JPH01116607A - Manufacture of optical semiconductor coupler - Google Patents

Manufacture of optical semiconductor coupler

Info

Publication number
JPH01116607A
JPH01116607A JP27329687A JP27329687A JPH01116607A JP H01116607 A JPH01116607 A JP H01116607A JP 27329687 A JP27329687 A JP 27329687A JP 27329687 A JP27329687 A JP 27329687A JP H01116607 A JPH01116607 A JP H01116607A
Authority
JP
Japan
Prior art keywords
optical
fiber
optical semiconductor
semiconductor element
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27329687A
Other languages
Japanese (ja)
Inventor
Susumu Nakatani
晋 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP27329687A priority Critical patent/JPH01116607A/en
Publication of JPH01116607A publication Critical patent/JPH01116607A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

PURPOSE:To eliminate the fluctuation at the time of soldering of an optical fiber by always bringing the optical fiber in the vicinity of an optical semiconductor element, into contact with a projecting part of a supporting base, and also, executing the soldering far in the rear separated from a supporting point which said fiber has come into contact with and fixing the optical fiber. CONSTITUTION:A part of a fiber holder 12 for always holding an optical fiber 11 is fixed in advance onto a substrate 10 being common to an optical semiconductor element 13, and brought into contact with a projecting part 14a of a supporting part 14a of a supporting base 14 for forming a supporting point positioned at a suitable gap against the optical semiconductor element 13. Subsequently, while holding this state, the optical axis adjustment is executed by using the contact part as the supporting point, and after the adjustment has been completed, the supporting base 14 and the fiber holder 12 are soldered and fixed by a soldering part 14b, at a position separated from a distance to the supporting point when it is seen from the optical semiconductor element 13, for instance, at a position which is distant by several times. In such a way, since the optical fiber 11 being in the vicinity of the optical semiconductor element 13 is always in a fixed state, the fluctuation of the soldering part 14b and the influence exerted on the tip of the fiber can be remarkably reduced.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、光半導体結合器の製造方法に係り、特に、光
半導体素子と光ファイバとの位置決めを正確に行い得る
光半導体結合器の製造方法に関するものである。
Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method for manufacturing an optical semiconductor coupler, and in particular, to a method for manufacturing an optical semiconductor coupler that can accurately position an optical semiconductor element and an optical fiber. It is about the method.

(従来の技術) 光半導体結合器を製造する一方法として、光半導体素子
の出力をレンズ等を介さずに直接光ファイバに結合する
方法がある。この方法によれば、光ファイバ先端に球状
の加工を施し、レンズ作用をもたらすことによりロンド
レンズ等を介した場合より数段高い結合効率を得ること
が可能である。
(Prior Art) One method of manufacturing an optical semiconductor coupler is to directly couple the output of an optical semiconductor element to an optical fiber without using a lens or the like. According to this method, the tip of the optical fiber is processed into a spherical shape to provide a lens effect, thereby making it possible to obtain a coupling efficiency that is several orders of magnitude higher than when using a Rondo lens or the like.

しかし、この場合は、軸ずれ精度は数段厳しくなり、例
えば、シングルモードファイバとの結合に至っては±0
.5μmを要求される。
However, in this case, the axis misalignment accuracy becomes several orders of magnitude more severe, and for example, when coupled with a single mode fiber, ±0
.. 5 μm is required.

従来、この種の光半導体結合器の製造方法として第7図
、第8図に示されるものがあった。
Conventionally, there have been methods for manufacturing this type of optical semiconductor coupler as shown in FIGS. 7 and 8.

まず、従来の光半導体結合器の製造方法を第7図を用い
て説明する。ここで、第7図(a)はその側面図、第7
1図(b)は第7図(a)のA−A線断面図である。
First, a conventional method for manufacturing an optical semiconductor coupler will be explained using FIG. 7. Here, FIG. 7(a) is a side view of the
FIG. 1(b) is a sectional view taken along line A--A in FIG. 7(a).

