JPH01115966A - Composition for coating - Google Patents
Composition for coatingInfo
- Publication number
- JPH01115966A JPH01115966A JP27182487A JP27182487A JPH01115966A JP H01115966 A JPH01115966 A JP H01115966A JP 27182487 A JP27182487 A JP 27182487A JP 27182487 A JP27182487 A JP 27182487A JP H01115966 A JPH01115966 A JP H01115966A
- Authority
- JP
- Japan
- Prior art keywords
- group
- composition
- parts
- weight
- alkoxysilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract description 42
- 238000000576 coating method Methods 0.000 title abstract description 38
- 239000011248 coating agent Substances 0.000 title abstract description 33
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 16
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 13
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims abstract description 5
- 125000002252 acyl group Chemical group 0.000 claims abstract description 3
- 239000008199 coating composition Substances 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 125000000962 organic group Chemical group 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 28
- 239000003513 alkali Substances 0.000 abstract description 9
- XPDGHGYGTJOTBC-UHFFFAOYSA-N methoxy(methyl)silicon Chemical compound CO[Si]C XPDGHGYGTJOTBC-UHFFFAOYSA-N 0.000 abstract 1
- -1 γ-chloropropyl group Chemical group 0.000 description 24
- 239000000945 filler Substances 0.000 description 20
- 239000003960 organic solvent Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 10
- 238000009835 boiling Methods 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- LTOATULEBMBWSO-UHFFFAOYSA-N acetic acid;2-ethoxyethanol Chemical compound CC(O)=O.CCOCCO LTOATULEBMBWSO-UHFFFAOYSA-N 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910000423 chromium oxide Inorganic materials 0.000 description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229910052845 zircon Inorganic materials 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 125000005309 thioalkoxy group Chemical group 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- 125000002861 (C1-C4) alkanoyl group Chemical group 0.000 description 1
- BSSNZUFKXJJCBG-OWOJBTEDSA-N (e)-but-2-enediamide Chemical compound NC(=O)\C=C\C(N)=O BSSNZUFKXJJCBG-OWOJBTEDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-UPHRSURJSA-N (z)-but-2-enediamide Chemical compound NC(=O)\C=C/C(N)=O BSSNZUFKXJJCBG-UPHRSURJSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- ONIKNECPXCLUHT-UHFFFAOYSA-N 2-chlorobenzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1Cl ONIKNECPXCLUHT-UHFFFAOYSA-N 0.000 description 1
- CEYHHQSTMVVZQP-UHFFFAOYSA-N 2-ethenoxyethanamine Chemical compound NCCOC=C CEYHHQSTMVVZQP-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LPNSCOVIJFIXTJ-UHFFFAOYSA-N 2-methylidenebutanamide Chemical compound CCC(=C)C(N)=O LPNSCOVIJFIXTJ-UHFFFAOYSA-N 0.000 description 1
- JGBOVFKUKBGAJQ-UHFFFAOYSA-N 2-methylidenebutanediamide Chemical compound NC(=O)CC(=C)C(N)=O JGBOVFKUKBGAJQ-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 101000795624 Homo sapiens Pre-rRNA-processing protein TSR1 homolog Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- MZWXWSVCNSPBLH-CYBMUJFWSA-N NCCCO[Si@](OC)(C)CCCN Chemical compound NCCCO[Si@](OC)(C)CCCN MZWXWSVCNSPBLH-CYBMUJFWSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- QQDSFKPWDURPAQ-UHFFFAOYSA-N O-[aminooxy(methyl)silyl]hydroxylamine Chemical compound C[SiH](ON)ON QQDSFKPWDURPAQ-UHFFFAOYSA-N 0.000 description 1
- 102100031564 Pre-rRNA-processing protein TSR1 homolog Human genes 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- MZFBKHCHWCYNSO-UHFFFAOYSA-N [acetyloxy(phenyl)silyl] acetate Chemical compound CC(=O)O[SiH](OC(C)=O)C1=CC=CC=C1 MZFBKHCHWCYNSO-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- AONDIGWFVXEZGD-UHFFFAOYSA-N diacetyloxy(methyl)silicon Chemical compound CC(=O)O[Si](C)OC(C)=O AONDIGWFVXEZGD-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- XNAFLNBULDHNJS-UHFFFAOYSA-N dichloro(phenyl)silicon Chemical compound Cl[Si](Cl)C1=CC=CC=C1 XNAFLNBULDHNJS-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- CIQDYIQMZXESRD-UHFFFAOYSA-N dimethoxy(phenyl)silane Chemical compound CO[SiH](OC)C1=CC=CC=C1 CIQDYIQMZXESRD-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- SIRXTPQQVQWAMB-UHFFFAOYSA-N n-methyl-n-silyloxymethanamine Chemical compound CN(C)O[SiH3] SIRXTPQQVQWAMB-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、コーティング用組成物に関し、さらに詳細に
は、低温で硬化させることができ、耐熱性、耐水性、耐
沸騰水性、耐有機薬品性、耐透水性、耐アルカリ性、耐
溶剤性、耐候性、耐汚染性、平滑性、密着性、保存安定
性などに優れた硬度の高い塗膜を提供するために好適な
コーティング用組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a coating composition, and more particularly, it relates to a coating composition that can be cured at low temperatures, has heat resistance, water resistance, boiling water resistance, and organic chemical resistance. The present invention relates to a coating composition suitable for providing a highly hard coating film with excellent properties such as water resistance, water permeability, alkali resistance, solvent resistance, weather resistance, stain resistance, smoothness, adhesion, and storage stability. .
近年、低温で硬化させることができ、耐熱性、耐水性、
耐沸騰水性、耐有機薬品性、耐透水性、耐アルカリ性、
耐溶剤性、耐候性、耐汚染性、平滑性、密着性、保存安
定性などに優れた硬度の高い塗膜を形成させることので
きるコーティング用組成物が求められている。In recent years, it can be cured at low temperature, has heat resistance, water resistance,
Boiling water resistance, organic chemical resistance, water permeability resistance, alkali resistance,
There is a need for a coating composition that can form a highly hard coating film with excellent solvent resistance, weather resistance, stain resistance, smoothness, adhesion, storage stability, etc.
このような要求の一部を満たすコーティング用組成物と
しては、例えば特公昭52−39691号公報、特公昭
53−5042号公報、特開昭54−87736号公報
、特開昭55−94971号公報、特開昭56−992
36号公報、特開昭59−68377号公報などにおい
て提案されている組成物を挙げることができる。Coating compositions that meet some of these requirements include, for example, Japanese Patent Publication No. 52-39691, Japanese Patent Publication No. 53-5042, Japanese Patent Application Laid-Open No. 87736-1973, and Japanese Patent Application Publication No. 55-94971. , Japanese Patent Publication No. 56-992
Examples include compositions proposed in Japanese Patent Application Publication No. 36, Japanese Patent Application Laid-open No. 59-68377, and the like.
しかしながら、前記公報に記載されているコーティング
用組成物は、いずれもオルガノアルコキシシランとコロ
イド状シリカもしくはコロイド状アルミナを主成分とし
たものであり、得られる塗膜の耐アルカリ性、耐熱性、
耐水性、耐沸騰水性、耐有機薬品性、耐透水性、耐溶剤
性、耐候性、耐汚染性、密着性、保存安定性が劣6、ま
た塗膜の平滑性が充分でないなどの欠点を有している。However, the coating compositions described in the above publications all contain organoalkoxysilane and colloidal silica or colloidal alumina as main components, and the resulting coatings have poor alkali resistance, heat resistance,
It has drawbacks such as poor water resistance, boiling water resistance, organic chemical resistance, water permeability resistance, solvent resistance, weather resistance, stain resistance, adhesion, and storage stability6, as well as insufficient smoothness of the coating film. have.
