JPH0234469U - - Google Patents
Info
- Publication number
- JPH0234469U JPH0234469U JP13284788U JP13284788U JPH0234469U JP H0234469 U JPH0234469 U JP H0234469U JP 13284788 U JP13284788 U JP 13284788U JP 13284788 U JP13284788 U JP 13284788U JP H0234469 U JPH0234469 U JP H0234469U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- tape
- storage body
- cover film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 229920006015 heat resistant resin Polymers 0.000 claims description 2
- 239000013039 cover film Substances 0.000 claims 2
- 229920001225 polyester resin Polymers 0.000 claims 2
- 239000004645 polyester resin Substances 0.000 claims 2
- 239000010408 film Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の電子部品収納体の１例を示す
平面図、第２図はこれに電子部品を収納した場合
の縦断面図であつて、図中の記号１は収納テープ
、２は収納凹部、３は通気孔、４は送り穴、５は
電子部品、６は耐熱性樹脂フイルム、７は接着剤
層を示す。
Fig. 1 is a plan view showing an example of the electronic component storage body of the present invention, and Fig. 2 is a vertical cross-sectional view when electronic components are stored therein. 3 is a storage recess, 3 is a ventilation hole, 4 is a feed hole, 5 is an electronic component, 6 is a heat-resistant resin film, and 7 is an adhesive layer.
Claims (1)
電子部品収納用凹部を等間隔に設けた電子部品収
納テープ及び耐熱性樹脂フイルムの表面に、ガラ
ス転移温度が９０℃以上である接着剤層を設けた
カバーフイルムから成る電子部品収納体。 ２ 耐熱性ポリエステル系樹脂製テープが帯電防
止処理した樹脂製テープである第１請求項に記載
の電子部品収納体。 ３ カバーフイルムが帯電防止処理を施してある
ことを特徴とする、第１請求項に記載の電子部品
収納体。[Scope of Claim for Utility Model Registration] 1. A tape made of heat-resistant polyester resin with a plurality of recesses for storing electronic parts formed at equal intervals, and a heat-resistant resin film whose surface has a glass transition temperature of 90°C or higher. An electronic component storage body consisting of a cover film provided with an adhesive layer. 2. The electronic component housing according to claim 1, wherein the heat-resistant polyester resin tape is an antistatically treated resin tape. 3. The electronic component storage body according to claim 1, wherein the cover film is subjected to antistatic treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13284788U JPH074221Y2 (en) | 1988-04-11 | 1988-10-13 | Electronic component storage |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4780988 | 1988-04-11 | ||
| JP63-47809 | 1988-04-11 | ||
| JP13284788U JPH074221Y2 (en) | 1988-04-11 | 1988-10-13 | Electronic component storage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0234469U true JPH0234469U (en) | 1990-03-05 |
| JPH074221Y2 JPH074221Y2 (en) | 1995-02-01 |
Family
ID=31717993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13284788U Expired - Lifetime JPH074221Y2 (en) | 1988-04-11 | 1988-10-13 | Electronic component storage |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH074221Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010274931A (en) * | 2009-05-26 | 2010-12-09 | Sekisui Chem Co Ltd | Carrier tape and cover tape |
| WO2022210158A1 (en) * | 2021-03-31 | 2022-10-06 | 住友ベークライト株式会社 | Cover tape for packaging electronic component and electronic component package |
| JP2022158849A (en) * | 2021-03-31 | 2022-10-17 | 住友ベークライト株式会社 | Cover tape for electronic component packaging, and electronic component package |
-
1988
- 1988-10-13 JP JP13284788U patent/JPH074221Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010274931A (en) * | 2009-05-26 | 2010-12-09 | Sekisui Chem Co Ltd | Carrier tape and cover tape |
| WO2022210158A1 (en) * | 2021-03-31 | 2022-10-06 | 住友ベークライト株式会社 | Cover tape for packaging electronic component and electronic component package |
| JP2022158849A (en) * | 2021-03-31 | 2022-10-17 | 住友ベークライト株式会社 | Cover tape for electronic component packaging, and electronic component package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH074221Y2 (en) | 1995-02-01 |
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