図に示されるように、光ファイバ1は先端に球状の加工
を施され、この先球加工を施された光ファイバ1はファ
イバホルダ2に支持されている。
As shown in the figure, the tip of the optical fiber 1 is processed into a spherical shape, and the optical fiber 1 with the tip processed into a spherical shape is supported by a fiber holder 2 .

そして、更に、このファイバホルダ2は光軸調整治具3
に把持されている。光半導体素子4を発光させた状態で
光軸調整治具3をX、Y、Zの3軸方向に移動すること
により光ファイバ1と光半導体素子4の光軸調整を行い
特性が最大となった所で、ファイバホルダ2と支持台5
の間をYAGレーザ等を使用して半田6により固定する
Furthermore, this fiber holder 2 has an optical axis adjustment jig 3.
is being held by. By moving the optical axis adjustment jig 3 in the three axis directions of X, Y, and Z while the optical semiconductor element 4 is emitting light, the optical axis of the optical fiber 1 and the optical semiconductor element 4 is adjusted to maximize the characteristics. At this point, attach the fiber holder 2 and support stand 5.
The space between them is fixed with solder 6 using a YAG laser or the like.

また、第8図は従来の他の光半導体結合器の製造方法の
説明図である。即ち、第8図(a)はその側面図、第8
図(b)は第8図(a)のB −B vA断面図である
Further, FIG. 8 is an explanatory diagram of another conventional method of manufacturing an optical semiconductor coupler. That is, FIG. 8(a) is a side view of the
FIG. 8(b) is a sectional view taken along B-B vA in FIG. 8(a).

この図に示されるように、光ファイバ7と支持台8との
間をYAGレーザ等を使用して半田9により固定するよ
うにしていた。
As shown in this figure, the optical fiber 7 and the support base 8 were fixed with solder 9 using a YAG laser or the like.

(発明が解決しようとする問題点) しかしながら、以上述べた何れの方法であっても、X、
Y、Zの3軸方向の調整による限り、光軸調整治具3に
より支持されている部分以外は必ず宙に浮いており、ど
の部分を固定するにしても半田6,9の溶融時の表面張
力や冷却時の体積収縮等により光ファイバ先端部が第7
図(b)及び第8図(b)に示されるように、矢印の方
向へ引っ張られ、半田付け後の結合特性が大きく変動す
るという問題点があった。
(Problem to be solved by the invention) However, with any of the methods described above,
As far as adjustment is performed in the three axis directions of Y and Z, the parts other than those supported by the optical axis adjustment jig 3 are always floating in the air, and no matter which part is fixed, the surface of the solder 6 and 9 when melted Due to tension, volumetric contraction during cooling, etc., the tip of the optical fiber becomes the 7th layer.
As shown in FIG. 8(b) and FIG. 8(b), there was a problem in that it was pulled in the direction of the arrow, and the bonding characteristics after soldering varied greatly.

本発明は、以上述べた光ファイバの半田付け時の変動を
除去し、結合特性の優れた光半導体結合器を提供するこ
とを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-described fluctuations during soldering of optical fibers and to provide an optical semiconductor coupler with excellent coupling characteristics.

(問題点を解決するための手段) 本発明は、上記問題点を解決するために、常に光ファイ
バを保持するファイバホルダの一部分を、光半導体素子
と共通の基板上に固定しておき、光半導体素子とは適当
な間隙を持って位置する支点を形成する支持台の突起部
に接触させ、この状態を保ちながら接触部分を支点とし
て光軸調整を行い、調整完了後、光半導体素子から見て
支点までの距離より離れた位置、例えば、数倍遠い位置
で支持台とファイバホルダとの間を半田付けにより固定
するようにしたものである。
(Means for Solving the Problems) In order to solve the above problems, the present invention fixes a part of the fiber holder that always holds the optical fiber on a common substrate with the optical semiconductor element, and The semiconductor element is brought into contact with the protruding part of the support base that forms a fulcrum located with an appropriate gap, and while maintaining this state, the optical axis is adjusted using the contact part as a fulcrum. After the adjustment is completed, the optical axis is adjusted as seen from the optical semiconductor element. The support base and the fiber holder are fixed by soldering at a position farther away than the distance to the fulcrum, for example, at a position several times farther away.