本発明は、前記従来の技術的課匙を背景になされたもの
で、低温で硬化させることができ、耐候性、耐透水性、
耐熱性、耐有機薬品性、耐溶剤性、耐汚染性、密着性、
保存安定性に優れ、特に耐アルカリ性、耐水性、耐沸騰
水性に優れた硬度の高い平滑性の良い塗膜を形成させる
ことのできるコーティング用組成物を提供することを目
的とする。The present invention was made against the background of the above-mentioned conventional technical problems, and can be cured at low temperatures, has weather resistance, water permeability resistance,
Heat resistance, organic chemical resistance, solvent resistance, stain resistance, adhesion,
The purpose of the present invention is to provide a coating composition that has excellent storage stability and can form a hard, smooth coating film that is particularly excellent in alkali resistance, water resistance, and boiling water resistance.
C問題点を解決するための手段〕
すなわち、本発明は、
(a)一般式Rn S t (OR’ ) a、(式
中、Rは炭素数1〜8の有機基、R′は炭素数1〜5の
アルキル基または炭素数1〜4のアシル基を示し、nは
Oまたは1である)で表されるアルコキシシラン、該ア
ルコキシシランの加水分解物および/または部分的縮合
物(以下「(a)成分」という)をアルコキシシラン換
算で10〜80重量部、fbl末端あるいは側鎖に加水
分解性基と結合したケイ素原子を有するシリル基を重合
体1分子中に少なくとも1個有するビニル系樹脂(以下
「(b)成分」という)1.0〜80重量部、ならびに
(c)1分子中に少なくとも1個の反応性官能基を有す
るオルガノポリシロキサン(以下「(c)成分」という
)10〜80重量部(ただし、(a) + (bl +
(c) =100重量部)を含有することを特徴とす
るコーティング用組成物を提供するものである。Means for Solving Problem C] That is, the present invention provides (a) general formula Rn S t (OR' ) a, (wherein R is an organic group having 1 to 8 carbon atoms, and R' is an organic group having 1 to 8 carbon atoms; 1-5 alkyl group or C1-4 acyl group, n is O or 1); hydrolyzates and/or partial condensates of the alkoxysilanes (hereinafter referred to as " 10 to 80 parts by weight (referred to as "component (a)") in terms of alkoxysilane, a vinyl-based polymer having at least one silyl group in one polymer molecule that has a silicon atom bonded to a hydrolyzable group at the fbl end or side chain. 1.0 to 80 parts by weight of a resin (hereinafter referred to as "component (b)"), and (c) an organopolysiloxane having at least one reactive functional group in one molecule (hereinafter referred to as "component (c)") 10 to 80 parts by weight ((a) + (bl +
(c) = 100 parts by weight).
次に、本発明の組成物を構成要件側に詳述する。Next, the constituent elements of the composition of the present invention will be explained in detail.
(a)成分
(al成分は、(a)′一般式R,,S i(OR’
) a−、。(a) component (al component is (a)' general formula R,,S i(OR'
) a-,.
で表されるアルコキシシラン、富亥アルコキシシランを
加水分解および/または部分的縮合して得られるもので
ある。It is obtained by hydrolyzing and/or partially condensing an alkoxysilane represented by the above formula, Fuhai alkoxysilane.
かかるアルコキシシラン中のRは、炭素数1〜8の有機
基であり、例えばメチル基、エチル基、プロピル基など
のアルキル基、そのほかγ−クロロプロピル基、ビニル
基、3.3.3−)リフロロプロピル基、γ−グリシド
キシプロピル基、T−メタクリルオキシブロビル基、γ
−メルカプトフロビル基、フェニル基、3.4−エポキ
シシクロヘキシルエチル基などが挙げられる。R in such alkoxysilane is an organic group having 1 to 8 carbon atoms, such as an alkyl group such as a methyl group, an ethyl group, or a propyl group, as well as a γ-chloropropyl group, a vinyl group, etc. Lifluoropropyl group, γ-glycidoxypropyl group, T-methacryloxybrobyl group, γ
-mercaptofurovir group, phenyl group, 3,4-epoxycyclohexylethyl group, and the like.
また、アルコキシシラン中のR′は、炭素数1〜5のア
ルキル基または炭素数1〜4のアシル基であり、例えば
メチル基、エチル基、プロピル基、ブチル基、アセチル
基などが挙げられる。Further, R' in the alkoxysilane is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, a propyl group, a butyl group, an acetyl group, and the like.
さらに、前記nはOまたは1の整数であり、ここでnが
0の場合は、例えばテトラアルコキシシランであり、ま
たnが1の場合は、例えばモノアルキルトリアルコキシ
シランである。Further, n is an integer of O or 1, and when n is 0, it is, for example, tetraalkoxysilane, and when n is 1, it is, for example, monoalkyltrialkoxysilane.
これらのアルコキシシランの具体例としては、テトラメ
トキシシラン、テトラエトキシシラン、テトラプロポキ
シシラン、テトラブトキシシランなどのテトラアルコキ
シシラン類、テトラエトキシシランダイマー、テトラエ
トキシシランテトラマー、テトラエトキシシランヘキサ
マーなどの前記テトラアルコキシシラン類の縮合物、メ
チルトリメトキシシラン、メチルトリエトキシシラン、
エチルトリメトキシシラン、エチルトリエトキシシラン
、プロピルトリメトキシシラン、プロピルトリエトキシ
シラン、γ−クロロプロピルトリメトキシシラン、γ−
クロロプロピルトリエトキシシラン、ビニルトリメトキ
シシラン、ビニルl−+Jエトキシシラン、3.3.3
−)リフロロプロピルトリメトキシシラン、3.3.3
−1−リフロロブロビルトリエトキシシラン、γ−グリ
シドキシプロピルトリメトキシシラン、T−グリシドキ
シプロピルトリエトキシシラン、γ−メタクリルオキシ
プロピルトリメトキシシラン、γ−メタクリルオキシプ
ロピルトリエトキシシラン、γ−メルカプトプロピルト
リメトキシシラン、γ−メルカプトプロピルトリエトキ
シシラン、フェニルトリメトキシシラン、フェニルトリ
エトキシシラン、3.4−エポキシシクロヘキシルエチ
ルトリメトキシシラン、3.4−エポキシシクロヘキシ
ルエチルトリエトキシシランなどのオルガノアルコキシ
シラン類を挙げることができ、好ましくはメチルトリメ
トキシシラン、メチルトリエトキシシラン、フェニルト
リメトキシシランである。Specific examples of these alkoxysilanes include tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, and tetrabutoxysilane; Condensates of tetraalkoxysilanes, methyltrimethoxysilane, methyltriethoxysilane,
Ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-
Chloropropyltriethoxysilane, vinyltrimethoxysilane, vinyl l-+J ethoxysilane, 3.3.3
-) Lifluoropropyltrimethoxysilane, 3.3.3
-1-lifluorobrobyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, T-glycidoxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ- Organoalkoxysilanes such as mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3.4-epoxycyclohexylethyltrimethoxysilane, 3.4-epoxycyclohexylethyltriethoxysilane Among them, methyltrimethoxysilane, methyltriethoxysilane, and phenyltrimethoxysilane are preferred.
(al成分の組成物中における使用割合は、(a) +
fbl+(c)の合計100重量部中、アルコキシシ
ラン換算で10〜80重量部、好ましくは15〜70重
量部であり、10重量部未満では得られる塗膜の耐候性
の悪化および硬度の低下を招き、一方80重量部を超え
ると得られる塗膜の耐アルカリ性が低下する。(The usage ratio of the al component in the composition is (a) +
Out of a total of 100 parts by weight of fbl+(c), the amount is 10 to 80 parts by weight, preferably 15 to 70 parts by weight in terms of alkoxysilane.If it is less than 10 parts by weight, the weather resistance and hardness of the resulting coating film may deteriorate. On the other hand, if it exceeds 80 parts by weight, the alkali resistance of the resulting coating film decreases.
