JPH01124580U - - Google Patents
Info
- Publication number
- JPH01124580U JPH01124580U JP1952588U JP1952588U JPH01124580U JP H01124580 U JPH01124580 U JP H01124580U JP 1952588 U JP1952588 U JP 1952588U JP 1952588 U JP1952588 U JP 1952588U JP H01124580 U JPH01124580 U JP H01124580U
- Authority
- JP
- Japan
- Prior art keywords
- pallet
- socket
- laser diode
- cylindrical shafts
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本願考案のレーザダイオードの測定用
治具の平面図、第２図は第１図の―線拡大断
面図、第３図はソケツトおよびこれに挿着される
レーザダイオードの斜視図、第４図は従来例を示
す断面図である。
１……治具、２……ソケツト、２ａ……（ソケ
ツトの）フランジ部、２ｃ……（ソケツトの）筒
軸部、３……パレツト、４……放熱板。
FIG. 1 is a plan view of a laser diode measurement jig of the present invention, FIG. 2 is an enlarged sectional view taken along the line -- in FIG. 1, and FIG. 3 is a perspective view of a socket and a laser diode inserted into it. FIG. 4 is a sectional view showing a conventional example. 1... Jig, 2... Socket, 2a... Flange part (of the socket), 2c... Cylindrical shaft part (of the socket), 3... Pallet, 4... Heat sink.
Claims (1)
取付けられ、それぞれがパレツト上面に接触する
フランジ部、およびこのフランジ部上に突出して
延び、頂面に端子ピン受容孔が形成された筒軸部
を有するレーザダイオード挿着用のソケツトと、
各ソケツトの筒軸部を収容する多数個の透孔を有
し、各透孔が上記各筒軸部にはめ込まれるように
してパレツトに対して固定される放熱板とを備え
、上記各筒軸部の頂面を、上記各透孔内に位置さ
せたことを特徴とする、レーザダイオードの測定
用治具。 A pallet, a flange portion which is arranged in a large number and mounted on the pallet, each contacting the upper surface of the pallet, and a cylindrical shaft portion which protrudes above the flange portion and has a terminal pin receiving hole formed on the top surface. a socket for inserting a laser diode,
It has a large number of through holes for accommodating the cylindrical shafts of each socket, and a heat dissipation plate fixed to the pallet in such a way that each through hole is fitted into each of the cylindrical shafts, and each of the cylindrical shafts A jig for measuring a laser diode, characterized in that the top surface of the portion is located within each of the through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019525U JPH079109Y2 (en) | 1988-02-17 | 1988-02-17 | Laser diode measuring jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019525U JPH079109Y2 (en) | 1988-02-17 | 1988-02-17 | Laser diode measuring jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01124580U true JPH01124580U (en) | 1989-08-24 |
| JPH079109Y2 JPH079109Y2 (en) | 1995-03-06 |
Family
ID=31235112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019525U Expired - Lifetime JPH079109Y2 (en) | 1988-02-17 | 1988-02-17 | Laser diode measuring jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079109Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008153178A1 (en) * | 2007-06-14 | 2008-12-18 | Chichibu Fuji Co., Ltd. | Aging board for semiconductor laser |
| JP2010122181A (en) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | Pressing plate and inspection device using the same |
| JP2010122182A (en) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | Inspection jig and inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158372U (en) * | 1982-04-19 | 1983-10-22 | 日本電気株式会社 | Semiconductor device measurement jig |
-
1988
- 1988-02-17 JP JP1988019525U patent/JPH079109Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158372U (en) * | 1982-04-19 | 1983-10-22 | 日本電気株式会社 | Semiconductor device measurement jig |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008153178A1 (en) * | 2007-06-14 | 2008-12-18 | Chichibu Fuji Co., Ltd. | Aging board for semiconductor laser |
| JP5292290B2 (en) * | 2007-06-14 | 2013-09-18 | 株式会社秩父富士 | Aging board for semiconductor laser |
| JP2010122181A (en) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | Pressing plate and inspection device using the same |
| JP2010122182A (en) * | 2008-11-21 | 2010-06-03 | Daitron Technology Co Ltd | Inspection jig and inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079109Y2 (en) | 1995-03-06 |