸乾燥させてプリプレグとし、このプリプレグを所定
枚数重ねて加熱加圧することを特徴とする積層板の製造
方法に関する。(Means for Solving the Problems) The present invention impregnates a paper base material with an epoxy resin emulsion using water as a dispersion medium and dries it, and then impregnates and dries an epoxy resin varnish to form a prepreg. The present invention relates to a method for manufacturing a laminate, which is characterized by stacking several sheets and heating and pressurizing them.
本発明では、下塗り樹脂として水を分散媒とするエポキ
シ樹脂エマルジョンが用いられ、紙基材に含浸されてい
る。これは、積層板の耐熱性、耐水性等の向上を図るに
は積層板を構成する各プリプレグである紙エポキシ基材
の耐熱性、耐水性の向上を図る必要があるためである。In the present invention, an epoxy resin emulsion containing water as a dispersion medium is used as the undercoat resin, and is impregnated into the paper base material. This is because in order to improve the heat resistance, water resistance, etc. of the laminate, it is necessary to improve the heat resistance and water resistance of the paper epoxy base material, which is each prepreg forming the laminate.
ところで、フェノール樹脂を下塗り樹脂に用いる場合、
紙基材層での吸水が大きくなっている。また吸水後の耐
熱試験による脹れ等もエポキシ樹脂層で起こることは少
なく、はとんど紙基材層で起こっている。By the way, when using phenolic resin as an undercoat resin,
Water absorption in the paper base layer is large. In addition, swelling and the like due to heat resistance tests after water absorption rarely occur in the epoxy resin layer, but mostly in the paper base layer.
これはフェノールが水溶性であるため吸水性が大きいこ
と、また反応が脱水縮合反応であるため、水が発生しや
すいこと等に起因している。This is due to the fact that phenol is water-soluble and therefore has high water absorption, and that the reaction is a dehydration condensation reaction, so water is easily generated.
そこで、本発明では、紙基材の下塗り樹脂として上記の
如くエポキシ樹脂を用いている。これは、エポキシ樹脂
自体フェノール樹脂と比べ、電気的。Therefore, in the present invention, an epoxy resin is used as the undercoat resin for the paper base as described above. This makes epoxy resin itself more electrically conductive than phenolic resin.
化学的特性等に優れているとともに、これを水エマルジ
ヨン化することにより、紙への含浸性が大幅に良好とな
るからである。This is because it has excellent chemical properties and the like, and when it is made into a water emulsion, its impregnating properties into paper are significantly improved.
また、ジシアンジアミドは、一般には溶媒に対して溶解
度の小さい物質であるが、水には比較的良く溶け、水エ
マルジヨン系エポキシ樹脂の硬化剤としては適している
。Furthermore, although dicyandiamide is generally a substance with low solubility in solvents, it is relatively well soluble in water and is suitable as a curing agent for water emulsion type epoxy resins.
（実施例の説明） 次に本発明を実施例および比較例に基づいて説明する。(Explanation of Examples) Next, the present invention will be explained based on Examples and Comparative Examples.
なお、以下において「部」とは「重量部」をいう。In addition, in the following, "part" refers to "part by weight".
実施例１
下記配合の下塗りワニスを、紙基材に含浸乾燥させ、上
塗りエポキシワニスをざらに含浸乾燥させた後、プリプ
レグとし、これを７枚重ねプレスして積層板とした。Example 1 A paper base material was impregnated with an undercoat varnish having the following composition and dried, and a topcoat epoxy varnish was roughly impregnated and dried to form a prepreg. Seven sheets of this were stacked and pressed to form a laminate.
水分散ＢＰＡ型エポキシ樹脂 ・・・９０部水分
散ノボラック型エポキシ樹脂 ・・・１０部ジシアン
ジアミド ・・・０．５当量２Ｅ４ＭＺ
・・・０．６部溶剤・・・水およ
び水／エチレングリコールモノエチルエーテル
比較例１
下記配合の下塗りワニスを製造し、上記実施例］と同様
にして積層板を製造した。Water-dispersed BPA type epoxy resin...90 parts Water-dispersed novolac type epoxy resin...10 parts Dicyandiamide...0.5 equivalent 2E4MZ
...0.6 parts Solvent...Water and Water/Ethylene Glycol Monoethyl Ether Comparative Example 1 An undercoat varnish having the following formulation was produced, and a laminate was produced in the same manner as in the above Example].
