JPH01118488U - - Google Patents

Info

Publication number
JPH01118488U
JPH01118488U JP1292288U JP1292288U JPH01118488U JP H01118488 U JPH01118488 U JP H01118488U JP 1292288 U JP1292288 U JP 1292288U JP 1292288 U JP1292288 U JP 1292288U JP H01118488 U JPH01118488 U JP H01118488U
Authority
JP
Japan
Prior art keywords
circuit board
frame
device casing
laminated structure
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1292288U
Other languages
English (en)
Japanese (ja)
Other versions
JPH075659Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988012922U priority Critical patent/JPH075659Y2/ja
Publication of JPH01118488U publication Critical patent/JPH01118488U/ja
Application granted granted Critical
Publication of JPH075659Y2 publication Critical patent/JPH075659Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1988012922U 1988-02-02 1988-02-02 回路基板の積層構造 Expired - Lifetime JPH075659Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988012922U JPH075659Y2 (ja) 1988-02-02 1988-02-02 回路基板の積層構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988012922U JPH075659Y2 (ja) 1988-02-02 1988-02-02 回路基板の積層構造

Publications (2)

Publication Number Publication Date
JPH01118488U true JPH01118488U (US20030220297A1-20031127-C00074.png) 1989-08-10
JPH075659Y2 JPH075659Y2 (ja) 1995-02-08

Family

ID=31222791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988012922U Expired - Lifetime JPH075659Y2 (ja) 1988-02-02 1988-02-02 回路基板の積層構造

Country Status (1)

Country Link
JP (1) JPH075659Y2 (US20030220297A1-20031127-C00074.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010081125A (ja) * 2008-09-25 2010-04-08 Toshiba Corp 携帯電話端末
JP2014192194A (ja) * 2013-03-26 2014-10-06 Sato Holdings Corp 基板ユニット機構
JP2018078239A (ja) * 2016-11-11 2018-05-17 北川工業株式会社 スペーサー
JP2020205347A (ja) * 2019-06-17 2020-12-24 パナソニックＩｐマネジメント株式会社 筐体、それを備える電気機器、及び電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103170U (ja) * 1982-01-06 1983-07-13 株式会社日立製作所 機器の筐体
JPS60186092A (ja) * 1984-03-06 1985-09-21 松下電器産業株式会社 制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103170U (ja) * 1982-01-06 1983-07-13 株式会社日立製作所 機器の筐体
JPS60186092A (ja) * 1984-03-06 1985-09-21 松下電器産業株式会社 制御装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010081125A (ja) * 2008-09-25 2010-04-08 Toshiba Corp 携帯電話端末
JP2014192194A (ja) * 2013-03-26 2014-10-06 Sato Holdings Corp 基板ユニット機構
JP2018078239A (ja) * 2016-11-11 2018-05-17 北川工業株式会社 スペーサー
JP2020205347A (ja) * 2019-06-17 2020-12-24 パナソニックＩｐマネジメント株式会社 筐体、それを備える電気機器、及び電力変換装置

Also Published As

Publication number Publication date
JPH075659Y2 (ja) 1995-02-08

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