(b)成分
本発明で使用される(b)成分とは、主鎖がビニル系重
合体からなり、末端あるいは側鎖に加水分解性基と結合
したケイ素原子を有するシリル基を重合体1分子中に少
なくとも1個、好ましくは2個以上含有するものであり
、該シリル基の多くは、下記一般式
%式%
(式中、Xはハロゲン原子、アルコキシ基、アシロキシ
基、アシロキシ基、フェノキシ基、チオアルコキシ基、
アミノ基などの加水分解性基、R1は水素原子、炭素数
1〜10のアルキル基、または炭素数7〜10のアラル
キル基、mは1〜3の整数である)で示される。Component (b) The component (b) used in the present invention is a polymer whose main chain is made of a vinyl polymer and which has a silyl group having a silicon atom bonded to a hydrolyzable group at the terminal or side chain. Most of the silyl groups contain at least one, preferably two or more, in the following general formula % (wherein X is a halogen atom, alkoxy group, acyloxy group, acyloxy group, phenoxy group , thioalkoxy group,
A hydrolyzable group such as an amino group, R1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aralkyl group having 7 to 10 carbon atoms, m is an integer of 1 to 3).
ここで、Xとしては、例えば塩素原子、臭素原子などの
ハロゲン原子、メトキシ基、エトキシ基、プロポキシ基
などのアルコキシ基、アセチル基、プロピオニル基など
のアシロキシ基、メチルメルカプト基、エチルメルカプ
ト基などのチオアルコキシ基、またR1としては、例え
ばメチル基、エチル基、プロピル基、オクチル基、ノニ
ル基などの炭素数1〜10のアルキル基、ベンジル基、
フェネチル基、クミル基などの炭素数7〜1oのアラル
キル基が挙げられる。Here, X is, for example, a halogen atom such as a chlorine atom or a bromine atom, an alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, an acyloxy group such as an acetyl group or a propionyl group, a methylmercapto group, an ethylmercapto group, etc. A thioalkoxy group, and as R1, an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, an octyl group, a nonyl group, a benzyl group,
Examples include aralkyl groups having 7 to 1 carbon atoms such as phenethyl group and cumyl group.
かかる(bl成分は、(イ)ヒドロシラン化合物を炭素
−炭素二重結合を有するビニル系樹脂と反応させること
により製造してもよく、また(口)下記一般式
(ただし、X% R’ 、mは前記に同じであり、R2
は例えばCH2=CH−1
CHz =CHCOO(cHz )x −1CHz =
C(cH3)Coo (cHz ’)3−1などの重合
性二重結合を有する有機基である)で示されるシラン化
合物と、各種ビニル系化合物とを重合することにより製
造してもよい。Such a (bl component) may be produced by (i) reacting a hydrosilane compound with a vinyl resin having a carbon-carbon double bond, and may also be produced using the following general formula (where X% R', m is the same as above, and R2
For example, CH2=CH-1 CHz = CHCOO(cHz) x -1CHz =
It may be produced by polymerizing a silane compound represented by C(cH3)Coo (cHz')3-1, which is an organic group having a polymerizable double bond, and various vinyl compounds.
ここで、前記(イ)で示される製造方法で使用されるヒ
ドロシラン化合物としては、例えばメチルジクロルシラ
ン、トリクロルシラン、フエニルジクロルシランなどの
ハロゲン化シラン類;メチルジェトキシシラン、メチル
ジメトキシシラン、フエニルジメトキシシラン、トリメ
トキシシラン、トリエトキシシランなどのアルコキシシ
ラン類;メチルジアセトキシシラン、フエニルジアセト
キシシラン、トリアセトキシシランなどのアシロキシシ
ラン類;メチルジアミノキシシラン、トリアミノキシシ
ラン、ジメチルアミノキシシラン、トリアミノシランな
どのアミノシラン類が挙げられる。Here, the hydrosilane compounds used in the production method shown in (a) above include, for example, halogenated silanes such as methyldichlorosilane, trichlorosilane, and phenyldichlorosilane; methyljethoxysilane, methyldimethoxysilane , alkoxysilanes such as phenyldimethoxysilane, trimethoxysilane, and triethoxysilane; acyloxysilanes such as methyldiacetoxysilane, phenyldiacetoxysilane, and triacetoxysilane; methyldiaminoxysilane, triaminoxysilane, Examples include aminosilanes such as dimethylaminoxysilane and triaminosilane.
また、(イ)で示される製造方法で使用されるビニル系
樹脂としては、水酸基を含むビニル系樹脂を除く以外、
特に限定はなく、例えば(メタ)アクリル酸メチル、(
メタ)アクリル酸エチル、(メタ)アクリル酸ブチル、
(メタ)アクリル酸2−エチルヘキシルなどの(メタ)
アクリル酸エステル; (メタ)アクリル酸、イタコン
酸、フマル酸などのカルボン酸および無水マレイン酸な
どの酸無水物;グリシジル(メタ)アクリレートなどの
エポキシ化合物;ジエチルアミノエチル(メタ)アクリ
レート、アミノエチルビニルエーテルなどのアミノ化合
物; (メタ)アクリルアミド、イタコン酸ジアミド、
α−エチルアクリルアミド、クロトンアミド、フマル酸
ジアミド、マレイン酸ジアミド、N−ブトキシメチル(
メタ)アクリルアミドなどのアミド化合物;アクリロニ
トリル、スチレン、α−メチルスチレン、塩化ビニル、
酢酸ビニル、プロピオン酸ビニルなどから選ばれるビニ
ル系化合物の重合体が適当である。In addition, the vinyl resins used in the manufacturing method shown in (a) include, except for vinyl resins containing hydroxyl groups,
There is no particular limitation, for example, methyl (meth)acrylate, (
meth)ethyl acrylate, butyl (meth)acrylate,
(Meth) such as 2-ethylhexyl (meth)acrylate
Acrylic acid esters; Carboxylic acids such as (meth)acrylic acid, itaconic acid, and fumaric acid and acid anhydrides such as maleic anhydride; Epoxy compounds such as glycidyl (meth)acrylate; Diethylaminoethyl (meth)acrylate, aminoethyl vinyl ether, etc. Amino compounds; (meth)acrylamide, itaconic acid diamide,
α-ethylacrylamide, crotonamide, fumaric acid diamide, maleic acid diamide, N-butoxymethyl (
Amide compounds such as meth)acrylamide; acrylonitrile, styrene, α-methylstyrene, vinyl chloride,
Polymers of vinyl compounds selected from vinyl acetate, vinyl propionate, etc. are suitable.
これらのビニル系化合物の重合体の製造時に、一部アク
リル酸アリル、メタクリル酸アリル、ジアリルフタレー
トなどを共重合させることにより、ビニル系樹脂中にヒ
ドロシリル化反応のための炭素−炭素二重結合を導入が
可能である。During the production of polymers of these vinyl compounds, carbon-carbon double bonds for hydrosilylation reactions are created in vinyl resins by partially copolymerizing allyl acrylate, allyl methacrylate, diallyl phthalate, etc. It is possible to introduce
一方、(ロ)で示される製造方法で使用されるシラン化
合物としては、例えば ・CH2= C,HS s
(OCH3)3、CH。On the other hand, as the silane compound used in the production method shown in (b), for example, ・CH2= C, HS s
(OCH3)3, CH.
CHz ”CH3i Cj2z 、CHz −CH3i
C1z、CH。CHz ”CH3i Cj2z, CHz -CH3i
C1z, CH.
■
CHz ”CHCOO(cWz )z S i (O
CH3)2−CH2−CHCOO(cHz )w S
i (OCHi )x、CH2−CHCOO(cH2
) s S i C1s、CHz =C(cH3)Co
o (cHz)3 Si (OCH3)z、CHz
=C(cHi )Co0(cHz )x S 1c1f
z、CH30
などが挙げられる。■ CHz ”CHCOO (cWz )z S i (O
CH3)2-CH2-CHCOO(cHz) w S
i (OCHi)x, CH2-CHCOO(cH2
) s S i C1s, CHz = C(cH3)Co
o (cHz)3 Si (OCH3)z, CHz
=C(cHi)Co0(cHz)xS1c1f
z, CH30, etc.
