JPH01119312U - - Google Patents

Info

Publication number
JPH01119312U
JPH01119312U JP1548988U JP1548988U JPH01119312U JP H01119312 U JPH01119312 U JP H01119312U JP 1548988 U JP1548988 U JP 1548988U JP 1548988 U JP1548988 U JP 1548988U JP H01119312 U JPH01119312 U JP H01119312U
Authority
JP
Japan
Prior art keywords
mold
temperature
circuit
heat medium
evaporation section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1548988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1548988U priority Critical patent/JPH01119312U/ja
Publication of JPH01119312U publication Critical patent/JPH01119312U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
JP1548988U 1988-02-08 1988-02-08 Pending JPH01119312U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1548988U JPH01119312U (fr) 1988-02-08 1988-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1548988U JPH01119312U (fr) 1988-02-08 1988-02-08

Publications (1)

Publication Number Publication Date
JPH01119312U true JPH01119312U (fr) 1989-08-11

Family

ID=31227588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1548988U Pending JPH01119312U (fr) 1988-02-08 1988-02-08

Country Status (1)

Country Link
JP (1) JPH01119312U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017087440A (ja) * 2015-11-02 2017-05-25 株式会社松井製作所 温度制御装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017087440A (ja) * 2015-11-02 2017-05-25 株式会社松井製作所 温度制御装置

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