JPH01115938A - Production of laminated board - Google Patents
Production of laminated boardInfo
- Publication number
- JPH01115938A JPH01115938A JP27423687A JP27423687A JPH01115938A JP H01115938 A JPH01115938 A JP H01115938A JP 27423687 A JP27423687 A JP 27423687A JP 27423687 A JP27423687 A JP 27423687A JP H01115938 A JPH01115938 A JP H01115938A
- Authority
- JP
- Japan
- Prior art keywords
- oil
- base material
- phenolic resin
- varnish
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002966 varnish Substances 0.000 claims abstract description 17
- 239000005011 phenolic resin Substances 0.000 claims abstract description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000839 emulsion Substances 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000007598 dipping method Methods 0.000 claims abstract description 3
- 238000010030 laminating Methods 0.000 claims abstract 3
- 239000000463 material Substances 0.000 claims description 22
- 238000001035 drying Methods 0.000 claims description 16
- 150000002989 phenols Chemical class 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000123 paper Substances 0.000 description 12
- 238000005470 impregnation Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000009833 condensation Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000005494 condensation Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 2
- 240000002834 Paulownia tomentosa Species 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、打抜き加工性、電気特性及び耐湿特性に優れ
たフェノール樹脂積層板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for producing a phenolic resin laminate having excellent punching workability, electrical properties and moisture resistance properties.
従来の技術
フェノール樹脂積層板は、従来より民生用電子機器分野
に、プリント回路用基板等に広く用いられておシ、特に
近年の電子部品の高機能。Conventional technology Phenolic resin laminates have been widely used in the field of consumer electronics and printed circuit boards, especially in the high-performance electronic components of recent years.
高密度実装化が進むにつれて、積層板に対する電気特性
、耐湿特性の向上及び打抜き加工性も低温打抜きが可能
である事等の要求が益々強まっている。As high-density packaging progresses, there is an increasing demand for laminates to have improved electrical properties and moisture resistance properties, and to be able to be punched at low temperatures.
これらの要求に対応するために、従来は、低縮合のフェ
ノール樹脂を有機溶剤に溶解したフェノを紙或いはガラ
ス不織布等の基材に含浸し乾燥する第一工程と、次に油
変性フェノール樹脂ワニスを含浸、乾燥する第二工程の
二段含浸乾燥によシブリプレグを作製する方法が用いら
れている。或は、前述の低縮合フェノール樹脂は水と有
機溶剤の混合系でフェノとして第一工程を行い、油変性
フェノール樹脂ワニスを含浸乾燥する第二工程を行なう
方法、更に、打抜き加工性を向上させるため、前述の油
変性として桐油、大豆油、亜麻仁油或はヒマシ油等で変
性し、加えて可塑剤を添加し可塑化を向上させる方法が
とられている。In order to meet these demands, conventionally, the first step was to impregnate a base material such as paper or glass nonwoven fabric with phenol, which is a low-condensation phenol resin dissolved in an organic solvent, and dry it, and then to apply an oil-modified phenol resin varnish. A method is used in which Sibripreg is produced by a two-stage impregnation and drying process in which the second step is impregnation and drying. Alternatively, the above-mentioned low condensation phenol resin may be processed into a phenol in a mixed system of water and an organic solvent in the first step, followed by a second step of impregnating and drying with an oil-modified phenol resin varnish, and further improving the punching processability. Therefore, as the oil modification described above, a method is used in which the oil is modified with tung oil, soybean oil, linseed oil, castor oil, etc., and in addition, a plasticizer is added to improve plasticization.
発明が解決しようとする問題点
前述の如く、第一工程として、有機溶剤を用いて低縮合
のフェノール樹脂を溶解しワニスとして用い、第二工程
として桐油等で変性したフェノール樹脂ワニスを用いる
方法や可盟剤を添加する方法では、打抜き加工性に関し
て密集小穴形成時の層間密着性と耐クラツク性及び電気
特性、耐湿特性等に問題がある。又、低縮合フェノール
樹脂を水と有機溶剤の混合系で溶解して用いる方法では
、樹脂含浸方法として、基材をワニス中に浸漬するデイ
、ツブ含浸方式或はロールコータ一方式による含浸方法
がとられているが、含浸時に紙の強度劣化による基材の
切れが生じやすい。更に、加熱乾燥時に多量の熱を必要
へすることや、乾燥中の溶剤ガス濃度が増加し、量産性
及び安全性上の問題がある０本発明は、上記の欠点を除
去するもので、打抜き加工性、電気特性、耐湿特性に優
れた積層板を量産性に優れた方法で提供する事を目的と
する。Problems to be Solved by the Invention As mentioned above, in the first step, a low condensation phenolic resin is dissolved using an organic solvent and used as a varnish, and in the second step, a phenolic resin varnish modified with tung oil etc. is used. The method of adding an embedding agent has problems with regard to punching workability, such as interlayer adhesion and crack resistance when forming dense small holes, electrical properties, and moisture resistance properties. In addition, in the method of using a low condensation phenol resin dissolved in a mixed system of water and an organic solvent, the resin impregnation method can be a day or spit impregnation method in which the base material is immersed in a varnish, or an impregnation method using a roll coater one method. However, the base material tends to break due to deterioration of paper strength during impregnation. Furthermore, a large amount of heat is required during heating and drying, and the concentration of solvent gas increases during drying, which poses problems in terms of mass production and safety.The present invention eliminates the above-mentioned drawbacks. The purpose is to provide laminates with excellent workability, electrical properties, and moisture resistance properties using a method that is highly mass-producible.