また、(ロ)で示される製造方法で使用されるビニル系
化合物としては、前記(イ)の製造方法でビニル系樹脂
の重合時に用いられるビニル系化金物を使用することが
可能であるが、かかる(イ)の製造方法に記載された以
外に、2−ヒドロキシエチル(メタ)アクリレート、2
−ヒドロキシプロピル(メタ)アクリレート、2−ヒド
ロキシビニルエーテル、N−メチロールアクリルアミド
などの水酸基を含むビニル系化合物を挙げることもでき
る。Furthermore, as the vinyl compound used in the production method shown in (b), it is possible to use the vinyl compound used in the polymerization of the vinyl resin in the production method (a) above. In addition to those described in the manufacturing method of (a), 2-hydroxyethyl (meth)acrylate, 2
Vinyl compounds containing hydroxyl groups such as -hydroxypropyl (meth)acrylate, 2-hydroxy vinyl ether, and N-methylol acrylamide can also be mentioned.
以上のような本発明に使用される(b)成分の具体例と
しては、鐘淵化学工業■製、ゼムラック、サイリル;東
芝シリコーン■製、シリコーンアクリルワニスTSR1
71などが挙げられる。Specific examples of the component (b) used in the present invention as described above include Zemlac and Cyryl manufactured by Kanebuchi Chemical Industry ■; silicone acrylic varnish TSR1 manufactured by Toshiba Silicone ■;
71 etc.
(b)成分の組成物中の割合は、(a) + (kll
+ (c1の合計100重量部中、10〜80重量部
、好ましくは15〜?0ffi量部であり、10重量部
未満では耐アルカリ性に乏しく、一方80重量部を超え
ると耐候性が悪化する。The proportion of component (b) in the composition is (a) + (kll
+ (out of a total of 100 parts by weight of c1, the amount is 10 to 80 parts by weight, preferably 15 to ?0ffi parts; less than 10 parts by weight results in poor alkali resistance, while more than 80 parts by weight deteriorates weather resistance.
(c)成分
(c)成分は、1分子中に少なくとも1個の反応性官能
基を有するオルガノポリシロキサンである。Component (c) Component (c) is an organopolysiloxane having at least one reactive functional group in one molecule.
この(c)成分としては、例えば(c)′一般式R’
II S 10 (4−m) y□ (式中、R“は炭
素数1〜8の有機基を示し、aは1.1〜1.8である
)で表される構造単位を有し、かつケイ素原子に結合し
た反応性官能基である一〇X′基(ここで、X′は水素
原子または炭素数1〜5のアルキル基を示す)を1個以
上有するオルガノポリシロキサンを挙げることができる
。As this component (c), for example, (c)' general formula R'
II S 10 (4-m) y□ (wherein R" represents an organic group having 1 to 8 carbon atoms, and a is 1.1 to 1.8), and organopolysiloxanes having one or more 10X' groups (where X' represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms) which are reactive functional groups bonded to a silicon atom. can.
かかる(c)′一般式のR“は、炭素数1〜8の有機基
であり、例えばメチル基、エチル基、プロピル基などの
アルキル基、そのほかγ−クロロプロピル基、ビニル基
、3,3.3−トリフロロプロピル基、γ−グリシドキ
シプロビル基、T−メタクリルオキシプロピル基、T−
メルカプトプロピル基、フェニル基、3,4−エポキシ
シクロヘキシルエチル基、T−アミノプロピル基などを
挙げることができ、このうちメチル基およびフェニル基
が好ましい。R'' in the general formula (c)' is an organic group having 1 to 8 carbon atoms, such as an alkyl group such as a methyl group, an ethyl group, or a propyl group, as well as a γ-chloropropyl group, a vinyl group, or a 3,3-carbon group. .3-trifluoropropyl group, γ-glycidoxypropyl group, T-methacryloxypropyl group, T-
Examples include a mercaptopropyl group, a phenyl group, a 3,4-epoxycyclohexylethyl group, a T-aminopropyl group, and among these, a methyl group and a phenyl group are preferred.
また、(c)′一般式R“a S i Ou−m、/z
(7) aは、1.1−1.8、好ましくは1.2〜
1.6の範囲であり、1.1未満では組成物のコーティ
ング塗膜にクラックが発生する場合があり、一方1.8
を超えると塗膜が硬化しにくい場合がある。In addition, (c)' general formula R"a S i Ou-m, /z
(7) a is 1.1-1.8, preferably 1.2-1.8
If it is less than 1.1, cracks may occur in the coating film of the composition;
If it exceeds this, the coating film may be difficult to cure.
さらに、かかる(c)成分には、ケイ素原子に結合した
一〇X′基などの反応性官能基を1個以上、好ましくは
3〜30個有するものである。Furthermore, the component (c) has one or more, preferably 3 to 30, reactive functional groups such as 10X' groups bonded to silicon atoms.
ココで、−〇X′基のX′は、水素原子または炭素数1
〜5のアルキル基、例えばメチル基、エチル基、プロピ
ル基、ブチル基などが挙げられる。Here, X' of -〇X' group is a hydrogen atom or a carbon number 1
-5 alkyl groups, such as methyl, ethyl, propyl, butyl, and the like.
前記(c1成分に反応性官能基が存在しないと、硬化反
応が充分に進行しない。If a reactive functional group is not present in the component (c1), the curing reaction will not proceed sufficiently.
以上のような(e)成分の具体例としては、東芝シリコ
ーン■製、シリコーンワニスTSR160、TSR16
5、TSR3168;)−レシリコーン■製、シリコー
ンワニス5H60/8、Ql−37;信越化学工業■製
、シリコーン中間体KR211、KR−212、KR−
213、KR−214、KR−216、KR−218な
どが挙げられる。Specific examples of the above component (e) include silicone varnish TSR160 and TSR16 manufactured by Toshiba Silicone ■.
5, TSR3168;) - manufactured by Resilicone ■, silicone varnish 5H60/8, Ql-37; manufactured by Shin-Etsu Chemical ■, silicone intermediate KR211, KR-212, KR-
213, KR-214, KR-216, KR-218, and the like.
(c1成分の組成物中における割合は、(a) + (
b) + (c)の合計100重量部中、10〜80重
量部、好ましくは15〜70重量部であり、10重量部
未満では得られる塗膜の耐アルカリが不充分であり、一
方80重量部を超えると得られる塗膜の硬度が低下する
。(The ratio of c1 component in the composition is (a) + (
b) + (c) in a total of 100 parts by weight, 10 to 80 parts by weight, preferably 15 to 70 parts by weight; if it is less than 10 parts by weight, the resulting coating film will have insufficient alkali resistance; If the amount exceeds 50%, the hardness of the resulting coating film will decrease.
なお、本発明の組成物は、前記(a)′一般式RnS
i (OR’ ) 4−fiで表されるアルコキシシ
ランを用いる場合には、水を含有させることが好ましい
。In addition, the composition of the present invention has the above-mentioned (a)' general formula RnS
When using an alkoxysilane represented by i (OR' ) 4-fi, it is preferable to contain water.
この場合の水の量は、前記(a)′成分が5t(OR’
)。In this case, the amount of water is 5t (OR') of the component (a)'.
).
で表されるテトラアルコキシシランの場合は、このテト
ラアルコキシシランの2倍モル以上、また(a)′成分
がR3i (OR’):+で表されるアルコキシシラ
ンの場合は、このアルコキシシランの1.5倍モル以上
が適当である。In the case of a tetraalkoxysilane represented by: 2 times the mole or more of this tetraalkoxysilane, and in the case of an alkoxysilane where component (a)' is represented by R3i (OR'):+, 1 mole of this alkoxysilane .5 times the mole or more is appropriate.
この水は、アルコキシシランあ縮合により消費されるが
、調製後の組成物中における水の割合は、(a)成分を
アルコキシシラン換算で100重量部に対して、80重
量部以下であることが好ましく、80重量部を超えると
組成物の保存安定性が低下する傾向がある。This water is consumed by alkoxysilane condensation, but the proportion of water in the prepared composition should be 80 parts by weight or less per 100 parts by weight of component (a) in terms of alkoxysilane. Preferably, if it exceeds 80 parts by weight, the storage stability of the composition tends to decrease.