(作用) 本発明によれば、上記のように構成したので、光半導体
素子の近傍の光ファイバが常に固定状態にあるため、半
田付け部の変動がファイバ先端に及ぼす影響を非常に少
なくすることができるので、特性変動の少ない光半導体
結合器の製造が可能である。
(Function) According to the present invention, with the above configuration, the optical fiber near the optical semiconductor element is always in a fixed state, so that the influence of fluctuations in the soldered portion on the fiber tip can be extremely reduced. Therefore, it is possible to manufacture an optical semiconductor coupler with less variation in characteristics.

また、調整治具の実際の移動量より光ファイバ先端部の
移動を小さくできるので、安価な調整治具で高精度な光
軸調整が可能である。
Furthermore, since the movement of the optical fiber tip can be made smaller than the actual movement amount of the adjustment jig, highly accurate optical axis adjustment is possible with an inexpensive adjustment jig.

(実施例) 以下、本発明の実施例について図面を参照しながら詳細
に説明する。
(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

第1図は本発明を実施する光半導体結合器の製造装置の
全体構成図、第2図はその光半導体結合器の支持台の斜
視図、第3図はその支持台への光ファイバの取付工程を
示す図である。
Fig. 1 is an overall configuration diagram of an optical semiconductor coupler manufacturing apparatus that implements the present invention, Fig. 2 is a perspective view of a support stand for the optical semiconductor coupler, and Fig. 3 is a diagram showing the attachment of an optical fiber to the support stand. It is a figure showing a process.

図中、10は基板、11は光ファイバ、12はこの光フ
ァイバを保持するファイバホルダ、13は光半導体素子
、14は支持台、14aは突起部、14bは半田付け部
、15は光軸調整治具、16はジヨイントA117は上
側アーム、18は圧縮バネ、19はジヨイントB、20
は下側アームである。
In the figure, 10 is a substrate, 11 is an optical fiber, 12 is a fiber holder that holds this optical fiber, 13 is an optical semiconductor element, 14 is a support stand, 14a is a protrusion, 14b is a soldering part, and 15 is an optical axis adjustment Jig, 16 is joint A, 17 is upper arm, 18 is compression spring, 19 is joint B, 20
is the lower arm.

この図に示されるように、光軸調整治具15はジョイン
)A16を中心に横方向にのみ可動する上側アーム17
と、この上側アーム17と圧縮バネ18により結合され
ており、ジョイン)B19を中心に上下方向にのみ可動
する下側アーム20とを有し、ファイバホルダ12は下
側アーム20により支持されている。支持台14は、第
2図及び第3図に示すように、突起部14aと半田付け
部14bとからなっている。
As shown in this figure, the optical axis adjustment jig 15 has an upper arm 17 that is movable only laterally around the joint A16.
and a lower arm 20 which is connected to the upper arm 17 by a compression spring 18 and is movable only in the vertical direction around the joint B19, and the fiber holder 12 is supported by the lower arm 20. . As shown in FIGS. 2 and 3, the support stand 14 includes a protrusion 14a and a soldering portion 14b.

即ち、突起部14aはその上部にv形の突起を設け、フ
ァイバホルダの中心から見て90″程度の挟み角を持つ
2点がファイバホルダ12と接触する構造を有している
。ファイバホルダ12は圧縮バネ18により、常に、こ
の突起に押し当てられた状態でセットされている。
That is, the protrusion 14a has a v-shaped protrusion on its upper part, and has a structure in which two points having an included angle of about 90'' when viewed from the center of the fiber holder are in contact with the fiber holder 12.Fiber holder 12 is always set against this protrusion by a compression spring 18.

一方、半田付け部14bはその上部が半円形に掘込まれ
ており、ファイバホルダ12が適当な調整しろを持って
セントされる構造をしている。
On the other hand, the soldering part 14b has a semicircular groove in its upper part, and has a structure in which the fiber holder 12 is centered with an appropriate adjustment margin.

