JPH01115253U - - Google Patents
Info
- Publication number
- JPH01115253U JPH01115253U JP1988011002U JP1100288U JPH01115253U JP H01115253 U JPH01115253 U JP H01115253U JP 1988011002 U JP1988011002 U JP 1988011002U JP 1100288 U JP1100288 U JP 1100288U JP H01115253 U JPH01115253 U JP H01115253U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element mounting
- mounting portion
- lead frame
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/884—
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- H10W72/931—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011002U JPH01115253U (enExample) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011002U JPH01115253U (enExample) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115253U true JPH01115253U (enExample) | 1989-08-03 |
Family
ID=31219170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011002U Pending JPH01115253U (enExample) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115253U (enExample) |
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1988
- 1988-01-28 JP JP1988011002U patent/JPH01115253U/ja active Pending