さらに、本発明の組成物は、親水性有機溶媒を含有させ
ることが好ましい。Furthermore, the composition of the present invention preferably contains a hydrophilic organic solvent.
この親水性有機溶媒は、主として(a)〜(c)成分を
均一に混合させ、かつ(a)〜fc)成分の濃度を調整
し、本発明の組成物の固形分を調整すると同時に、種々
の塗装方法に適用させ、組成物の分散安定性および保存
安定性を向上させるためのものである。This hydrophilic organic solvent mainly mixes components (a) to (c) uniformly, adjusts the concentration of components (a) to fc), and at the same time adjusts the solid content of the composition of the present invention. The present invention is intended to improve the dispersion stability and storage stability of the composition.
かかる親水性有機溶媒としては、例えばメタノール、エ
タノール、プロピルアルコール、ブチルアルコール、エ
チレングリコール、ジエチレングリコール、トリエチレ
ングリコール、エチレングリコールモノブチルエーテル
、酢酸エチレングリコールモノエチルエーテルなどのア
ルコール類、アセトン、メチルエチルケトン、テトラヒ
ドロフランなどの沸点が120℃以下の低沸点親水性有
機溶剤を挙げることができる。Examples of such hydrophilic organic solvents include alcohols such as methanol, ethanol, propyl alcohol, butyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monobutyl ether, and acetic acid ethylene glycol monoethyl ether, acetone, methyl ethyl ketone, and tetrahydrofuran. Examples include low-boiling hydrophilic organic solvents having a boiling point of 120°C or less.
これらの親水性有機溶媒のうち、好ましくはi−プロピ
ルアルコール、5ec−ブチルアルコール、n−プロピ
ルアルコール、n−ブチルアルコール、ジエチレングリ
コール、エチレングリコールモノブチルエーテル、酢酸
エチレングリコールモノエチルエーテルなどのアルコー
ル類であり、特に好ましくはi−プロピルアルコールお
よび酢酸エチレングリコールモノエチルエーテルである
。Among these hydrophilic organic solvents, alcohols such as i-propyl alcohol, 5ec-butyl alcohol, n-propyl alcohol, n-butyl alcohol, diethylene glycol, ethylene glycol monobutyl ether, and acetic acid ethylene glycol monoethyl ether are preferable. , particularly preferred are i-propyl alcohol and acetic acid ethylene glycol monoethyl ether.
本発明の組成物は、前記(a)〜(c)成分を含有して
なるが、その全固形分濃度は、好ましくは10〜50重
量%、特に好ましくは15〜35重量%であり、10重
量%未満では固形分濃度が薄すぎて得られる組成物をコ
ーティングに供することにより形成される塗膜の耐熱性
、耐水性、耐薬品性、耐候性などの緒特性が発現されな
い場合があり、また形成される塗膜にピンホールが発生
する場合があり、一方50重量%を超えると固形分濃度
が高すぎて組成物の保存安定性が悪化したり、組成物を
コーティングに供しても均一な塗膜の形成が困難となる
などの弊害が生起する場合がある。The composition of the present invention contains the above-mentioned components (a) to (c), and the total solid concentration thereof is preferably 10 to 50% by weight, particularly preferably 15 to 35% by weight, and 10 to 10% by weight. If it is less than % by weight, the solid content concentration is too low and the coating film formed by coating the resulting composition may not exhibit the properties such as heat resistance, water resistance, chemical resistance, and weather resistance. In addition, pinholes may occur in the coating film that is formed.On the other hand, if it exceeds 50% by weight, the solid content concentration will be too high and the storage stability of the composition will deteriorate, and even if the composition is coated, it will not be uniform. In some cases, adverse effects such as difficulty in forming a coating film may occur.
なお、本発明の組成物には、必要に応じてその他の充填
剤を添加することも可能である。In addition, it is also possible to add other fillers to the composition of the present invention as needed.
かかる充填剤は、水に不溶性のものであり、例えば有機
顔料もしくは無機顔料を挙げることができる。Such fillers are water-insoluble and include, for example, organic or inorganic pigments.
また、顔料以外の粒子状または繊維状の金属および合金
ならびにこれらの酸化物、水酸化物、炭化物、窒化物、
硫化物など、具体例として粒子状もしくは繊維状の鉄、
銅、アルミニウム、ニッケル、銀、亜鉛、フェライト、
カーボンブランク、ステンレス鋼、酸化ケイ素、酸化チ
タン、酸化アルミニウム、酸化クロム、酸化マンガン、
酸化鉄、酸化ジルコニウム、酸化コバルト、合成ムライ
ト、ジルコン(ケイ酸ジルコニウム)、水酸化アルミニ
ウム、水酸化鉄、炭化ケイ素、窒化ケイ素、窒化ホウ素
、二硫化モリブデンなどを挙げることができる。In addition, particulate or fibrous metals and alloys other than pigments, and their oxides, hydroxides, carbides, nitrides,
Sulfides, specific examples include particulate or fibrous iron,
copper, aluminum, nickel, silver, zinc, ferrite,
Carbon blank, stainless steel, silicon oxide, titanium oxide, aluminum oxide, chromium oxide, manganese oxide,
Examples include iron oxide, zirconium oxide, cobalt oxide, synthetic mullite, zircon (zirconium silicate), aluminum hydroxide, iron hydroxide, silicon carbide, silicon nitride, boron nitride, and molybdenum disulfide.
これらの充填剤の平均粒径または平均長さは、通常、0
.05〜50μm、好ましくは0.1〜5μmであり、
0605μm未満では組成物の粘度が上昇したり、目的
とする膜厚が達成できない場合があり、一方50μmを
超えると得られる組成物の分散性が悪化する傾向がある
。The average particle size or average length of these fillers is usually 0
.. 05 to 50 μm, preferably 0.1 to 5 μm,
If it is less than 0.605 μm, the viscosity of the composition may increase or the desired film thickness may not be achieved, while if it exceeds 50 μm, the dispersibility of the resulting composition tends to deteriorate.
必要に応じて使用される充填剤の組成物中の割合は、+
a)成分をアルコキシシラン換算で100重量部に対し
て、通常、5〜500重量部、好ましくは10〜300
重量部であり、5重量部未満であると充填剤が組成物に
付与する性能を充分に発揮することができず、一方50
0重量部を超えると得られる組成物がゲル化することが
あり、またコーティングに供することにより得られる塗
膜の硬度が悪化するとともに基材への密着性が悪化する
。The proportion of fillers used if necessary in the composition is +
Usually 5 to 500 parts by weight, preferably 10 to 300 parts by weight of component a) per 100 parts by weight in terms of alkoxysilane.
If the amount is less than 5 parts by weight, the performance imparted by the filler to the composition cannot be fully exhibited;
If the amount exceeds 0 parts by weight, the resulting composition may gel, and the hardness of the coating film obtained by coating will deteriorate, as well as the adhesion to the substrate.
なお、必要に応じて使用される充填剤の選択は、得られ
る塗膜の目的によって、例えば下記選択に基づいて行う
。Incidentally, the filler to be used as necessary is selected depending on the purpose of the coating film to be obtained, for example, based on the following selection.
■防蝕膜を作るための充填剤としては、酸化ケイ素、酸
化チタン、酸化アルミニウム、酸化クロム、酸化ジルコ
ニウム、合成ムライト、ジルコン、炭化ケイ素、窒化ケ
イ素などを使用する。■Silicon oxide, titanium oxide, aluminum oxide, chromium oxide, zirconium oxide, synthetic mullite, zircon, silicon carbide, silicon nitride, etc. are used as fillers for making corrosion-resistant films.
■電気絶縁膜を作るための充填剤としては、アルカリ金
属を含まない電気絶縁性の金属酸化物、炭化物または窒
化物を使用する。■As a filler for making an electrically insulating film, use electrically insulating metal oxides, carbides, or nitrides that do not contain alkali metals.
■化粧膜を作るための充填剤としては、酸化鉄、酸化チ
タン、酸化コバルト、酸化亜鉛、酸化スズ、酸化鉛、酸
化アルミニウムなどの酸化物を使用する。■Oxides such as iron oxide, titanium oxide, cobalt oxide, zinc oxide, tin oxide, lead oxide, and aluminum oxide are used as fillers to create the decorative film.
