JPH01107152U - - Google Patents
Info
- Publication number
- JPH01107152U JPH01107152U JP228888U JP228888U JPH01107152U JP H01107152 U JPH01107152 U JP H01107152U JP 228888 U JP228888 U JP 228888U JP 228888 U JP228888 U JP 228888U JP H01107152 U JPH01107152 U JP H01107152U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- die island
- sip type
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のＳＩＰ型半導体装
置の平面模式図、第２図は他の実施例のＳＩＰ型
半導体装置の平面模試図、第３図は従来のＳＩＰ
型半導体装置の平面模試図である。
Ａ，Ｂ…ＳＩＰ型半導体装置、３…ダイアイラ
ンド、４…吊り部、５…リード、５１…インナー
リード、５１ａ…先端部、５２…外部リード、６
…パツケージ樹脂部、７…ダイアイランド、８…
吊り部、９…リード、９１…インナーリード、９
１ａ…先端部、９２…外部リード、１０…パツケ
ージ樹脂部。
FIG. 1 is a schematic plan view of a SIP type semiconductor device according to one embodiment of the present invention, FIG. 2 is a schematic plan view of a SIP type semiconductor device according to another embodiment, and FIG.
2 is a plan view of a type semiconductor device; FIG. A, B...SIP type semiconductor device, 3...Die island, 4...Hanging part, 5...Lead, 51...Inner lead, 51a...Tip part, 52...External lead, 6
...Package resin part, 7...Die island, 8...
Hanging part, 9...Lead, 91...Inner lead, 9
1a...Tip part, 92...External lead, 10...Package resin part.
Claims (1)
アイランドの周辺に配置される複数のインナーリ
ードの各先端部とをワイヤボンデイングによつて
接続し、全体を樹脂パツケージして成るＳＩＰ型
半導体装置において、 上記各インナーリードの先端部を、上記ダイア
イランドの平面の中心を直交して通る２本の中心
線の各々に対して対称となるように配置したこと
を特徴とするＳＩＰ型半導体装置。 (2) 上記ダイアイランドが、対応する平行の縁
部に一対の吊り部を有し、該両吊り部の先端を上
記パツケージの外側に各々導出するようにしたこ
とを特徴とする実用新案登録請求の範囲第１項記
載のＳＩＰ型半導体装置。[Claims for Utility Model Registration] (1) A chip mounted on a die island and each tip of a plurality of inner leads arranged around the die island are connected by wire bonding, and the whole is packaged in a resin package. In the SIP type semiconductor device, the tip of each inner lead is arranged symmetrically with respect to each of two center lines passing perpendicularly through the center of the plane of the die island. SIP type semiconductor device. (2) A request for registration of a utility model characterized in that the die island has a pair of hanging parts on corresponding parallel edges, and the tips of both hanging parts are respectively led out to the outside of the package cage. The SIP type semiconductor device according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP228888U JPH01107152U (en) | 1988-01-12 | 1988-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP228888U JPH01107152U (en) | 1988-01-12 | 1988-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107152U true JPH01107152U (en) | 1989-07-19 |
Family
ID=31506166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP228888U Pending JPH01107152U (en) | 1988-01-12 | 1988-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107152U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571051A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
| JPS57208166A (en) * | 1981-06-17 | 1982-12-21 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS58225641A (en) * | 1982-06-23 | 1983-12-27 | Nec Corp | Manufacture of casting mold |
| JPS5957464A (en) * | 1982-09-27 | 1984-04-03 | Mitsubishi Electric Corp | Semiconductor device |
-
1988
- 1988-01-12 JP JP228888U patent/JPH01107152U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571051A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
| JPS57208166A (en) * | 1981-06-17 | 1982-12-21 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPS58225641A (en) * | 1982-06-23 | 1983-12-27 | Nec Corp | Manufacture of casting mold |
| JPS5957464A (en) * | 1982-09-27 | 1984-04-03 | Mitsubishi Electric Corp | Semiconductor device |