JPH01120342U - - Google Patents
Info
- Publication number
- JPH01120342U JPH01120342U JP1573188U JP1573188U JPH01120342U JP H01120342 U JPH01120342 U JP H01120342U JP 1573188 U JP1573188 U JP 1573188U JP 1573188 U JP1573188 U JP 1573188U JP H01120342 U JPH01120342 U JP H01120342U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- resin
- thin metal
- metal wires
- substantially flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1573188U JPH01120342U (US20030199744A1-20031023-C00003.png) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1573188U JPH01120342U (US20030199744A1-20031023-C00003.png) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120342U true JPH01120342U (US20030199744A1-20031023-C00003.png) | 1989-08-15 |
Family
ID=31228033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1573188U Pending JPH01120342U (US20030199744A1-20031023-C00003.png) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120342U (US20030199744A1-20031023-C00003.png) |
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1988
- 1988-02-10 JP JP1573188U patent/JPH01120342U/ja active Pending