問題点を解決するための手段
本発明は上記の目的を達成するためになされたもので、
紙基材に油変性フェノール樹脂の水分散媒エマルジョン
を噴霧付着させてロールで加圧することにより含浸させ
乾燥する第一工程と、次いで前記工程を経た紙基材に油
変性フェノール樹脂ワニスを浸漬あるいはロールコータ
−により含浸させ乾燥させる第二工程を経てプリプレグ
を得、このプリプレグを積層成形するものである。Means for Solving the Problems The present invention has been made to achieve the above objects.
A first step of spraying an aqueous dispersion medium emulsion of an oil-modified phenolic resin onto a paper base material and impregnating it by applying pressure with a roll and drying the paper base material, followed by dipping or drying an oil-modified phenol resin varnish onto the paper base material that has undergone the above steps. A prepreg is obtained through a second step of impregnating and drying using a roll coater, and this prepreg is laminated and molded.
作用
本発明は、（１）油変性フェノール樹脂のエマルジョン
を噴霧塗工するので、デイツプ含浸やロールコータ方式
に比べて基材への水分付着量を抑制できるため、基材の
切れを防止できる。Effects of the present invention (1) Since the oil-modified phenol resin emulsion is spray-coated, the amount of moisture adhering to the base material can be suppressed compared to dip impregnation or roll coater methods, and thus cutting of the base material can be prevented.
（２）水分散媒のエマルジョンを使用すること並びにロ
ールで加圧して強制含浸を行なうことによυ、基材中へ
の樹脂の浸透性がよくなシ、得られた積層板の打抜加工
性、電気特性、耐湿特性の向上につながる。(2) By using an emulsion of an aqueous dispersion medium and by performing forced impregnation by applying pressure with a roll, the permeability of the resin into the base material is good, and the resulting laminate is punched. This leads to improved performance, electrical properties, and moisture resistance.
（３）第一工程で水の付着量は少ないので乾燥に必要な
熱量は少なくてすみ、また、水を使用することから乾燥
中の有機溶剤のガス濃度も低下する○
実施例
次に、本発明の一実施例を説明する。(3) Since the amount of water attached in the first step is small, the amount of heat required for drying is small, and since water is used, the gas concentration of the organic solvent during drying is also reduced. An embodiment of the invention will be described.
実施例１
桐油変性フェノール樹脂１００重量部（固形）に対して
、界面活性剤を３ｔｉ部添加し、さらに水を添加して攪
拌混合し、固形濃度１０重量％のエマルジョンワニスＡ
を得た。含浸の第一工程として、エマルジョンワニスＡ
を第１図に示すようにスプレー装ｆ！Ｌ１により、移送
される長尺の紙基材２（ＩＩミルスのクラフト紙）に噴
霧付着させ、さらに一対のロール３の間を通すことによ
り、エマルジョンワニスＡを紙基材２強制的に含浸させ
、その後乾燥炉４に導入して予備乾燥を行なった。Example 1 3ti parts of surfactant was added to 100 parts by weight (solid) of tung oil-modified phenolic resin, and water was further added and mixed with stirring to prepare emulsion varnish A with a solid concentration of 10% by weight.
I got it. As the first step of impregnation, emulsion varnish A
As shown in Figure 1, spray equipment f! The emulsion varnish A is forcibly impregnated into the paper base material 2 by spraying it onto the transported long paper base material 2 (Kraft paper of II Mils) by L1 and passing it between a pair of rolls 3. Thereafter, it was introduced into a drying oven 4 for preliminary drying.
次に第二工程として、前記工程を経た基材に、桐油変性
７エノール樹脂フエス（固形濃度７０重量％）をロール
コータ−によシ含浸させ、乾燥して総樹脂量５０重量％
のプリプレグを得た。Next, as a second step, the base material that has undergone the above step is impregnated with tung oil-modified 7-enol resin FES (solid concentration 70% by weight) using a roll coater, and dried to give a total resin amount of 50% by weight.
prepreg was obtained.
