JPH01115153A - 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 - Google Patents

半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法

Info

Publication number
JPH01115153A
JPH01115153A JP27286487A JP27286487A JPH01115153A JP H01115153 A JPH01115153 A JP H01115153A JP 27286487 A JP27286487 A JP 27286487A JP 27286487 A JP27286487 A JP 27286487A JP H01115153 A JPH01115153 A JP H01115153A
Authority
JP
Japan
Prior art keywords
pins
pin
alloy
support
arrayal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27286487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583188B2 (enExample
Inventor
Yoshiaki Shimojo
下城　義秋
Iwane Matsushita
松下　岩根
Tetsuo Toizume
戸井詰　哲郎
Masakazu Umeda
梅田　正和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Proterial Ltd
Original Assignee
Kyocera Corp
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, Sumitomo Special Metals Co Ltd filed Critical Kyocera Corp
Priority to JP27286487A priority Critical patent/JPH01115153A/ja
Publication of JPH01115153A publication Critical patent/JPH01115153A/ja
Publication of JPH0583188B2 publication Critical patent/JPH0583188B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP27286487A 1987-10-28 1987-10-28 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 Granted JPH01115153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27286487A JPH01115153A (ja) 1987-10-28 1987-10-28 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27286487A JPH01115153A (ja) 1987-10-28 1987-10-28 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPH01115153A true JPH01115153A (ja) 1989-05-08
JPH0583188B2 JPH0583188B2 (enExample) 1993-11-25

Family

ID=17519831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27286487A Granted JPH01115153A (ja) 1987-10-28 1987-10-28 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPH01115153A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459102A (en) * 1993-02-19 1995-10-17 Ngk Spark Plug Co., Ltd. Method of electroplating lead pins of integrated circuit package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459102A (en) * 1993-02-19 1995-10-17 Ngk Spark Plug Co., Ltd. Method of electroplating lead pins of integrated circuit package
US5580432A (en) * 1993-02-19 1996-12-03 Ngk Spark Plug Co., Ltd. Jig for electroplating lead pins of an integrated circuit package

Also Published As

Publication number Publication date
JPH0583188B2 (enExample) 1993-11-25

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