JPH01122464U - - Google Patents

Info

Publication number
JPH01122464U
JPH01122464U JP1464488U JP1464488U JPH01122464U JP H01122464 U JPH01122464 U JP H01122464U JP 1464488 U JP1464488 U JP 1464488U JP 1464488 U JP1464488 U JP 1464488U JP H01122464 U JPH01122464 U JP H01122464U
Authority
JP
Japan
Prior art keywords
electronic component
housing according
metal tape
component storage
component housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1464488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1464488U priority Critical patent/JPH01122464U/ja
Publication of JPH01122464U publication Critical patent/JPH01122464U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の電子部品収納体の１例を示す
平面図、第２図はこれに電子部品を収納した場合
の断面図であつて、図中の記号１は収納体、２は
収納用凹部、３は通気孔、４は送り穴、５は電子
部品、６はカバーフイルムを示す。 Fig. 1 is a plan view showing one example of the electronic component storage body of the present invention, and Fig. 2 is a cross-sectional view when electronic components are stored therein. 3 is a ventilation hole, 4 is a feed hole, 5 is an electronic component, and 6 is a cover film.

Claims (1)

【実用新案登録請求の範囲】 １ 金属製テープに複数の電子部品収納用凹部を
等間隔に設けた電子部品収納体。 ２ 片面又は両面が有機材料膜で被覆されている
第１請求項に記載の電子部品収納体。 ３ 金属製テープが耐熱性フイルムの少なくとも
片面に金属蒸着層を形成して得られたものである
第１請求項に記載の電子部品収納体。[Claims for Utility Model Registration] 1. An electronic component storage body in which a plurality of electronic component storage recesses are provided at equal intervals in a metal tape. 2. The electronic component housing according to claim 1, wherein one or both sides are coated with an organic material film. 3. The electronic component housing according to claim 1, wherein the metal tape is obtained by forming a metal vapor deposition layer on at least one side of a heat-resistant film.
JP1464488U 1988-02-08 1988-02-08 Pending JPH01122464U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1464488U JPH01122464U (en) 1988-02-08 1988-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1464488U JPH01122464U (en) 1988-02-08 1988-02-08

Publications (1)

Publication Number Publication Date
JPH01122464U true JPH01122464U (en) 1989-08-21

Family

ID=31226030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1464488U Pending JPH01122464U (en) 1988-02-08 1988-02-08

Country Status (1)

Country Link
JP (1) JPH01122464U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56101800A (en) * 1980-01-17 1981-08-14 Matsushita Electric Ind Co Ltd Miniature electronic part packaging material
JPS6122783B2 (en) * 1977-01-18 1986-06-03 Nippon Denki Kk
JPS61178878A (en) * 1985-01-25 1986-08-11 川島　弘至 Carrier tape

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122783B2 (en) * 1977-01-18 1986-06-03 Nippon Denki Kk
JPS56101800A (en) * 1980-01-17 1981-08-14 Matsushita Electric Ind Co Ltd Miniature electronic part packaging material
JPS61178878A (en) * 1985-01-25 1986-08-11 川島　弘至 Carrier tape

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