次に、第4図及び第5図は本発明の光半導体結合器の製
造工程を説明する図である。即ち、第4図(a)はその
第1工程を説明する平面図、第4図(b)は第4図(a
)のC−C線断面図、第4図(c)は第4図(b)のD
−D線断面図、第5図(a)はその第2工程を説明する
平面図、第5図(b)は第5図(a)のE−E線断面図
、更に、第5図(c)は第5図(b)のF−F線断面図
である。
Next, FIGS. 4 and 5 are diagrams illustrating the manufacturing process of the optical semiconductor coupler of the present invention. That is, FIG. 4(a) is a plan view illustrating the first step, and FIG. 4(b) is a plan view illustrating the first step.
), Figure 4(c) is a cross-sectional view taken along line C-C of Figure 4(b).
5(a) is a plan view explaining the second step, FIG. 5(b) is a sectional view taken along line E-E in FIG. c) is a sectional view taken along line FF in FIG. 5(b).

まず、第1図及び第4図に示されるように、ファイバホ
ルダ12が支点を形成する突起部14aに押し付けられ
た状態では、例えば、光軸調整治具15の横方向への移
動は上側アーム17の水平方向の回転運動に置き換えら
れ、また、上下方向への移動は下側アーム20の垂直方
向の回転運動に置き換えられる。そして更にこれらの動
きは支持台14の突起部14aを支点にして光ファイバ
の先端部を、各々光半導体素子13の活性層に平行な方
向、活性層に垂直な方向へ移動させ光軸を調整する。勿
論、光軸方向への調整は調整治具15を前後させること
によりファイバホルダ12を支持台14上でスライドさ
せるだけでよい。以上のように、ファイバホルダ12を
支持台14の突起部14aに押し当てた状態を保ちなが
ら光軸調整が可能となる。これらの調整において光軸調
整治具15の移動量に対する実際のファイバ先端部の移
動量の比は第6図(a)に示されるように、A/Bとな
るため、容易に高精度な光軸調整を行うことができる。
First, as shown in FIGS. 1 and 4, when the fiber holder 12 is pressed against the protrusion 14a forming the fulcrum, for example, the optical axis adjustment jig 15 cannot be moved in the lateral direction by the upper arm. 17 is replaced by a horizontal rotational movement, and the vertical movement is replaced by a vertical rotational movement of the lower arm 20. These movements further adjust the optical axis by moving the tip of the optical fiber in a direction parallel to the active layer of the optical semiconductor element 13 and in a direction perpendicular to the active layer, respectively, using the projection 14a of the support base 14 as a fulcrum. do. Of course, adjustment in the optical axis direction can be made by simply sliding the fiber holder 12 on the support base 14 by moving the adjustment jig 15 back and forth. As described above, the optical axis can be adjusted while keeping the fiber holder 12 pressed against the protrusion 14a of the support base 14. In these adjustments, the ratio of the actual amount of movement of the fiber tip to the amount of movement of the optical axis adjustment jig 15 is A/B as shown in FIG. Axis adjustments can be made.

ここで、例えば、Aは2ms、Bは5011程度である
。また、この時生じる角度ずれは少なく、X、Y方向の
調整により十分補正できる範囲である。
Here, for example, A is 2 ms and B is about 5011 ms. Further, the angular deviation that occurs at this time is small and can be sufficiently corrected by adjustment in the X and Y directions.

次に、光軸調整完了後、第5図に示されるように、支持
台14とファイバホルダ12とを半田23を用いて光半
導体素子13から見て支点までの距離より離れた位置、
例えば、数倍遠い位置に形成された支持台14の半田付
け部14bとファイバホルダとの間をYAGレーザ等で
半田付け固定する。なお、下側アーム20にかかるバネ
圧はファイバホルダ12が撓まない程度の量にする。こ
の時、起こる半田付け部の変動に対する実際のファイバ
先端の軸ずれ量の比は第6図(b)に示されるように、
A/Cとなるため非常に半田付け時の特性変動を少なく
することができる。ここで、例えば、Aは2寵、Cは5
.5鶴である。つまり、光半導体素子13から支持台1
4の突起部14aまでの距離が短いほど、光軸調整範囲
は狭くなるが、高精度な光軸調整が可能となり、半田付
け時の変動も少なくなる。
Next, after completing the optical axis adjustment, as shown in FIG.
For example, a YAG laser or the like is used to solder and fix the fiber holder to the soldering portion 14b of the support base 14, which is formed at a position several times farther away. Note that the spring pressure applied to the lower arm 20 is set to an amount such that the fiber holder 12 does not bend. At this time, the ratio of the amount of axis deviation of the actual fiber tip to the fluctuation of the soldered part that occurs is as shown in Figure 6(b).
Since it is an A/C, variation in characteristics during soldering can be greatly reduced. Here, for example, A is 2 points and C is 5 points.
.. It is 5 cranes. In other words, from the optical semiconductor element 13 to the support base 1
The shorter the distance to the protrusion 14a of No. 4, the narrower the optical axis adjustment range becomes, but it becomes possible to adjust the optical axis with high precision, and fluctuations during soldering are also reduced.

なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。
Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(発明の効果) 以上、詳細に説明したように、本発明によれば、従来方
法と異なり、光半導体素子の近傍の光ファイバが常に支
持台の突起部に接触状態にあり、更に、その接触した支
点より離れたはるかに後方にて半田付けを行い光ファイ
バを固定するようにしたので、半田付け部の変動がファ
イバ先端に及ぼす影響を非常に少なくすることができ、
特性変動の少ない光半導体結合器の製造が可能である。
(Effects of the Invention) As described above in detail, according to the present invention, unlike the conventional method, the optical fiber near the optical semiconductor element is always in contact with the protrusion of the support base, and Since the optical fiber is fixed by soldering far behind the fulcrum, the effect of fluctuations in the soldered part on the fiber tip can be greatly reduced.
It is possible to manufacture an optical semiconductor coupler with little variation in characteristics.

また、調整治具の実際の移動量より光ファイバ先端部の
移動を小さくできるので、安価な調整治具で高精度な光
軸調整が可能である。
Furthermore, since the movement of the optical fiber tip can be made smaller than the actual movement amount of the adjustment jig, highly accurate optical axis adjustment is possible with an inexpensive adjustment jig.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明を実施する光半導体結合器の製造装置の
全体構成図、第2図はその光半導体結合器の支持台の斜
視図、第3図はその支持台への光ファイバの取付工程を
示す図、第4図及び第5図は本発明の光半導体結合器の
製造工程を説明する図、第6図は本発明の詳細な説明図
、第7図は従来の光半導体結合器の製造工程を示す図、
第8図は従来の他の光半導体結合器の製造工程を示す図
である。  。 10・・・基板、11・・・光ファイバ、12・・・フ
ァイバホルダ、13・・・光半導体素子、14・・・支
持台、14a・・・突起部、14b・・・半田付け部、
15・・・光軸調整治具、16・・・ジヨイントA11
7・・・上側アーム、18・・・圧縮バネ、19・・・
ジヨイントB120・・・下側アーム。 特許出願人 沖電気工業株式会社
Fig. 1 is an overall configuration diagram of an optical semiconductor coupler manufacturing apparatus that implements the present invention, Fig. 2 is a perspective view of a support stand for the optical semiconductor coupler, and Fig. 3 is a diagram showing the attachment of an optical fiber to the support stand. 4 and 5 are diagrams illustrating the manufacturing process of the optical semiconductor coupler of the present invention, Figure 6 is a detailed explanatory diagram of the present invention, and Figure 7 is a conventional optical semiconductor coupler. A diagram showing the manufacturing process of
FIG. 8 is a diagram showing the manufacturing process of another conventional optical semiconductor coupler. . DESCRIPTION OF SYMBOLS 10... Substrate, 11... Optical fiber, 12... Fiber holder, 13... Optical semiconductor element, 14... Support stand, 14a... Protrusion part, 14b... Soldering part,
15... Optical axis adjustment jig, 16... Joint A11
7... Upper arm, 18... Compression spring, 19...
Joint B120...lower arm. Patent applicant Oki Electric Industry Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] (1)基板上に光半導体素子と光ファイバ固定用支持台
を設け、光ファイバと光半導体素子の光軸合わせを行っ
た後、光ファイバを前記支持台に固定する光半導体結合
器の製造方法において、 (a)光ファイバを支持するファイバホルダの一部を、
支持台に設けられた支点を形成する突起部に押し当てた
状態で光半導体素子と光ファイバ先端部との光軸調整を
行う工程と、 (b)前記状態を保ったまま、前記突起部の後方であっ
て、前記光半導体素子から見て支点までの距離より離れ
た位置で前記支持台とファイバホルダとの間を半田付け
により固定する工程とを有することを特徴とする光半導
体結合器の製造方法。
(1) A method for manufacturing an optical semiconductor coupler in which an optical semiconductor element and a support for fixing an optical fiber are provided on a substrate, the optical axes of the optical fiber and the optical semiconductor element are aligned, and then the optical fiber is fixed to the support. (a) A part of the fiber holder supporting the optical fiber,
