JPH01119312U - - Google Patents
Info
- Publication number
- JPH01119312U JPH01119312U JP1548988U JP1548988U JPH01119312U JP H01119312 U JPH01119312 U JP H01119312U JP 1548988 U JP1548988 U JP 1548988U JP 1548988 U JP1548988 U JP 1548988U JP H01119312 U JPH01119312 U JP H01119312U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- temperature
- circuit
- heat medium
- evaporation section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005057 refrigeration Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 3
- 238000001704 evaporation Methods 0.000 claims 3
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1548988U JPH01119312U (fr) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1548988U JPH01119312U (fr) | 1988-02-08 | 1988-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01119312U true JPH01119312U (fr) | 1989-08-11 |
Family
ID=31227588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1548988U Pending JPH01119312U (fr) | 1988-02-08 | 1988-02-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01119312U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017087440A (ja) * | 2015-11-02 | 2017-05-25 | 株式会社松井製作所 | 温度制御装置 |
-
1988
- 1988-02-08 JP JP1548988U patent/JPH01119312U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017087440A (ja) * | 2015-11-02 | 2017-05-25 | 株式会社松井製作所 | 温度制御装置 |
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