JPH01107150U - - Google Patents
Info
- Publication number
- JPH01107150U JPH01107150U JP70288U JP70288U JPH01107150U JP H01107150 U JPH01107150 U JP H01107150U JP 70288 U JP70288 U JP 70288U JP 70288 U JP70288 U JP 70288U JP H01107150 U JPH01107150 U JP H01107150U
- Authority
- JP
- Japan
- Prior art keywords
- molded resin
- lead frame
- sealed package
- sealed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP70288U JPH01107150U (ru) | 1988-01-06 | 1988-01-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP70288U JPH01107150U (ru) | 1988-01-06 | 1988-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107150U true JPH01107150U (ru) | 1989-07-19 |
Family
ID=31199961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP70288U Pending JPH01107150U (ru) | 1988-01-06 | 1988-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107150U (ru) |
-
1988
- 1988-01-06 JP JP70288U patent/JPH01107150U/ja active Pending