JPH01115575A - Lapping grinding wheel - Google Patents
Lapping grinding wheelInfo
- Publication number
- JPH01115575A JPH01115575A JP27184887A JP27184887A JPH01115575A JP H01115575 A JPH01115575 A JP H01115575A JP 27184887 A JP27184887 A JP 27184887A JP 27184887 A JP27184887 A JP 27184887A JP H01115575 A JPH01115575 A JP H01115575A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- whetstones
- grindstone
- bond
- lap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 238000000465 moulding Methods 0.000 claims abstract 2
- 239000005011 phenolic resin Substances 0.000 claims description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims 1
- 230000003252 repetitive effect Effects 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はラップ砥石に関し、鏡面仕上用ラップ砥石に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a lap grindstone, and more particularly to a lap grindstone for mirror finishing.
[従来の技術]
一般に、この種のラップ砥石は、微粒子砥石をボンドで
結合することにより製造されるが、従来、微粒子砥石を
結合しているボンドには、一種類のボンドしか使用され
ていない、このボンドには、例えば、フェノール系樹脂
またはエポキシ系樹脂が使用されている。[Prior Art] Generally, this type of lap grinding wheel is manufactured by bonding fine grain grinding wheels together with a bond, but conventionally, only one type of bond has been used for bonding the fine grain grinding wheels together. For example, phenolic resin or epoxy resin is used for this bond.
[発明が解決しようとする問題点1
しかしながら、ボンドとしてフェノール系樹脂またはエ
ポキシ系樹脂を用いたラップ砥石の場合、使用中に目詰
りが発生し易い、この理由は、研削に作用する刃の凹凸
が少なく、空孔が小さいので、切扮の逃げる道がなく、
冷却水も十分砥石の周辺に浸透し難いためである。[Problem to be solved by the invention 1 However, in the case of lap grindstones using phenolic resin or epoxy resin as bond, clogging occurs easily during use.The reason for this is the unevenness of the blade that acts on grinding. Since there are few holes and the holes are small, there is no way for Kiri to escape.
This is because it is difficult for the cooling water to sufficiently penetrate around the grindstone.
本発明の目的は、目詰りなしで繰返し鏡面加工が出来る
ラップ砥石を提供することにある。An object of the present invention is to provide a lap grindstone that can repeatedly perform mirror polishing without clogging.
[問題点を解決するための手段]
本発明によるラップ砥石は、微粒子砥石をフェノール系
樹脂又はエポキシ系樹脂等の比較的硬い第1の樹脂から
成る第1のボンドを用いて結合することにより得られた
粒状の砥石を、前記第1の樹脂より軟らかいウレタン系
樹脂等の第2の樹脂から成る第2のボンドを用いて成型
焼成してなる。[Means for Solving the Problems] The lap grindstone according to the present invention is obtained by bonding a fine grain grindstone using a first bond made of a relatively hard first resin such as a phenolic resin or an epoxy resin. The resulting granular grindstone is molded and fired using a second bond made of a second resin, such as a urethane resin, which is softer than the first resin.
[作用]
本発明では、1つのラップ砥石に硬軟2種類のボンドを
使用している。I&初に、比較的硬いフェノール系樹脂
又はエポキシ系樹脂等の第1の樹脂から成る第1のボン
ドで、微粒子砥石を結合して粒状の砥石を作製する。こ
の製法には、通常の砥石の製法で砥石を作り、この砥石
を粉砕してふるいを通して造粒してもよい0次に、この
粒状の砥石を第1の樹脂より軟らかいウレタン系樹脂等
の第2の樹脂から成る第2のボンドで更に通常の砥石の
製法と同じ方法でラップ砥石を製造する。[Function] In the present invention, two types of bonds, hard and soft, are used in one lap grindstone. First, a particulate grindstone is bonded with a first bond made of a relatively hard first resin such as a phenolic resin or an epoxy resin to produce a granular grindstone. This manufacturing method involves making a whetstone using a normal whetstone manufacturing method, crushing this whetstone and passing it through a sieve to make granules. Using the second bond made of the resin No. 2, a lap whetstone is further manufactured in the same manner as a normal whetstone.
−aに、フェノール系樹脂又はエポキシ系樹脂のボンド
の場合、約200℃で焼成し、ウレタン系樹脂のボンド
の場合、それより低温の150℃位で処理するため、後
者の処理で第1の樹脂が変質することはない。-a, in the case of phenolic resin or epoxy resin bonds, it is fired at about 200°C, and in the case of urethane resin bonds, it is processed at a lower temperature of about 150°C, so in the latter process, the first The resin will not change in quality.
