JPH01121927U - - Google Patents
Info
- Publication number
- JPH01121927U JPH01121927U JP1711888U JP1711888U JPH01121927U JP H01121927 U JPH01121927 U JP H01121927U JP 1711888 U JP1711888 U JP 1711888U JP 1711888 U JP1711888 U JP 1711888U JP H01121927 U JPH01121927 U JP H01121927U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- semiconductor device
- temperature sensor
- heater block
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017118U JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017118U JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121927U true JPH01121927U (en:Method) | 1989-08-18 |
| JPH0727624Y2 JPH0727624Y2 (ja) | 1995-06-21 |
Family
ID=31230617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017118U Expired - Lifetime JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727624Y2 (en:Method) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS5987825A (ja) * | 1982-11-11 | 1984-05-21 | Toshiba Corp | ダイ・ボンデイング方法 |
| JPS6116536A (ja) * | 1985-06-21 | 1986-01-24 | Hitachi Ltd | ペレツトボンデイング装置 |
-
1988
- 1988-02-12 JP JP1988017118U patent/JPH0727624Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS5987825A (ja) * | 1982-11-11 | 1984-05-21 | Toshiba Corp | ダイ・ボンデイング方法 |
| JPS6116536A (ja) * | 1985-06-21 | 1986-01-24 | Hitachi Ltd | ペレツトボンデイング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727624Y2 (ja) | 1995-06-21 |