JPH01107144U - - Google Patents
Info
- Publication number
- JPH01107144U JPH01107144U JP1988001407U JP140788U JPH01107144U JP H01107144 U JPH01107144 U JP H01107144U JP 1988001407 U JP1988001407 U JP 1988001407U JP 140788 U JP140788 U JP 140788U JP H01107144 U JPH01107144 U JP H01107144U
- Authority
- JP
- Japan
- Prior art keywords
- exterior case
- semiconductor device
- output terminal
- input
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001407U JPH01107144U (fr) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001407U JPH01107144U (fr) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107144U true JPH01107144U (fr) | 1989-07-19 |
Family
ID=31201265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988001407U Pending JPH01107144U (fr) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107144U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195421A (ja) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | 半導体モジュール |
| WO2018087890A1 (fr) * | 2016-11-11 | 2018-05-17 | 三菱電機株式会社 | Dispositif à semiconducteur, onduleur, et automobile |
-
1988
- 1988-01-08 JP JP1988001407U patent/JPH01107144U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195421A (ja) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | 半導体モジュール |
| WO2018087890A1 (fr) * | 2016-11-11 | 2018-05-17 | 三菱電機株式会社 | Dispositif à semiconducteur, onduleur, et automobile |
| JPWO2018087890A1 (ja) * | 2016-11-11 | 2019-06-24 | 三菱電機株式会社 | 半導体装置、インバータユニット及び自動車 |
| CN109952639A (zh) * | 2016-11-11 | 2019-06-28 | 三菱电机株式会社 | 半导体装置、逆变器单元及汽车 |
| US10770376B2 (en) | 2016-11-11 | 2020-09-08 | Mitsubishi Electric Corporation | Semiconductor device, inverter unit and automobile |
| CN109952639B (zh) * | 2016-11-11 | 2023-06-27 | 三菱电机株式会社 | 半导体装置、逆变器单元及汽车 |