このような構成のラップ砥石は、ウレタン系樹脂(PV
A)のボンドによる多孔性と弾力性により、フェノール
系樹脂又はエポキシ系樹脂のボンドのみを使用した砥石
の無孔性と剛性の欠点を補い、ドレッサー無しで目詰り
がなく、繰返し鏡面加工が出来る。ここで、被加工物の
仕上面は、微粒子砥石の粒径で決り、造粒の大きさには
殆ど影響しない。A lap grindstone with such a configuration is made of urethane resin (PV
The porosity and elasticity of the bond in A) compensates for the lack of porosity and rigidity of grinding wheels that use only phenolic resin or epoxy resin bonds, and allows repeated mirror polishing without clogging without a dresser. . Here, the finished surface of the workpiece is determined by the grain size of the fine grain grindstone, and has little effect on the size of the granules.
[実施例] 以下、本発明の実施例について説明する。[Example] Examples of the present invention will be described below.
微粒子砥石として、平均粒径2μmの酸化セリウムを用
い、この酸化セリウムを第1の樹脂としてのフェノール
樹脂で均一に被覆後、0.1關〜0.5關の径に造粒し
焼成して粒状の砥石を得た。Cerium oxide with an average particle size of 2 μm is used as a fine-grain grindstone, and after uniformly coating this cerium oxide with phenol resin as the first resin, it is granulated to a diameter of 0.1 to 0.5 and fired. A granular whetstone was obtained.
この粒状の砥石を、第2の樹脂としてのウレタン系樹脂
であるポリビニルアルコール(PVA)をボンドとして
、外径300關、厚さ15IwlIのラップ砥石を作製
した。このラップ砥石を、よく知られたラップマスタ式
の片面ラップ定盤に使用した。This granular whetstone was bonded with polyvinyl alcohol (PVA), which is a urethane resin as a second resin, to produce a lap whetstone having an outer diameter of 300mm and a thickness of 15mm. This lap grinding wheel was used in the well-known Lap Master type single-sided lap surface plate.
本発明者は、このラップ砥石と、同一の微粒子砥石を使
用し、同−砥粒率でフェノール樹脂をボンドとして、よ
く知られた方法で作製された従来のラップ砥石との研削
ラッピングの比教試験を行った。ここで、ラッピング加
工条件としては、被加工物にガラス(BK−7>を使用
し、定盤(ラップ砥石)の回転数を100 r、p、i
、、荷重を600 gr/−1水のみを滴下し、加工し
た。被加工物としては、大きさがφ10x t 5のガ
ラス板を用い、第1図に示されるように、このガラス板
1を貼付台兼錘2に放射状に接着剤3で4個張付けな。The present inventor has compared the grinding and lapping process between this lap whetstone and a conventional lap whetstone manufactured by a well-known method using the same fine-grain whetstone and the same abrasive grain ratio and using phenolic resin as a bond. The test was conducted. Here, as the lapping processing conditions, glass (BK-7> is used as the workpiece, and the number of rotations of the surface plate (lap grindstone) is 100 r, p, i.
,,The load was 600 gr/-1 and only water was dropped and processed. As the workpiece, a glass plate having a size of φ10 x t5 is used, and as shown in FIG. 1, four of the glass plates 1 are pasted radially on a mounting table and weight 2 with an adhesive 3.
加工量は、貼付台兼錘2の面を基準としてガラス板1の
減耗を測定した。The amount of processing was determined by measuring the wear of the glass plate 1 using the surface of the attachment table and weight 2 as a reference.
試験片(ガラス板1)としては、50ツト(4X5=2
0個)を使用した。GC’ 200(1)遊離砥粒を用
いて試験片の前加工を行った。As a test piece (glass plate 1), 50 pieces (4X5=2
0 pieces) were used. The specimens were pre-processed using GC' 200(1) free abrasive.
第2図にその試験結果を示す。図中、4で示される実線
が本発明のラップ砥石を用いた加工量、5で示される破
線が従来のラップ砥石を用いた加工量を表している。こ
の第2図から明らかなように、本発明のラップ砥石は連
続50ツト加工しても、加工量(ラッピングレート)が
変わっていない、即ち、目詰りが起っていない。これに
対して、従来のラップ砥石は、20ツト以降徐々に加工
量が小となり、砥石に目詰りが発生していることが分る
。尚、加工面として、表面粗さRaがいずれも0.02
μ以下の表面をもつものが得られた。Figure 2 shows the test results. In the figure, the solid line denoted by 4 represents the amount of machining using the lap grindstone of the present invention, and the broken line denoted by 5 represents the amount of machining using the conventional lap whetstone. As is clear from FIG. 2, the amount of processing (lapping rate) of the lapping grindstone of the present invention does not change even after 50 continuous processings, that is, no clogging occurs. On the other hand, with the conventional lap grindstone, the amount of machining gradually decreases after 20 points, indicating that the grindstone is becoming clogged. In addition, the surface roughness Ra of the machined surfaces is 0.02.
