JPH01112599U - - Google Patents
Info
- Publication number
- JPH01112599U JPH01112599U JP769388U JP769388U JPH01112599U JP H01112599 U JPH01112599 U JP H01112599U JP 769388 U JP769388 U JP 769388U JP 769388 U JP769388 U JP 769388U JP H01112599 U JPH01112599 U JP H01112599U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tetracyanoxydimethane
- complex
- type electronic
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 7
- 239000012790 adhesive layer Substances 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 claims 2
- KXAVXNWSOPHOON-UHFFFAOYSA-N 1-butylisoquinoline Chemical compound C1=CC=C2C(CCCC)=NC=CC2=C1 KXAVXNWSOPHOON-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP769388U JPH046159Y2 (fi) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP769388U JPH046159Y2 (fi) | 1988-01-26 | 1988-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01112599U true JPH01112599U (fi) | 1989-07-28 |
JPH046159Y2 JPH046159Y2 (fi) | 1992-02-20 |
Family
ID=31212919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP769388U Expired JPH046159Y2 (fi) | 1988-01-26 | 1988-01-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH046159Y2 (fi) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0364256U (fi) * | 1989-06-02 | 1991-06-24 | ||
WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
JPH0436998A (ja) * | 1990-05-31 | 1992-02-06 | Shin Etsu Polymer Co Ltd | トップテープフィルム |
JPH0532288A (ja) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | チツプ型電子部品包装用カバーテープ |
JPH0594188U (ja) * | 1992-05-25 | 1993-12-21 | アキレス株式会社 | 電子部品包装用導電性キャリアテープ |
-
1988
- 1988-01-26 JP JP769388U patent/JPH046159Y2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0364256U (fi) * | 1989-06-02 | 1991-06-24 | ||
WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
JPH0436998A (ja) * | 1990-05-31 | 1992-02-06 | Shin Etsu Polymer Co Ltd | トップテープフィルム |
JPH0532288A (ja) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | チツプ型電子部品包装用カバーテープ |
JPH0594188U (ja) * | 1992-05-25 | 1993-12-21 | アキレス株式会社 | 電子部品包装用導電性キャリアテープ |
Also Published As
Publication number | Publication date |
---|---|
JPH046159Y2 (fi) | 1992-02-20 |
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