上記プリプレグを８枚重ね、その片側に接着剤付き銅箔
を重ね、１６０℃−１００ｋｇ／ｃｒ！ｔにて６０分加
熱加圧して厚さ１．６Ｍの銅張積層板を得た。Layer 8 sheets of the above prepreg and layer copper foil with adhesive on one side, 160℃-100kg/cr! A copper clad laminate having a thickness of 1.6M was obtained by heating and pressing at t for 60 minutes.
比較例１
低縮合フェノール樹脂１００重量部（固形）に対して、
水２００ｇ、メタノール２００ｇを添加し混合攪拌して
第一工程のワニスとし、これを実施例１と同様の紙基材
にデイツプ含浸し予備乾燥を行なった。Comparative Example 1 For 100 parts by weight (solid) of low condensation phenolic resin,
200 g of water and 200 g of methanol were added, mixed and stirred to obtain a varnish for the first step, which was dip-impregnated into the same paper base material as in Example 1 and pre-dried.
以下、実施例１と同様の第二工程を経てプリプレグを作
製し、同様に１．６謳厚の銅張積層板を得た。Thereafter, a prepreg was produced through the same second step as in Example 1, and a copper-clad laminate having a thickness of 1.6 was obtained in the same manner.
各積層板の特性を第１表に示す０
第１表
発明の効果
上述したように、本発明によれば、含浸の第一工程で、
油変性フェノール樹脂のエマルジョンワニスを噴霧によ
り紙基材に付着させることにより、余分な水分の付着を
防げるため基材切れを防止出来ると共に、エマルジョン
ワニスの使用並びにロールによる加圧で含浸をするため
基材中へ樹脂が浸透し、得られた積層板の打抜き加工性
、電気特性、耐湿特性の向上が図れる。The properties of each laminate are shown in Table 10 Table 1 Effects of the Invention As described above, according to the present invention, in the first step of impregnation,
By spraying an emulsion varnish made of oil-modified phenolic resin onto the paper base material, it is possible to prevent excess moisture from adhering to the paper base material, thereby preventing the base material from breaking. The resin penetrates into the material, improving the punching workability, electrical properties, and moisture resistance properties of the resulting laminate.
また、第一工程で含浸後の乾燥時に必要な熱量を削減出
来る。Additionally, the amount of heat required for drying after impregnation in the first step can be reduced.
尚、−膜内に１紙基材として８０〜１４０．９／ｍのク
ラフト紙が使用されているが、本発明の方法を用いるこ
とにより、２００〜２５０ｇ／ｍの重いクラフト紙を基
材として使用する方向への展開が可能となり、製造の合
理化及び安価な積層板の供給が期待できる。Furthermore, although kraft paper with a weight of 80 to 140.9 g/m is used as a paper base material in the membrane, by using the method of the present invention, heavy kraft paper with a weight of 200 to 250 g/m can be used as a base material. It is possible to expand the use of this product, and it is expected to streamline manufacturing and supply inexpensive laminates.
第１図は本発明においてプリプレグ製造工程（第一工程
）を示す説明図である。
１はスプレー装置、２は紙基材、３はロール、４は乾燥
炉。FIG. 1 is an explanatory diagram showing the prepreg manufacturing process (first step) in the present invention. 1 is a spray device, 2 is a paper base material, 3 is a roll, and 4 is a drying oven.
Claims (1)
ワニスを噴霧付着させてロールで加圧することにより含
浸させ乾燥する第一工程と、次いで前記工程を経た紙基
材に油変性フェノール樹脂ワニスを浸漬あるいはロール
コーターにより含浸させ、乾燥する第二工程を経てプリ
プレグを得、このプリプレグを積層成形することを特徴
とする積層板の製造法。A first step of spraying a water-dispersed emulsion varnish of oil-modified phenolic resin onto the paper base material and impregnating it by applying pressure with a roll and drying it, followed by dipping the oil-modified phenol resin varnish into the paper base material that has gone through the above steps. Alternatively, a method for manufacturing a laminate, which comprises obtaining a prepreg through a second step of impregnating it with a roll coater and drying it, and then laminating and molding the prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27423687A JPH01115938A (en) | 1987-10-29 | 1987-10-29 | Production of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27423687A JPH01115938A (en) | 1987-10-29 | 1987-10-29 | Production of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115938A true JPH01115938A (en) | 1989-05-09 |
Family
ID=17538898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27423687A Pending JPH01115938A (en) | 1987-10-29 | 1987-10-29 | Production of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006232951A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Method for producing prepreg |
-
1987
- 1987-10-29 JP JP27423687A patent/JPH01115938A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006232951A (en) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | Method for producing prepreg |
| JP4734953B2 (en) * | 2005-02-23 | 2011-07-27 | パナソニック電工株式会社 | Manufacturing method of prepreg |
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