JPH01103253A - Supersonic wave vibration polishing or grinding machine - Google Patents
Supersonic wave vibration polishing or grinding machineInfo
- Publication number
- JPH01103253A JPH01103253A JP26079187A JP26079187A JPH01103253A JP H01103253 A JPH01103253 A JP H01103253A JP 26079187 A JP26079187 A JP 26079187A JP 26079187 A JP26079187 A JP 26079187A JP H01103253 A JPH01103253 A JP H01103253A
- Authority
- JP
- Japan
- Prior art keywords
- supersonic wave
- polishing
- polishing plate
- ceramics
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 30
- 239000000463 material Substances 0.000 abstract description 11
- 239000000919 ceramic Substances 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract 4
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、高脆性材料の表面を研磨または研削する高能
率、高精度のサーフェス研磨盤または研削盤に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a highly efficient and highly accurate surface polishing machine or grinding machine for polishing or grinding the surface of highly brittle materials.
高脆性材料の表面を研磨または研削する装置は、従来、
金属材料等の加工に用いる装置をそのまま用い、ラッピ
ング剤または砥石として高脆性材料に適合するものを選
定して使用していた。Conventionally, equipment for polishing or grinding the surface of highly brittle materials is
Equipment used for processing metal materials, etc. was used as is, and a lapping agent or grindstone suitable for highly brittle materials was selected and used.
セラミックスなどの高脆性材料は硬質で脆性があり、研
磨または研削しにくく、加工能率が著しく低かった。ま
た加工能率を上げようとすると。Highly brittle materials such as ceramics are hard and brittle and difficult to polish or grind, resulting in significantly low processing efficiency. Also, when trying to increase machining efficiency.
表面精度、例えば表面粗さや平面度を損なうという矛盾
があり、また微細なりラックを生ずるなどの問題がある
。There is a contradiction in that surface accuracy, such as surface roughness and flatness, is impaired, and there are also problems such as fine racks being generated.
本発明は上記実情に鑑み開発されたもので、加工効率が
高く、加工精度が高い研磨または研削加工装置を提供す
ることを目的とする。The present invention was developed in view of the above circumstances, and an object of the present invention is to provide a polishing or grinding device with high processing efficiency and high processing accuracy.
本発明は高脆性材料の研磨盤または研削盤であって、
(1) 回転駆動軸に超音波振動発生装置を内蔵したこ
と
(2) 複数のワーク取付軸を研磨または研削円板上に
揺動自在に配設したこと
(3) ワーク取付軸に超音波振動発生装置を組込んだ
こと
を技術的特徴とする超音波振動研磨または研削盤である
。The present invention is a polishing machine or grinding machine for highly brittle materials, which includes: (1) an ultrasonic vibration generator built into the rotary drive shaft; and (2) a plurality of workpiece mounting shafts oscillating on a polishing or grinding disk. Flexible arrangement (3) This is an ultrasonic vibration polishing or grinding machine whose technical feature is that an ultrasonic vibration generator is built into the workpiece mounting shaft.
上記ワーク取付軸にはワークに代りドレッシング材を取
付けることができる。A dressing material can be attached to the workpiece attachment shaft instead of the workpiece.
本発明は、高脆性材料の研磨または研削に用いられる加
工機であって、超音波振動を付与しながらワークの表面
を研磨または研削するので、加工効率が従来の3〜5倍
に上昇し、表面精度を損なうことなく、高脆性材料の研
磨または研削加工することができ、また高脆性材料にク
ラック等を生じることがない。The present invention is a processing machine used for polishing or grinding highly brittle materials, and since the surface of the workpiece is polished or ground while applying ultrasonic vibration, the machining efficiency is increased 3 to 5 times compared to conventional methods. Highly brittle materials can be polished or ground without impairing surface precision, and cracks or the like will not occur in the highly brittle materials.
@1図は本発明の実施例の研磨盤の(a)は平面図、(
b)は正面縦断面図(第1図(a)のB−B矢視図)、
(c)は側面縦断面図、(第1図(a)のC−C矢視図
)を示すものである。@1 Figures are (a) a plan view and (a) of a polishing machine according to an embodiment of the present invention;
b) is a front longitudinal sectional view (B-B arrow view in Fig. 1(a));
(c) shows a side longitudinal sectional view (view taken along the line CC in FIG. 1(a)).
第1図において、研磨板lは回転駆動部2に支持されて
水平面内を回転する。In FIG. 1, a polishing plate 1 is supported by a rotation drive unit 2 and rotates in a horizontal plane.
