JPH01120034A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPH01120034A
JPH01120034A JP27890787A JP27890787A JPH01120034A JP H01120034 A JPH01120034 A JP H01120034A JP 27890787 A JP27890787 A JP 27890787A JP 27890787 A JP27890787 A JP 27890787A JP H01120034 A JPH01120034 A JP H01120034A
Authority
JP
Japan
Prior art keywords
wiring
transistor
cell
region
cell region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27890787A
Other languages
Japanese (ja)
Inventor
Koichi Fujii
浩一 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP27890787A priority Critical patent/JPH01120034A/en
Publication of JPH01120034A publication Critical patent/JPH01120034A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits
    • H01L27/11803Masterslice integrated circuits using field effect technology
    • H01L27/11807CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To improve current driving capacity of a logic circuit and to make it possible to use a conventional wiring software by providing a cell region of which unit cell is formed by use of a complementary insulating gate effect transistor and by providing a wiring channel region having an additional field effective transistor in a part whereof. CONSTITUTION:A cell region 1 of which unit cell 3 is formed by use of a complementary insulating gate field effect transistor is provided to compose a gate array. Additional field effective transistors 4, 5 are provided in a part of a wiring channel region 2, alternately with the cell region 1 to make connection between unit cells 3. For instance, in the wiring channel region 2, an N channel MOS transistor 4 and a P channel MOS transistors 5a, 5b are additionally formed before a primary Al wiring layer 6 which is wired crosswise and a secondary Al wiring layer 7 which is formed lengthwise through an interlayer insulation film are provided. The transistor 5b is connected in paralleled to a transistor of the added side of the unit cell when the secondary Al wiring layer 7 is formed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体集積回路装置に関し、特にゲートアレイ
を形成する相補型MIS構造を有する半導体集積回路装
置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a semiconductor integrated circuit device having a complementary MIS structure forming a gate array.

〔従来の技術〕[Conventional technology]

従来、この種のゲートアレイ半導体装置は配線のみを行
う配線チャンネル領域とMoSトランジスタ等の素子を
形成するセル領域とを交互に配置したゲートアレイ装置
か、またはセル領域を隙間なく配置し配線チャンネル領
域として最初から特に領域を設けていないゲートアレイ
装置が一般的である。
Conventionally, this type of gate array semiconductor device has been either a gate array device in which wiring channel regions for only wiring and cell regions for forming elements such as MoS transistors are arranged alternately, or a gate array device in which cell regions are arranged without gaps and wiring channel regions are arranged without gaps. Generally, gate array devices do not have any specific area from the beginning.

第3図は従来の一例を説明するための前者に相当するゲ
ートアレイ装置(チップ)の平面図である。
FIG. 3 is a plan view of a gate array device (chip) corresponding to the former for explaining a conventional example.

第3図に示すように、チップ21は゛MOSトランジス
タ等の半導体素子を形成するための例えばN型拡散層か
らなるセル領域22および同様のP型拡散層からなるセ
ル領域23、配線接続のための配線チャンネル領域24
、これらセル領域22.23とチャンネル領域′24の
周囲に形成された周辺回路を含むバッファ部25を有し
ている。尚、ここでは外部接続用のパッドについては省
略している。かかるチップ21において、セル領域22
.23を用いて構成する単位セル間の接続および単位セ
ルのバッファ部25との接続は配線チャンネル領域24
を用いて行われている。
As shown in FIG. 3, the chip 21 includes a cell region 22 made of an N-type diffusion layer for forming semiconductor elements such as MOS transistors, a cell region 23 made of a similar P-type diffusion layer, and a cell region 23 made of a P-type diffusion layer for forming semiconductor elements such as MOS transistors. Wiring channel area 24
, has a buffer section 25 including peripheral circuits formed around these cell regions 22, 23 and channel region '24. Note that pads for external connection are omitted here. In such a chip 21, a cell region 22
.. 23 and the connection between the unit cells and the buffer section 25 are made using the wiring channel region 24.
It is done using.

第4図は第3図におけるセル領域を形成するかかる単位
セルの平面図である。
FIG. 4 is a plan view of such a unit cell forming the cell area in FIG. 3.

第4図に示すように、単位セル26はN型拡散層22と
ゲート27とにより二個のNチャンネルMOSトランジ
スタを形成し、P型拡散層23とゲート27とにより二
個のPチャンネルMOSトランジスタを形成したもので
ある。
As shown in FIG. 4, the unit cell 26 includes an N-type diffusion layer 22 and a gate 27 to form two N-channel MOS transistors, and a P-type diffusion layer 23 and a gate 27 to form two P-channel MOS transistors. was formed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の前者のゲートアレイ装置は、トランジス
タのゲートの実効幅が限られているため負荷が重いとき
には電流駆動能力が低下するという欠点がある。また、
後者のシー・オブ・ゲートと呼ばれるゲートアレイ装置
(図示省略)は、必要な論理回路を自由に形成すること
ができるものの配線ソフトが難かしくなるという欠点が
ある。
The former conventional gate array device described above has a drawback in that the effective width of the gate of the transistor is limited, so that the current driving ability decreases when the load is heavy. Also,
The latter gate array device (not shown) called Sea of Gates allows the necessary logic circuits to be formed freely, but has the disadvantage that wiring software is difficult.

