JPH0110923Y2 - - Google Patents
Info
- Publication number
- JPH0110923Y2 JPH0110923Y2 JP2060284U JP2060284U JPH0110923Y2 JP H0110923 Y2 JPH0110923 Y2 JP H0110923Y2 JP 2060284 U JP2060284 U JP 2060284U JP 2060284 U JP2060284 U JP 2060284U JP H0110923 Y2 JPH0110923 Y2 JP H0110923Y2
- Authority
- JP
- Japan
- Prior art keywords
- main shaft
- gripper
- utility
- model registration
- semiconductor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 6
- 230000000452 restraining effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2060284U JPS60133629U (ja) | 1984-02-17 | 1984-02-17 | 半導体材料の水切乾燥用回転装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2060284U JPS60133629U (ja) | 1984-02-17 | 1984-02-17 | 半導体材料の水切乾燥用回転装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60133629U JPS60133629U (ja) | 1985-09-06 |
| JPH0110923Y2 true JPH0110923Y2 (US20020095090A1-20020718-M00002.png) | 1989-03-29 |
Family
ID=30511245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2060284U Granted JPS60133629U (ja) | 1984-02-17 | 1984-02-17 | 半導体材料の水切乾燥用回転装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60133629U (US20020095090A1-20020718-M00002.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0528760Y2 (US20020095090A1-20020718-M00002.png) * | 1985-09-18 | 1993-07-23 | ||
| JPH0616504B2 (ja) * | 1988-02-25 | 1994-03-02 | 島田理化工業株式会社 | 両面洗浄装置における保持爪開閉装置 |
-
1984
- 1984-02-17 JP JP2060284U patent/JPS60133629U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60133629U (ja) | 1985-09-06 |
