JPH01121926U - - Google Patents

Info

Publication number
JPH01121926U
JPH01121926U JP1793688U JP1793688U JPH01121926U JP H01121926 U JPH01121926 U JP H01121926U JP 1793688 U JP1793688 U JP 1793688U JP 1793688 U JP1793688 U JP 1793688U JP H01121926 U JPH01121926 U JP H01121926U
Authority
JP
Japan
Prior art keywords
lead frame
slider
bonding device
point
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1793688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1793688U priority Critical patent/JPH01121926U/ja
Publication of JPH01121926U publication Critical patent/JPH01121926U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Die Bonding (AREA)
JP1793688U 1988-02-13 1988-02-13 Pending JPH01121926U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1793688U JPH01121926U (enExample) 1988-02-13 1988-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1793688U JPH01121926U (enExample) 1988-02-13 1988-02-13

Publications (1)

Publication Number Publication Date
JPH01121926U true JPH01121926U (enExample) 1989-08-18

Family

ID=31232141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1793688U Pending JPH01121926U (enExample) 1988-02-13 1988-02-13

Country Status (1)

Country Link
JP (1) JPH01121926U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476926A (ja) * 1990-07-19 1992-03-11 Toshiba Corp 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476926A (ja) * 1990-07-19 1992-03-11 Toshiba Corp 半導体製造装置

Similar Documents

Publication Publication Date Title
JPH01121926U (enExample)
JPS6063523U (ja) 釦加工装置の部品供給装置
JPH01129827U (enExample)
JPS6061177U (ja) 打込機の釘送り装置
JPS622543U (enExample)
CN212625503U (zh) 用于固晶机去除散点的压板组件及其固晶机
JPS58102233U (ja) ブランク材の送給装置
JPH0451475Y2 (enExample)
JPS6116689Y2 (enExample)
JPS56112736A (en) Semiconductor assembling apparatus
JPS6049633U (ja) マウント装置
JPS6312832U (enExample)
JPS62178089U (enExample)
JPH04148750A (ja) 半導体部品製造用短冊状リードフレームの間欠移送装置
JPS58153024U (ja) 押出機クロスヘツドのダイス位置調節装置
JPS6130299U (ja) 電子部品の供給機構
JPS62157142U (enExample)
JPH0226236U (enExample)
JPS57113240A (en) Wire bonding apparatus
JPH0290204U (enExample)
JPS62165028U (enExample)
JPS60173421U (ja) シ−トアジヤスタ
JPH0292929U (enExample)
JPS625144U (enExample)
JPS645448U (enExample)