JPH01104028U - - Google Patents
Info
- Publication number
- JPH01104028U JPH01104028U JP19819087U JP19819087U JPH01104028U JP H01104028 U JPH01104028 U JP H01104028U JP 19819087 U JP19819087 U JP 19819087U JP 19819087 U JP19819087 U JP 19819087U JP H01104028 U JPH01104028 U JP H01104028U
- Authority
- JP
- Japan
- Prior art keywords
- block
- runner
- resin
- cavity
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198190U JPH058677Y2 (https=) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198190U JPH058677Y2 (https=) | 1987-12-25 | 1987-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104028U true JPH01104028U (https=) | 1989-07-13 |
| JPH058677Y2 JPH058677Y2 (https=) | 1993-03-04 |
Family
ID=31488711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987198190U Expired - Lifetime JPH058677Y2 (https=) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058677Y2 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5866639U (ja) * | 1981-10-27 | 1983-05-06 | 日本電気株式会社 | 半導体集積回路用樹脂モ−ルド金型 |
-
1987
- 1987-12-25 JP JP1987198190U patent/JPH058677Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5866639U (ja) * | 1981-10-27 | 1983-05-06 | 日本電気株式会社 | 半導体集積回路用樹脂モ−ルド金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058677Y2 (https=) | 1993-03-04 |