A material with a surface of less than μ was obtained.
尚、上記実施例では、第1の樹脂としてフェノール樹脂
を用いているが、エポキシ系樹脂を用いても良い。In addition, in the above embodiment, a phenol resin is used as the first resin, but an epoxy resin may also be used.
[発明の効果]
以上の説明で明らかなように、本発明によれば、目詰り
なしで繰返し鏡面加工が出来るという効果があるゆ[Effects of the Invention] As is clear from the above explanation, the present invention has the effect of repeatedly performing mirror finishing without clogging.
第1図は本発明および従来のラップ砥石を用いてラッピ
ング加工する場合の試料(被加工’h>の保持方法を示
す図、第2図は第1図に示された状態で保持された試料
を本発明および従来のラップ砥石を用いてラッピング加
工した時の累積加工時間(分)と各ロヅトの加工量(μ
)の関係を表した図である。
1・・・被加工物(ガラス板)、2・・・貼付台兼錘、
3・・・接着剤、4・・・本発明のラップ砥石を用いた
加工量、5・・・従来のラップ砥石を用いた加工量。
第1図
第2図
票椙加工哨問Figure 1 is a diagram showing how to hold a sample (workpiece 'h>) when lapped using the present invention and a conventional lapping grindstone, and Figure 2 is a sample held in the state shown in Figure 1. The cumulative machining time (minutes) and the machining amount of each rod (μ
) is a diagram showing the relationship between 1... Workpiece (glass plate), 2... Pasting stand and weight,
3... Adhesive, 4... Processing amount using the lap grindstone of the present invention, 5... Processing amount using the conventional lap grindstone. Figure 1 Figure 2 Sheet processing inspection
Claims (1)
ボンドを用いて結合することにより得られた粒状の砥石
を、前記第1の樹脂より軟らかい第2の樹脂から成る第
2のボンドを用いて成型焼成してなるラップ砥石。 2、前記第1の樹脂がフェノール系樹脂で、前記第2の
樹脂がウレタン系樹脂である特許請求の範囲第1項記載
のラップ砥石。 3、前記第1の樹脂がエポキシ系樹脂で、前記第2の樹
脂がウレタン系樹脂である特許請求の範囲第1項記載の
ラップ砥石。[Scope of Claims] 1. A granular grindstone obtained by bonding a fine-grain grindstone using a first bond made of a relatively hard first resin is bonded to a second resin that is softer than the first resin. A lap whetstone formed by molding and firing using a second bond consisting of. 2. The lap grindstone according to claim 1, wherein the first resin is a phenolic resin and the second resin is a urethane resin. 3. The lap grindstone according to claim 1, wherein the first resin is an epoxy resin and the second resin is a urethane resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27184887A JPH01115575A (en) | 1987-10-29 | 1987-10-29 | Lapping grinding wheel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27184887A JPH01115575A (en) | 1987-10-29 | 1987-10-29 | Lapping grinding wheel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01115575A true JPH01115575A (en) | 1989-05-08 |
Family
ID=17505720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27184887A Pending JPH01115575A (en) | 1987-10-29 | 1987-10-29 | Lapping grinding wheel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01115575A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2740716A1 (en) * | 1995-11-08 | 1997-05-09 | Lam Plan Sa | RODOIR AND MANUFACTURING METHOD THEREOF |
WO2003055958A1 (en) * | 2001-12-21 | 2003-07-10 | Dynea Canada, Ltd. | Abrasive composition containing organic particles for chemical mechanical planarization |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50101989A (en) * | 1974-01-14 | 1975-08-12 | ||
JPS6080564A (en) * | 1983-10-06 | 1985-05-08 | Mitsubishi Metal Corp | Grinding wheel |
-
1987
- 1987-10-29 JP JP27184887A patent/JPH01115575A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50101989A (en) * | 1974-01-14 | 1975-08-12 | ||
JPS6080564A (en) * | 1983-10-06 | 1985-05-08 | Mitsubishi Metal Corp | Grinding wheel |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2740716A1 (en) * | 1995-11-08 | 1997-05-09 | Lam Plan Sa | RODOIR AND MANUFACTURING METHOD THEREOF |
EP0773088A1 (en) * | 1995-11-08 | 1997-05-14 | Lam-Plan | Hone and manufacturing of the same |
WO2003055958A1 (en) * | 2001-12-21 | 2003-07-10 | Dynea Canada, Ltd. | Abrasive composition containing organic particles for chemical mechanical planarization |
US6620215B2 (en) | 2001-12-21 | 2003-09-16 | Dynea Canada, Ltd. | Abrasive composition containing organic particles for chemical mechanical planarization |
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