本発明の目的は、かかる論理回路の電流駆動能力を向上
させ、且つ従来の配線ソフトをそのまま利用することの
できる半導体集積回路装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit device that improves the current drive capability of such logic circuits and allows conventional wiring software to be used as is.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の半導体集積回路装置は、相補型絶縁ゲート電界
効果トランジスタを用いて単位セルを形成しゲートアレ
イを構成するためのセル領域と、前記単位セル間等の接
続を行うために前記セル領域と交互に配置され且つ一部
に付加的な電界効果トランジスタを形成した配線チャン
ネル領域とを有して構成される。
The semiconductor integrated circuit device of the present invention includes a cell region for forming a gate array by forming unit cells using complementary insulated gate field effect transistors, and a cell region for making connections between the unit cells. Wiring channel regions are arranged alternately and have additional field effect transistors formed in some of them.

〔実施例〕〔Example〕

次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を説明するためのゲートアレ
イ装置の平面図である。
FIG. 1 is a plan view of a gate array device for explaining one embodiment of the present invention.

第1図に示すように、かかるゲートアレイ装置は単位セ
ル3が並ぶセル領域1と配線チャンネル領域2とが交互
に配置されており、この配線チャンネル領域2には従来
と同様に横方向に配線される第一のAe配線層6と層間
絶縁膜を介して縦方向に形成される第二のAe配線層7
とを設ける前にNチャンネルMOSトランジスタ4およ
びPチャンネルMOSトランジスタ5a、5bが付加的
に形成される。この付加的に設けられたPチャンネルM
OSトランジスタ5bは、第二のAf配線層7を形成す
る際に単位セル3における付加された側のトランジスタ
に並列接続される。すなわち、このことは付加された側
のトランジスタの電流駆動能力を向上させたことになる
。しがも、前述のように従来の配線を変更することなく
結線される。一方、電流駆動能力を向上させる必要のな
い単位セル3側のトランジスタのところに設けられたト
ランジスタ、例えばNチャンネルMOSトランジスタ4
およびPチャンネルMOS)ランジスタ5aについては
、第一のAe配線層6の下方に層間絶縁膜をはさんで埋
れるようにする。
As shown in FIG. 1, in this gate array device, cell regions 1 in which unit cells 3 are lined up and wiring channel regions 2 are arranged alternately. A first Ae wiring layer 6 and a second Ae wiring layer 7 formed vertically via an interlayer insulating film.
N-channel MOS transistor 4 and P-channel MOS transistors 5a and 5b are additionally formed before providing. This additionally provided P channel M
The OS transistor 5b is connected in parallel to the added transistor in the unit cell 3 when forming the second Af wiring layer 7. In other words, this improves the current driving ability of the added transistor. However, as described above, the connections can be made without changing the conventional wiring. On the other hand, a transistor provided at a transistor on the unit cell 3 side that does not need to improve current drive capability, for example, an N-channel MOS transistor 4
The transistor 5a (P-channel MOS) is buried under the first Ae wiring layer 6 by sandwiching an interlayer insulating film therebetween.

第2図は第1図におけるセル領域と配線チャンネル領域
との拡大平面図である。
FIG. 2 is an enlarged plan view of the cell region and wiring channel region in FIG. 1.

第2図に示すように、セル領域1は基板上にN型拡散層
8とP型拡散N9とを有し、これら拡散層の上に相補型
絶縁ゲートFET (MI 5−FET)を形成するた
めのゲート10を形成する。一方、配線チャンネル領域
2は第一のAe配線層6を前記セル領域1のそれと同時
に形成し、しかる後第二のA!!配線層7を眉間膜を介
して形成する。その際、第一のAe配線層6と接続の必
要のある個所には、コンタクト11が設けられる。本実
施例においては、この第二のAt?配線層7の形成と同
時に第二のAJ7配線層13を形成するので、従来の配
線6.7を変更する必要はなく配線ソフトをそのまま使
用することができる。
As shown in FIG. 2, the cell region 1 has an N-type diffusion layer 8 and a P-type diffusion N9 on the substrate, and a complementary insulated gate FET (MI 5-FET) is formed on these diffusion layers. A gate 10 is formed for this purpose. On the other hand, in the wiring channel region 2, the first Ae wiring layer 6 is formed at the same time as that in the cell region 1, and then the second Ae wiring layer 6 is formed. ! The wiring layer 7 is formed via the glabellar membrane. At this time, contacts 11 are provided at locations that need to be connected to the first Ae wiring layer 6. In this embodiment, this second At? Since the second AJ7 wiring layer 13 is formed simultaneously with the formation of the wiring layer 7, there is no need to change the conventional wiring 6.7, and the wiring software can be used as is.