■熱放射膜を作るための充填剤としては、酸化鉄、酸化
銅、酸化コバルト、酸化マンガン、酸化クロム、酸化ケ
イ素、酸化チタン、酸化アルミニウム、ジルコンなどの
酸化物を使用する。■Oxides such as iron oxide, copper oxide, cobalt oxide, manganese oxide, chromium oxide, silicon oxide, titanium oxide, aluminum oxide, and zircon are used as fillers for making the heat radiation film.
■導電膜または半導電膜を作るための充填剤としては、
銅、アルミニウム、ニッケル、銀、カーボンブラック、
酸化スズなどを使用する。■As fillers for making conductive or semiconductive films,
copper, aluminum, nickel, silver, carbon black,
Use tin oxide, etc.
■断熱膜を作るための充填剤としては、熱伝導率の小さ
い金属酸化物、水酸化物、窒化物などを使用する。■Metal oxides, hydroxides, nitrides, etc. with low thermal conductivity are used as fillers to create the heat insulating film.
■防錆膜を作るための充填剤としては、亜鉛、鉛、クロ
ムなどを使用する。■Zinc, lead, chromium, etc. are used as fillers to create the anti-rust film.
■そのほか、各種充填剤の持つ特性を活かした塗膜を作
るためには、前記例示の充填剤を2種以上を併用するこ
とができる。(2) In addition, two or more of the above-mentioned fillers can be used in combination in order to create a coating film that takes advantage of the characteristics of various fillers.
また、本発明の組成物をより速(硬化させるにあたって
は、硬化促進剤を使用してもよく、比較的低い温度で硬
化させるためには、硬化促進剤を併用する方が効果的で
ある。Further, in order to cure the composition of the present invention more rapidly, a curing accelerator may be used, and in order to cure the composition at a relatively low temperature, it is more effective to use a curing accelerator in combination.
かかる硬化促進剤としては、水酸化ナトリウム、水酸化
カリウムなどのアルカリ性化合物;アルキルチタン酸、
リン酸、p−トルエンスルホン酸、フタル酸などの酸性
化合物;エチレンジアミン、ヘキサンジアミン、ジエチ
レントリアミン、トリエチレンテトラミン、テトラエチ
レンペンタミン、ピペリジン、ピペラジン、メタフェニ
レンジアミン、エタノールアミン類、トリエチルアミン
、エポキシ樹脂の硬化剤として用いられる各種変性アミ
ンなどのアミン化合物;γ−アミノプロピルトリエトキ
シシラン、γ−(2−アミノエチル)−アミノプロビル
トリメトキシシラン、r−(2−アミノエチル)−アミ
ノプロピルメチルジメトキシシラン、T−アニリノプロ
ピルトリメトキシシランなどのアミン系シランカップリ
ング剤−;(c4H9)Z Sn (OCOC++H
zz)z、(ca H9) z S n (OCOCH
= CHCOOCH:l ) z、(c4H9)2 S
n (S CHt Coo)、(c4HJz S
n (S CHz COOCa Hlt)
z 、(c4H9’)−3n=S
などの有機スズ化合物;
(c4Hq )25nO1(cs H+t)zS n
O−。Such curing accelerators include alkaline compounds such as sodium hydroxide and potassium hydroxide; alkyl titanic acids,
Acidic compounds such as phosphoric acid, p-toluenesulfonic acid, and phthalic acid; curing of ethylenediamine, hexanediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, piperidine, piperazine, metaphenylenediamine, ethanolamines, triethylamine, and epoxy resins Amine compounds such as various modified amines used as agents; γ-aminopropyltriethoxysilane, γ-(2-aminoethyl)-aminopropyltrimethoxysilane, r-(2-aminoethyl)-aminopropylmethyldimethoxysilane , T-anilinopropyltrimethoxysilane and other amine-based silane coupling agents; (c4H9)Z Sn (OCOC++H
zz) z, (ca H9) z S n (OCOCH
= CHCOOCH:l ) z, (c4H9)2S
n (S CHt Coo), (c4HJz S
n (S CHz COOCa Hlt)
Organotin compounds such as z, (c4H9')-3n=S; (c4Hq)25nO1(cs H+t)zS n
O-.
(c,Hq )SnOl(cB Hlt) sn。(c, Hq) SnOl (cB Hlt) sn.
などの有機スズオキサイドとエチルシリケート、エチル
シリケート40、マレイン酸ジメチル、マレイン酸ジエ
チル、フタル酸ジオクチルなどのエステル化合物との反
応生成物;トリイソプロポキシアルミニウム、トリ5e
c−ブトキシアルミニウム、テトラブトキシジルコニウ
ムなどの金属アルコキシド;アルミニウム、ジルコニウ
ムなどの金属アルコキシドとアセチルアセトン、エチル
アセトアセテートなどのキレート化物などが使用される
。Reaction products of organic tin oxides such as ethyl silicate, ethyl silicate 40, dimethyl maleate, diethyl maleate, dioctyl phthalate; triisopropoxyaluminum, tri5e
Metal alkoxides such as c-butoxyaluminum and tetrabutoxyzirconium; chelates of metal alkoxides such as aluminum and zirconium and chelates such as acetylacetone and ethylacetoacetate are used.
これらの硬化促進剤の組成物中における割合は、本発明
の組成物の固形分100重量部に対して、通常、50重
量部以下、好ましくは30重量部以下用いられる。The proportion of these curing accelerators in the composition is usually 50 parts by weight or less, preferably 30 parts by weight or less, based on 100 parts by weight of the solid content of the composition of the present invention.
なお、本発明の組成物には、各種界面活性剤、前記以外
のシランカフプリング剤、チタンカップリング剤、また
ナフテン酸、オクチル酸、亜硝酸、亜硫酸、アルミン酸
、炭酸などのアルカリ金属塩、染料などの添加剤を添加
することもできる。The composition of the present invention includes various surfactants, silane cuff pulling agents other than those mentioned above, titanium coupling agents, and alkali metal salts such as naphthenic acid, octylic acid, nitrous acid, sulfite, aluminic acid, and carbonic acid. Additives such as dyes can also be added.
さらに、本発明の組成物中には、前記親水性有機溶媒以
外の有機溶剤を含有させることができ、かかる有機溶剤
としては、前記+a)〜(c)成分の沈澱が生起しない
溶剤であればどのようなものでもよく、一般の塗料、コ
ーティング剤などに用いられる脂肪族炭化水素類、芳香
族炭化水素類、ハロゲン化炭化水素類、ケトン類、エス
テル類、エーテル類、ケトンエーテル類、ケトンエステ
ル類、エステルエーテル類などを挙げることができる。Furthermore, the composition of the present invention may contain an organic solvent other than the above-mentioned hydrophilic organic solvent, and such an organic solvent may be any solvent that does not cause precipitation of the above-mentioned +a) to (c) components. Any substance may be used, including aliphatic hydrocarbons, aromatic hydrocarbons, halogenated hydrocarbons, ketones, esters, ethers, ketone ethers, and ketone esters used in general paints, coatings, etc. and ester ethers.
これらの有機溶剤は、本発明の組成物の固形分100重
量部に対し、通常、300重量部以下程度使用される。These organic solvents are usually used in an amount of about 300 parts by weight or less based on 100 parts by weight of the solid content of the composition of the present invention.
以上のようなfa)〜(c)成分を含有する本発明の組
成物は、例えばまず(伺前記(a)成分の出発物質とな
る(a)′アルコキシシラン、(b)成分、(c)成分
、水および親水性有機溶媒を混合して加水分解および縮
合を行う。The composition of the present invention containing components fa) to (c) as described above can be prepared by, for example, first containing (a)'alkoxysilane, which is the starting material for component (a), component (b), and component (c). The components, water and a hydrophilic organic solvent are mixed to perform hydrolysis and condensation.
