JPH01125502U - - Google Patents
Info
- Publication number
- JPH01125502U JPH01125502U JP2027188U JP2027188U JPH01125502U JP H01125502 U JPH01125502 U JP H01125502U JP 2027188 U JP2027188 U JP 2027188U JP 2027188 U JP2027188 U JP 2027188U JP H01125502 U JPH01125502 U JP H01125502U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat dissipation
- fitted
- leg
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図は本考案によるプリント板の実
施例に係り、第１図は組立図、第２図はスルーホ
ールの他の実施例を示す斜視図、第３図は従来の
プリント板の構成図である。
１……プリント基板、３……抵抗体、４……端
子、６……放熱フイン、６ａ……放熱部、６ｂ…
…脚部、７……スルーホール、７ａ，７ｂ……孔
。
1 and 2 relate to an embodiment of the printed board according to the present invention, FIG. 1 is an assembly diagram, FIG. 2 is a perspective view showing another embodiment of the through hole, and FIG. 3 is a conventional printed board. FIG. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 3... Resistor, 4... Terminal, 6... Heat radiation fin, 6a... Heat radiation part, 6b...
...legs, 7...through holes, 7a, 7b...holes.
Claims (1)
方、プリント基板には抵抗体の端子を嵌め込む孔
と放熱フインの脚部を嵌め込む孔とをつないでス
ルーホールを形成するとともに、スルーホールの
まわりに導電材料からなるスルーホール部を形成
し、 抵抗体における一対の端子を一対のスルーホー
ルに夫々嵌め込むとともに夫々のスルーホールに
放熱フインの脚部を嵌め込み、端子と放熱フイン
の脚部とスルーホール部とを一体にはんだ付けし
たことを特徴とするプリント板。[Claim for Utility Model Registration] A heat dissipation fin consisting of a heat dissipation part and a leg is provided, and a through hole is provided in the printed circuit board to connect the hole into which the terminal of the resistor is fitted and the hole into which the leg of the heat dissipation fin is fitted. At the same time, a through-hole part made of a conductive material is formed around the through-hole, a pair of terminals of the resistor are respectively fitted into the pair of through-holes, and a leg part of the heat dissipation fin is fitted into each through-hole. A printed board characterized in that a terminal, a leg part of a heat dissipation fin, and a through-hole part are integrally soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027188U JPH01125502U (en) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027188U JPH01125502U (en) | 1988-02-18 | 1988-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01125502U true JPH01125502U (en) | 1989-08-28 |
Family
ID=31236497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2027188U Pending JPH01125502U (en) | 1988-02-18 | 1988-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01125502U (en) |
-
1988
- 1988-02-18 JP JP2027188U patent/JPH01125502U/ja active Pending