JPH01107130U - - Google Patents
Info
- Publication number
- JPH01107130U JPH01107130U JP1988001050U JP105088U JPH01107130U JP H01107130 U JPH01107130 U JP H01107130U JP 1988001050 U JP1988001050 U JP 1988001050U JP 105088 U JP105088 U JP 105088U JP H01107130 U JPH01107130 U JP H01107130U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- semiconductor pellets
- holding
- semiconductor
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001050U JPH01107130U (enExample) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001050U JPH01107130U (enExample) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107130U true JPH01107130U (enExample) | 1989-07-19 |
Family
ID=31200600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988001050U Pending JPH01107130U (enExample) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107130U (enExample) |
-
1988
- 1988-01-08 JP JP1988001050U patent/JPH01107130U/ja active Pending
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