JPH01107144U - - Google Patents

Info

Publication number
JPH01107144U
JPH01107144U JP1988001407U JP140788U JPH01107144U JP H01107144 U JPH01107144 U JP H01107144U JP 1988001407 U JP1988001407 U JP 1988001407U JP 140788 U JP140788 U JP 140788U JP H01107144 U JPH01107144 U JP H01107144U
Authority
JP
Japan
Prior art keywords
exterior case
semiconductor device
output terminal
input
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988001407U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988001407U priority Critical patent/JPH01107144U/ja
Publication of JPH01107144U publication Critical patent/JPH01107144U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の電力半導体装置の一実施例の
断面図、第2図は同実施例の要部拡大図、第3図
は従来例の断面図である。 1…基板、2…内部回路部品、3…入出力端子
、4…外装ケース、7…位置決め支持部。
FIG. 1 is a cross-sectional view of an embodiment of the power semiconductor device of the present invention, FIG. 2 is an enlarged view of the main part of the same embodiment, and FIG. 3 is a cross-sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Internal circuit component, 3... Input/output terminal, 4... Exterior case, 7... Positioning support part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外装ケースを備えた注型樹脂封止タイプの電力
半導体装置において、上記外装ケースの内壁に入
出力端子の位置決め支持部を設けたことを特徴と
する電力半導体装置。
1. A power semiconductor device of a cast resin-sealed type equipped with an exterior case, characterized in that a positioning support for an input/output terminal is provided on an inner wall of the exterior case.
JP1988001407U 1988-01-08 1988-01-08 Pending JPH01107144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988001407U JPH01107144U (en) 1988-01-08 1988-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988001407U JPH01107144U (en) 1988-01-08 1988-01-08

Publications (1)

Publication Number Publication Date
JPH01107144U true JPH01107144U (en) 1989-07-19

Family

ID=31201265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988001407U Pending JPH01107144U (en) 1988-01-08 1988-01-08

Country Status (1)

Country Link
JP (1) JPH01107144U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017195421A (en) * 2014-09-30 2017-10-26 株式会社三社電機製作所 Semiconductor module
WO2018087890A1 (en) * 2016-11-11 2018-05-17 三菱電機株式会社 Semiconductor device, inverter unit, and automobile

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017195421A (en) * 2014-09-30 2017-10-26 株式会社三社電機製作所 Semiconductor module
WO2018087890A1 (en) * 2016-11-11 2018-05-17 三菱電機株式会社 Semiconductor device, inverter unit, and automobile
JPWO2018087890A1 (en) * 2016-11-11 2019-06-24 三菱電機株式会社 Semiconductor device, inverter unit and automobile
CN109952639A (en) * 2016-11-11 2019-06-28 三菱电机株式会社 Semiconductor device, inverter unit and automobile
US10770376B2 (en) 2016-11-11 2020-09-08 Mitsubishi Electric Corporation Semiconductor device, inverter unit and automobile
CN109952639B (en) * 2016-11-11 2023-06-27 三菱电机株式会社 Semiconductor device, inverter unit, and automobile

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