ここで、(伺工程は、前記(a)′〜(c)成分、なら
びに必要に応じて水および親水性有機溶媒を混合して攪
拌下に、温度10〜70’c、好ましくは20〜60℃
、時間1〜10時間、好ましくは2〜8時間程度の条件
で実施される。Here, (in the listening step, the components (a) to (c), and if necessary, water and a hydrophilic organic solvent are mixed and stirred at a temperature of 10 to 70 °C, preferably 20 to 60 °C. ℃
, for a period of 1 to 10 hours, preferably 2 to 8 hours.
次いで、(ロ)さらに必要に応じ、前記親水性有機溶媒
により所定の固形分濃度に希釈される。Next, (b) it is further diluted with the hydrophilic organic solvent to a predetermined solid content concentration, if necessary.
さらに、塗布前に(ハ)必要に応じて前記硬化促進剤を
添加するものである。Furthermore, (c) the curing accelerator is added as necessary before coating.
なお、(a)〜(c)成分を含有する本発明の組成物の
製造方法において、前記充填剤などを配合する場合には
、前記(a)′〜(c)成分および前記充填剤を混合し
て前記(伺工程を行い、次いで(ロ)工程、さらに(ハ
)工程を実施するが、あるいは充填剤を(伺工程終了後
、(ロ)工程において別途添加してもよい。In addition, in the method for producing the composition of the present invention containing components (a) to (c), when blending the filler etc., the components (a)' to (c) and the filler are mixed. Then, the above-mentioned (inquiry step) is carried out, followed by (b) step, and then (c) step. Alternatively, a filler may be added separately in (b) step after the (inquiry step) is completed.
本発明の組成物は、対象物である基材の表面に刷毛、ス
プレー、デイ・ノビングなどの塗装手段により、1回塗
りで厚さ5〜50μm程度、2〜3回の塗装で厚さ10
〜150μm程度の塗膜を形成することができ、室温〜
300℃程度の温度で10分〜12時間程度放置し、乾
燥することにより硬い塗膜を形成することが可能である
。The composition of the present invention can be applied to the surface of the target substrate by a coating method such as brushing, spraying, or day nobbing, to a thickness of about 5 to 50 μm in one coat, and to a thickness of 10 μm in two to three coats.
A coating film of ~150 μm can be formed at room temperature ~
It is possible to form a hard coating film by leaving it at a temperature of about 300° C. for about 10 minutes to about 12 hours and drying it.
本発明の組成物がコーティングされる基材としては、例
えばステンレス、アルミニウム、セラミックス、セメン
ト、紙、ガラス、プラスチックなどが挙げられる。Examples of substrates to be coated with the composition of the present invention include stainless steel, aluminum, ceramics, cement, paper, glass, and plastic.
以下、実施例を挙げ、本発明をさらに具体的に説明する
が、以下の実施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples.
なお、実施例中、部および%は、特に断らな6s限り重
量基準である。In the examples, parts and percentages are based on weight unless otherwise specified.
また、実施例中の各種評価は、以下の試験方法に従った
。Moreover, various evaluations in Examples were conducted according to the following test methods.
■保存安定性は、ポリエチレン製ビン中で硬化促進剤を
添加せずに密栓保存し、目視によりゲル化の有無を判定
し、ゲルが発生する時間を測定した。(2) Storage stability was determined by storing the sample in a polyethylene bottle tightly sealed without adding a curing accelerator, visually determining the presence or absence of gelation, and measuring the time it took for gelation to occur.
■耐水性は、水道水に常温で60日間浸漬し、塗膜の状
態を観察した。(2) Water resistance was determined by immersing the film in tap water at room temperature for 60 days and observing the state of the coating film.
■耐沸騰水性は、水道水で8時間煮沸し、塗膜の状態を
観察した。■ Boiling water resistance was determined by boiling in tap water for 8 hours and observing the state of the coating film.
■硬度は、JIS K5400による鉛筆硬度に拠っ
た。■Hardness was based on pencil hardness according to JIS K5400.
■耐候性は、Jl、S K5400により、ウェザ−
メーターで2,000時間照射試験を実施し、塗膜の状
態を観察した。■Weather resistance is determined by Jl, S K5400.
A 2,000 hour irradiation test was conducted using a meter, and the state of the coating film was observed.
■耐薬品性は、5%水酸化ナトリウム水溶液を塗膜上に
1−滴下し、蓋付きのシャーレ中で1日静置したのち水
洗し、塗膜の状態を観察した。(2) Chemical resistance was determined by adding one drop of a 5% aqueous sodium hydroxide solution onto the coating film, allowing it to stand for one day in a petri dish with a lid, washing with water, and observing the condition of the coating film.
■可使時間は、ポリエチレン製ビン中で硬化促進剤を添
加して密栓保存し、目視によりゲル化の有無を判定し、
ゲルが発生する時間を測定した。■Pot life is determined by adding a hardening accelerator in a polyethylene bottle, storing it in a tightly capped container, and visually determining the presence or absence of gelation.
The time for gel formation was measured.
なお、前記試験方法により測定した判定基準は、下記記
号に拠った。Note that the criteria measured by the above test method were based on the following symbols.
O;全く異状なし。O: No abnormality at all.
△;一部に剥離、錆の発生、侵蝕などが観察された。△: Peeling, rust formation, corrosion, etc. were observed in some parts.
×;はとんどまたは全部が、剥離、錆の発生、侵蝕など
が観察された。x: Peeling, rust formation, corrosion, etc. were observed in most or all of the samples.
実施例1
還流冷却器、攪拌機を備えた反応器に、(a)′メチル
トリメト主299フ65部、山)成分(固形分濃度;6
0%、溶媒;キシレン、鐘淵工業■製、ゼムラック)5
5部、(c)成分(東芝シリコーン■製、シリコーンワ
ニスTSR3168)30部をi−プロピルアルコール
100部に溶解して’11したのち、i−プロピルアル
コール140部と水10部を添加し、室温で2時間反応
させて、第1表に示すコーティング用組成物■を得た。Example 1 Into a reactor equipped with a reflux condenser and a stirrer, (a) 65 parts of 299 ml of main methyltrimeth, 65 parts of (solid content concentration;
0%, solvent: xylene, Kanebuchi Kogyo ■, Zemlac) 5
5 parts, 30 parts of component (c) (manufactured by Toshiba Silicone ■, silicone varnish TSR3168) was dissolved in 100 parts of i-propyl alcohol, and then 140 parts of i-propyl alcohol and 10 parts of water were added, and the mixture was heated to room temperature. The mixture was reacted for 2 hours to obtain coating composition (2) shown in Table 1.
前記と同様の操作により、(a)′オルガノアルコキシ
シラン、(bl成分の種類および量、(c)成分の種類
および量を第1表に示したように変えてコーティング用
組成物■〜[株]を得た。By the same operation as above, coating compositions ■ to [Co., Ltd. ] was obtained.
さらに、コーティング用組成物■400部に、ケイ酸ジ
ルコニウム80部および二酸化チタン3部を加えてコー
ティング用組成!l1FOを得た。Furthermore, 80 parts of zirconium silicate and 3 parts of titanium dioxide were added to 400 parts of coating composition (1) to create a coating composition! I1FO was obtained.
比較例1
実施例1と同様の操作で、第1表に示す組成のコーティ
ング用組成物@〜0を得た。Comparative Example 1 In the same manner as in Example 1, a coating composition @~0 having the composition shown in Table 1 was obtained.
試験例1
前記実施例1で得られたコーティング用組成物■〜[相
]および比較例1で得られたコーティング用組成物@〜
[相]に、第2表に示す各種の硬化促進剤を添加し、も
しくは添加せずに、それぞれ下記テストピースA〜Cに
エアースプレーガンを用いて乾燥塗膜で10μmとなる
ように塗布し、室温〜150℃の温度で硬化塗膜を形成
させた。Test Example 1 Coating composition ~ [phase] obtained in Example 1 and coating composition @~ obtained in Comparative Example 1
[Phase] was coated with or without the addition of various curing accelerators shown in Table 2 to the following test pieces A to C using an air spray gun to give a dry film thickness of 10 μm. A cured coating film was formed at a temperature of room temperature to 150°C.