尚、第2図は第1図におけるPチャンネルMOSトラン
ジスタ5bとその周辺を拡大して示しているが、セル領
域1のPチャンネルMOSトランジスタと配線チャンネ
ル領域2のPチャンネルMOSトランジスタ5bとを第
二のAJ7配線層13によりゲート10相互を、またド
レイン、ソースとなる領域、すなわちP型拡散層9,1
2相互を接続することにより、単位セルにおける論理回
路の電流駆動能力が向上する。
Note that although FIG. 2 shows an enlarged view of the P-channel MOS transistor 5b and its surroundings in FIG. The AJ7 wiring layer 13 connects the gate 10 to each other, and also connects the drain and source regions, that is, the P-type diffusion layers 9 and 1.
By interconnecting the two, the current driving ability of the logic circuit in the unit cell is improved.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の半導体集積回路装置は配
線チャンネル領域とセル領域とが交互に配置されている
ゲートアレイS積回路装置の配線チャンネル領域の一部
に付加的なMOS)ランジスタを設けることにより、所
望の論理回路の電流駆動能力を向上させることができる
という効果があり、また新たに他配線への制約をつけ加
えることなくそのトランジスタの結線を行うことができ
るので配線ソフトはほぼ従来のものを利用できるという
効果がある。
As explained above, in the semiconductor integrated circuit device of the present invention, an additional MOS transistor is provided in a part of the wiring channel region of the gate array S integrated circuit device in which the wiring channel region and the cell region are arranged alternately. This has the effect of improving the current drive capability of the desired logic circuit, and also enables wiring of the transistor without adding new restrictions to other wiring, so the wiring software can be used almost as usual. It has the effect of being able to use things.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を説明するためのゲートアレ
イ装置の平面図、第2図は第1図におけるセル領域と配
線チャンネル領域との拡大平面図、第3図は従来の一例
を説明するためのゲートアレイ装置の平面図、第4図は
第3図におけるセル領域を形成する単位セルの平面図で
ある。 1・・・セル領域、2・・・配線チャンネル領域、3・
・・単位セル、4・・・NチャンネルMOSトランジス
タ、5a、5b・・・PチャンネルMOS)ランジスタ
、6・・・第一のアルミ配線層、7.13・・・第二の
アルミ配線層、8・・・N型拡散層、9・・・P型拡散
層、10・・・ゲート、11・・・コンタクト、12・
・・P型拡散層。
FIG. 1 is a plan view of a gate array device for explaining one embodiment of the present invention, FIG. 2 is an enlarged plan view of a cell region and wiring channel region in FIG. 1, and FIG. 3 is a conventional example. A plan view of the gate array device for explanation, FIG. 4 is a plan view of a unit cell forming the cell region in FIG. 3. 1... Cell area, 2... Wiring channel area, 3...
... Unit cell, 4... N-channel MOS transistor, 5a, 5b... P-channel MOS) transistor, 6... First aluminum wiring layer, 7.13... Second aluminum wiring layer, 8... N type diffusion layer, 9... P type diffusion layer, 10... Gate, 11... Contact, 12...
...P-type diffusion layer.

Claims (1)

【特許請求の範囲】[Claims]  相補型絶縁ゲート電界効果トランジスタを用いて単位
セルを形成しゲートアレイを構成するためのセル領域と
、前記単位セル間等の接続を行うために前記セル領域と
交互に配置され且つ一部に付加的な電界効果トランジス
タを形成した配線チャンネル領域とを有することを特徴
とする半導体集積回路装置。
A cell region for forming a gate array by forming unit cells using complementary insulated gate field effect transistors, and a cell region arranged alternately with the cell region and added to a part for making connections between the unit cells, etc. 1. A semiconductor integrated circuit device comprising a wiring channel region in which a field effect transistor is formed.
JP27890787A 1987-11-02 1987-11-02 Semiconductor integrated circuit device Pending JPH01120034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27890787A JPH01120034A (en) 1987-11-02 1987-11-02 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27890787A JPH01120034A (en) 1987-11-02 1987-11-02 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH01120034A true JPH01120034A (en) 1989-05-12

Family

ID=17603755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27890787A Pending JPH01120034A (en) 1987-11-02 1987-11-02 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH01120034A (en)

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