JPH01107144U - - Google Patents
Info
- Publication number
- JPH01107144U JPH01107144U JP1988001407U JP140788U JPH01107144U JP H01107144 U JPH01107144 U JP H01107144U JP 1988001407 U JP1988001407 U JP 1988001407U JP 140788 U JP140788 U JP 140788U JP H01107144 U JPH01107144 U JP H01107144U
- Authority
- JP
- Japan
- Prior art keywords
- exterior case
- semiconductor device
- output terminal
- input
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第1図は本考案の電力半導体装置の一実施例の
断面図、第2図は同実施例の要部拡大図、第3図
は従来例の断面図である。
1…基板、2…内部回路部品、3…入出力端子
、4…外装ケース、7…位置決め支持部。
FIG. 1 is a cross-sectional view of an embodiment of the power semiconductor device of the present invention, FIG. 2 is an enlarged view of the main part of the same embodiment, and FIG. 3 is a cross-sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Internal circuit component, 3... Input/output terminal, 4... Exterior case, 7... Positioning support part.
Claims (1)
半導体装置において、上記外装ケースの内壁に入
出力端子の位置決め支持部を設けたことを特徴と
する電力半導体装置。 1. A power semiconductor device of a cast resin-sealed type equipped with an exterior case, characterized in that a positioning support for an input/output terminal is provided on an inner wall of the exterior case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988001407U JPH01107144U (en) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988001407U JPH01107144U (en) | 1988-01-08 | 1988-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01107144U true JPH01107144U (en) | 1989-07-19 |
Family
ID=31201265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988001407U Pending JPH01107144U (en) | 1988-01-08 | 1988-01-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01107144U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017195421A (en) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | Semiconductor module |
WO2018087890A1 (en) * | 2016-11-11 | 2018-05-17 | 三菱電機株式会社 | Semiconductor device, inverter unit, and automobile |
-
1988
- 1988-01-08 JP JP1988001407U patent/JPH01107144U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017195421A (en) * | 2014-09-30 | 2017-10-26 | 株式会社三社電機製作所 | Semiconductor module |
WO2018087890A1 (en) * | 2016-11-11 | 2018-05-17 | 三菱電機株式会社 | Semiconductor device, inverter unit, and automobile |
JPWO2018087890A1 (en) * | 2016-11-11 | 2019-06-24 | 三菱電機株式会社 | Semiconductor device, inverter unit and automobile |
CN109952639A (en) * | 2016-11-11 | 2019-06-28 | 三菱电机株式会社 | Semiconductor device, inverter unit and automobile |
US10770376B2 (en) | 2016-11-11 | 2020-09-08 | Mitsubishi Electric Corporation | Semiconductor device, inverter unit and automobile |
CN109952639B (en) * | 2016-11-11 | 2023-06-27 | 三菱电机株式会社 | Semiconductor device, inverter unit, and automobile |