JPH01123361U - - Google Patents
Info
- Publication number
- JPH01123361U JPH01123361U JP2049288U JP2049288U JPH01123361U JP H01123361 U JPH01123361 U JP H01123361U JP 2049288 U JP2049288 U JP 2049288U JP 2049288 U JP2049288 U JP 2049288U JP H01123361 U JPH01123361 U JP H01123361U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tiers
- bumps
- wiring
- stacking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2049288U JPH01123361U (US06486227-20021126-C00005.png) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2049288U JPH01123361U (US06486227-20021126-C00005.png) | 1988-02-17 | 1988-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01123361U true JPH01123361U (US06486227-20021126-C00005.png) | 1989-08-22 |
Family
ID=31236906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2049288U Pending JPH01123361U (US06486227-20021126-C00005.png) | 1988-02-17 | 1988-02-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01123361U (US06486227-20021126-C00005.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006028155A1 (ja) * | 2004-09-08 | 2006-03-16 | Nec Corporation | モジュール型電子部品及び電子機器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6133258A (ja) * | 1984-07-25 | 1986-02-17 | Matsushita Electric Ind Co Ltd | 噴霧装置 |
-
1988
- 1988-02-17 JP JP2049288U patent/JPH01123361U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6133258A (ja) * | 1984-07-25 | 1986-02-17 | Matsushita Electric Ind Co Ltd | 噴霧装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006028155A1 (ja) * | 2004-09-08 | 2006-03-16 | Nec Corporation | モジュール型電子部品及び電子機器 |