テストピースA;スレート板(JSRAテストピースC
;テストピースAにコーティング用組成物■を乾燥塗膜
で40μm塗布し、150℃で30分間加熱処理したも
の。Test piece A: Slate board (JSRA test piece C
Test piece A was coated with coating composition (4) in a dry film thickness of 40 μm, and heat-treated at 150° C. for 30 minutes.
テストピースC;テストピースAに無機質コ−ティング
用組成物(日本合成ゴム■製、グラス力EIIOI)を
、テストピースBと同様に塗布し、加熱乾燥したもの。Test piece C: An inorganic coating composition (manufactured by Nippon Gosei Gomu, Glass Riki EIIOI) was applied to test piece A in the same manner as test piece B, and then heated and dried.
これらの硬化塗膜についての結果を第2表に示す。The results for these cured coatings are shown in Table 2.
試験例2
試験例1において、テストピースを下記D−Fのテスト
ピースに代えた以外は、試験例1と同様の操作で塗膜を
形成させた。Test Example 2 A coating film was formed in the same manner as in Test Example 1, except that the test piece was replaced with the test piece D-F below.
テストピースD;アルミニウム板(JISH4000S
A1050P)
テストピースE;テストピースDにコーティング用組成
物■を乾燥塗膜で40μm塗布し、150℃で30分間
加熱乾燥したもの。Test piece D: Aluminum plate (JISH4000S
A1050P) Test piece E: Coating composition (1) was applied to test piece D to a dry film thickness of 40 μm and dried by heating at 150° C. for 30 minutes.
テストピースF;テストピースDに無itコーティング
用組成物(日本合成ゴム■製、グラス力EIIOI)を
、テストピースEと同様に塗布し、加熱乾燥したもの。Test piece F: A non-IT coating composition (manufactured by Japan Synthetic Rubber ■, Glass Power EIIOI) was applied to test piece D in the same manner as test piece E, and then dried by heating.
これらの硬化塗膜についての結果を第3表に示す。The results for these cured coatings are shown in Table 3.
本発明のコーティング用組成物は、(a)成分、(′b
)成分および+C)成分の3成分を含む組成物であり、
保存安定性に優れ、低温で硬化させることができ、得ら
れる塗膜は特に耐アルカリ性を大幅に改善することが可
能である。しかも、本発明の組成物より得られる塗膜は
、硬度が高く、平滑性の良い外観を呈し、優れた耐候性
、耐水性、耐沸謄水性、耐熱性、耐透水性、耐有機薬品
性、耐溶剤性、耐汚染性を有し、かつ基材との密着性に
も優れている。The coating composition of the present invention comprises component (a), ('b
A composition containing three components: component ) and component +C),
It has excellent storage stability, can be cured at low temperatures, and the resulting coating film can significantly improve alkali resistance in particular. Moreover, the coating film obtained from the composition of the present invention has high hardness, a smooth appearance, and excellent weather resistance, water resistance, boiling water resistance, heat resistance, water permeability resistance, and organic chemical resistance. , solvent resistance, stain resistance, and excellent adhesion to substrates.
また、必要に応じて充填剤を含有させたものは、充填剤
の種類により各種機能を付与された塗膜とすることが可
能である。Furthermore, if a filler is added as necessary, it is possible to obtain a coating film with various functions depending on the type of filler.
特許出願人 日本合成ゴム株式会社 代理人 弁理士 白 井 重 隆Patent applicant: Japan Synthetic Rubber Co., Ltd. Agent: Patent Attorney Takashi Shirai
Claims (2)
(式中、Rは炭素数1〜8の有機基、R′は炭素数1〜
5のアルキル基または炭素数1〜4のアシル基を示し、
nは0または1である)で表されるアルコキシシラン、
該アルコキシシランの加水分解物および/または部分的
縮合物をアルコキシシラン換算で10〜80重量部、 (b)末端あるいは側鎖に加水分解性基と結合したケイ
素原子を有するシリル基を重合体1分子中に少なくとも
1個有するビニル系樹脂10〜80重量部、ならびに (c)1分子中に少なくとも1個の反応性官能基を有す
るオルガノポリシロキサン10〜80重量部(ただし、
(a)+(b)+(c)=100重量部)を含有するこ
とを特徴とするコーティング用組成物。(1) (a) General formula R_nSi(OR')_4_-_n
(In the formula, R is an organic group having 1 to 8 carbon atoms, and R' is an organic group having 1 to 8 carbon atoms.
5 alkyl group or an acyl group having 1 to 4 carbon atoms,
an alkoxysilane represented by n is 0 or 1),
10 to 80 parts by weight of the hydrolyzate and/or partial condensate of the alkoxysilane in terms of alkoxysilane; (b) polymer 1 containing a silyl group having a silicon atom bonded to a hydrolyzable group at the terminal or side chain; 10 to 80 parts by weight of a vinyl resin having at least one in the molecule, and (c) 10 to 80 parts by weight of an organopolysiloxane having at least one reactive functional group in one molecule (however,
(a)+(b)+(c)=100 parts by weight).
−_a_)_/_2(式中、R″は炭素数1〜8の有機
基を示し、aは1.1〜1.8である)で表される構造
単位を有し、かつケイ素原子に結合した反応性官能基を
有するオルガノポリシロキサンである特許請求の範囲第
1項記載のコーティング用組成物。(2) The component (c) has the general formula R″_aSiO_(_4_
-_a_)_/_2 (in the formula, R'' represents an organic group having 1 to 8 carbon atoms, and a is 1.1 to 1.8), and has a silicon atom A coating composition according to claim 1, which is an organopolysiloxane having attached reactive functional groups.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62271824A JP2759178B2 (en) | 1987-10-29 | 1987-10-29 | Composition for coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62271824A JP2759178B2 (en) | 1987-10-29 | 1987-10-29 | Composition for coating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01115966A true JPH01115966A (en) | 1989-05-09 |
JP2759178B2 JP2759178B2 (en) | 1998-05-28 |
Family
ID=17505363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62271824A Expired - Lifetime JP2759178B2 (en) | 1987-10-29 | 1987-10-29 | Composition for coating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2759178B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001081404A (en) * | 1999-09-17 | 2001-03-27 | Jsr Corp | Coating composition and cured material |
WO2005100495A1 (en) * | 2004-04-12 | 2005-10-27 | Daikin Industries, Ltd. | Antifouling coating composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5491546A (en) * | 1977-12-29 | 1979-07-20 | Kanegafuchi Chem Ind Co Ltd | Cold-setting composition |
JPS6044552A (en) * | 1983-08-23 | 1985-03-09 | Dainippon Ink & Chem Inc | Resin composition having improved shelf stability |
JPS6047076A (en) * | 1983-08-25 | 1985-03-14 | Dainippon Ink & Chem Inc | Room temperature curing paint resin composition |
JPS62158767A (en) * | 1986-01-08 | 1987-07-14 | Nippon Shokubai Kagaku Kogyo Co Ltd | Water-based coating agent |
-
1987
- 1987-10-29 JP JP62271824A patent/JP2759178B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5491546A (en) * | 1977-12-29 | 1979-07-20 | Kanegafuchi Chem Ind Co Ltd | Cold-setting composition |
JPS6044552A (en) * | 1983-08-23 | 1985-03-09 | Dainippon Ink & Chem Inc | Resin composition having improved shelf stability |
JPS6047076A (en) * | 1983-08-25 | 1985-03-14 | Dainippon Ink & Chem Inc | Room temperature curing paint resin composition |
JPS62158767A (en) * | 1986-01-08 | 1987-07-14 | Nippon Shokubai Kagaku Kogyo Co Ltd | Water-based coating agent |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001081404A (en) * | 1999-09-17 | 2001-03-27 | Jsr Corp | Coating composition and cured material |
WO2005100495A1 (en) * | 2004-04-12 | 2005-10-27 | Daikin Industries, Ltd. | Antifouling coating composition |
Also Published As
Publication number | Publication date |
---|---|
JP2759178B2 (en) | 1998-05-28 |
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