フェノール ・・・３０部ホルム
アルデヒド ・・・７０部トリメチル
アミン ・・・３部溶剤
・・・メタノール／水上記実施例１および
比較例１によって得られた積層板を用いて下記項目につ
き試験を行なった。Phenol...30 parts Formaldehyde...70 parts Trimethylamine...3 parts Solvent
...Methanol/Water Tests were conducted on the following items using the laminates obtained in Example 1 and Comparative Example 1 above.
次表に試験結果を示す。The test results are shown in the table below.
＊ＪＩＳ Ｃ６４８１−５，５に準する上記実験結果
からも明らかなように、水エポキシエマルジョンを用い
て下塗りを行なった系は、良好な耐熱性、耐水性、耐電
食性を示した。*As is clear from the above experimental results based on JIS C6481-5,5, the system in which the undercoat was applied using the water-epoxy emulsion exhibited good heat resistance, water resistance, and electrolytic corrosion resistance.
また上記実施例１による配合で下塗りを行なった紙基材
は、上塗りエポキシ樹脂とも良好な密着性を示した。ま
た、断面部分の吸水が少なくなるとともに、製造時、従
来のフェノール樹脂ワニス使用時の場合の如き硬化収縮
もなくなり、紙基材のカール現象が抑えられ作業性も向
上した。Furthermore, the paper base material that was undercoated with the formulation according to Example 1 showed good adhesion to the topcoat epoxy resin. In addition, water absorption in the cross-sectional area is reduced, and curing shrinkage that occurs when conventional phenolic resin varnishes are used during production is eliminated, the curling phenomenon of the paper base material is suppressed, and workability is improved.
（発明の効果）
本発明になる積層板は、上記の如く、下塗り樹脂として
紙基材にエポキシ樹脂を含浸塗布することにより各プレ
プリグを構成したので、耐熱性。(Effects of the Invention) As described above, the laminate of the present invention has heat resistance because each prepreg is constructed by impregnating and coating a paper base material with an epoxy resin as an undercoat resin.
耐水性、絶縁特性に優れた積層板を得ることができる等
の効果を有する。It has effects such as being able to obtain a laminate with excellent water resistance and insulation properties.
Claims (2)
ョンを含浸、乾燥させた後、エポキシ樹脂ワニスを含浸
乾燥させてプリプレグとし、このプリプレグを所定枚数
重ねて加熱加圧することを特徴とする積層板の製造方法
。(1) A paper base material is impregnated with an epoxy resin emulsion using water as a dispersion medium, dried, and then impregnated with an epoxy resin varnish and dried to form a prepreg, and a predetermined number of sheets of this prepreg are stacked and heated and pressurized. Method of manufacturing laminates.
アンジアミドを含むことを特徴とする特許請求の範囲第
１項記載の積層板の製造方法。(2) The method for producing a laminate according to claim 1, wherein the epoxy resin emulsion contains dicyandiamide as a curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28366587A JPH01126344A (en) | 1987-11-10 | 1987-11-10 | Production of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28366587A JPH01126344A (en) | 1987-11-10 | 1987-11-10 | Production of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01126344A true JPH01126344A (en) | 1989-05-18 |
Family
ID=17668474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28366587A Pending JPH01126344A (en) | 1987-11-10 | 1987-11-10 | Production of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01126344A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996033235A1 (en) * | 1995-04-19 | 1996-10-24 | Shell Internationale Research Maatschappij B.V. | Stable waterbone epoxy resin dispersion |
| US11057991B2 (en) | 2009-12-16 | 2021-07-06 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
-
1987
- 1987-11-10 JP JP28366587A patent/JPH01126344A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996033235A1 (en) * | 1995-04-19 | 1996-10-24 | Shell Internationale Research Maatschappij B.V. | Stable waterbone epoxy resin dispersion |
| US11057991B2 (en) | 2009-12-16 | 2021-07-06 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
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