(b) adjusting the optical axis of the optical semiconductor element and the tip of the optical fiber while the optical semiconductor element is pressed against a protrusion forming a fulcrum provided on the support; (b) adjusting the protrusion while maintaining the above state; An optical semiconductor coupler comprising the step of fixing the supporting base and the fiber holder by soldering at a rear position that is further away from the fulcrum when viewed from the optical semiconductor element. Production method.
(2)前記支持台は光半導体素子に適度な間隙を持って
設置され、この支持台上の突起部を支点として、ここに
前記ファイバホルダの一部分を適当な押し付け圧を以て
接触させ、この接触点を中心に調整治具を移動すること
により、その移動方向とは点対称な方向に光ファイバ先
端部を移動させ、更に調整治具から支点部分までと、支
点部分から光ファイバ先端までの距離の比を1より大き
くして、実際の調整治具の移動量より光ファイバ先端に
おける移動量が小さくなるようにしたことを特徴とする
特許請求の範囲第1項記載の光半導体結合器の製造方法
(2) The support base is installed on the optical semiconductor element with an appropriate gap, and using the protrusion on the support base as a fulcrum, a part of the fiber holder is brought into contact with the protrusion with an appropriate pressing pressure, and this contact point is By moving the adjustment jig around , the tip of the optical fiber is moved in a direction symmetrical to the direction of movement, and the distances from the adjustment jig to the fulcrum and from the fulcrum to the tip of the optical fiber are The method for manufacturing an optical semiconductor coupler according to claim 1, characterized in that the ratio is made larger than 1 so that the amount of movement at the tip of the optical fiber is smaller than the amount of movement of the actual adjustment jig. .
(3)前記ファイバホルダと支持台の半田付け部から突
起部までと、その突起部からファイバ先端部までの距離
の比を1より大きくすることにより、実際の半田付け部
の変動より光ファイバ先端部に於ける光軸ずれが小さく
なるようにしたことを特徴とする特許請求の範囲第1項
記載の光半導体結合器の製造方法。
(3) By making the ratio of the distance from the soldering part of the fiber holder and support stand to the protrusion and from the protrusion to the fiber tip larger than 1, the optical fiber tip 2. The method of manufacturing an optical semiconductor coupler according to claim 1, wherein the optical axis shift in the optical semiconductor coupler is made small.
JP27329687A 1987-10-30 1987-10-30 Manufacture of optical semiconductor coupler Pending JPH01116607A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27329687A JPH01116607A (en) 1987-10-30 1987-10-30 Manufacture of optical semiconductor coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27329687A JPH01116607A (en) 1987-10-30 1987-10-30 Manufacture of optical semiconductor coupler

Publications (1)

Publication Number Publication Date
JPH01116607A true JPH01116607A (en) 1989-05-09

Family

ID=17525877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27329687A Pending JPH01116607A (en) 1987-10-30 1987-10-30 Manufacture of optical semiconductor coupler

Country Status (1)

Country Link
JP (1) JPH01116607A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097710A1 (en) * 2012-12-21 2014-06-26 古河電気工業株式会社 Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097710A1 (en) * 2012-12-21 2014-06-26 古河電気工業株式会社 Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber
US10101547B2 (en) 2012-12-21 2018-10-16 Furukawa Electric Co., Ltd. Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber

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