回転駆動部2の一実施例の縦断面図を第2図に示す、ケ
ーシング3内に駆動軸4が内蔵され、この駆動軸4には
回転子5と固定子6とから成る回転モータ7が設けられ
ており、軸受8に支持され研磨板lを回転子る0回転軸
4にはまた超音波振動子9が付設されており、スリップ
リング10を介して給電される。超音波振動子は縦振動
を発生し、その振動数は20k)fzとした。なお回転
駆動軸とワーク取付軸に付与する超音波振動は同期して
いてもよく、振動数、位相が異なるものでよい。FIG. 2 shows a vertical cross-sectional view of an embodiment of the rotation drive unit 2. A drive shaft 4 is built into the casing 3, and a rotation motor 7 consisting of a rotor 5 and a stator 6 is mounted on the drive shaft 4. An ultrasonic vibrator 9 is also attached to the zero-rotation shaft 4, which is supported by a bearing 8 and rotates the polishing plate 1, and is supplied with power via a slip ring 10. The ultrasonic vibrator generated longitudinal vibration, and its frequency was 20k) fz. Note that the ultrasonic vibrations applied to the rotational drive shaft and the workpiece mounting shaft may be synchronized or may have different frequencies and phases.
次に、研磨板l上にはワーク21を取付けたワーク取付
部22が複数個配設され、揺動腕23、揺動軸24、揺
動モータ25によって、矢印26のように研磨板!上を
水平に揺動する。Next, a plurality of workpiece mounting portions 22 to which workpieces 21 are attached are arranged on the polishing plate l, and the polishing plate is moved as shown by the arrow 26 by the swinging arm 23, the swinging shaft 24, and the swinging motor 25. swing horizontally above.
ワーク21は研磨板l上に加工面を押し当て、研磨板1
の半径方向にほぼ均一に移動する。The workpiece 21 presses the processed surface onto the polishing plate 1, and
move almost uniformly in the radial direction.
ワーク取付部22の実施例を第3図に示した。An embodiment of the workpiece attachment part 22 is shown in FIG.
ケーシング31内にワーク取付軸32が固定されており
、その先端にワーク保持部33が設けられ、他端に超音
波振動子34が取付けられている。ワーク取付部22は
研磨板l上に少なくとも2個を設け、その−個はドレッ
サーとし、他は取付加工部とすることにより、常時研磨
板の加工面をドレッシングし高い研磨精度を確保するこ
とができる。A workpiece mounting shaft 32 is fixed within the casing 31, a workpiece holding portion 33 is provided at one end thereof, and an ultrasonic vibrator 34 is mounted at the other end. At least two workpiece attachment parts 22 are provided on the polishing plate 1, one of which serves as a dresser, and the others serve as attachment processing parts, thereby ensuring high polishing accuracy by constantly dressing the processing surface of the polishing plate. can.
実施例の超音波振動研磨盤はワークおよび研磨板に超音
波振動を付与するので加工効率が従来の3〜5倍に上昇
した。Since the ultrasonic vibration polishing machine of the example applies ultrasonic vibration to the workpiece and the polishing plate, the processing efficiency was increased 3 to 5 times that of the conventional one.
本発明によれば、高脆性材料の表面の研磨または研削能
率を著しく向上させることができ、微細なりラック等を
生じることなくセラミックス等の加工を容易にする優れ
た効果を奏する。According to the present invention, the polishing or grinding efficiency of the surface of a highly brittle material can be significantly improved, and the excellent effect of facilitating the processing of ceramics, etc., can be achieved without producing fine cracks or the like.
第1図は本発明の実施例の研磨盤の(a)は平面図、(
b)は正面縦断面図(第1図(a)のB−B矢視図)、
(c)は側面縦断面図、(第1図(a)のC−C矢視図
)、第2図はその回転駆動部の縦断面図、第3図はその
ワーク取付部の縦断面図である
1・・・研磨板 2・・・回転駆動部3・・・
ケーシング 4・・・駆動軸5・・・回転子
6・・・固定子7・・・回転モータ 8・・・
軸受9・・・超音波振動子 10・・・スリツープリ
ング21・・・ワーク 22・・・ワーク取付部
23・・・腕 24・・・揺動軸25・・・
揺動モータ 31・・・ケーシング32・・・ワーク
取付軸 33・・・ワーク保持部34・・・超音波振動
子FIG. 1 shows (a) a plan view of a polishing disk according to an embodiment of the present invention, and (
b) is a front longitudinal sectional view (B-B arrow view in Fig. 1(a));
(c) is a side longitudinal cross-sectional view, (view taken along the line C-C in Fig. 1 (a)), Fig. 2 is a longitudinal cross-sectional view of the rotary drive part, and Fig. 3 is a longitudinal cross-sectional view of the workpiece mounting part. 1... Polishing plate 2... Rotation drive unit 3...
Casing 4... Drive shaft 5... Rotor
6... Stator 7... Rotating motor 8...
Bearing 9...Ultrasonic vibrator 10...Three-to-pull ring 21...Work 22...Work mounting portion 23...Arm 24...Swing shaft 25...
Swing motor 31...Casing 32...Workpiece mounting shaft 33...Workpiece holding part 34...Ultrasonic vibrator
Claims (1)
置を内蔵すると共に、複数のワーク取付軸を水平揺動自
在に研磨または研削円板上に配設し、かつ該ワーク取付
軸に超音波振動発生装置を組込んだことを特徴とする超
音波振動研磨または研削盤。1. An ultrasonic vibration generator is built into the rotational drive shaft of the polishing or grinding machine, and multiple workpiece mounting shafts are horizontally oscillatably arranged on the polishing or grinding disk, and the workpiece mounting shafts are equipped with an ultrasonic vibration generator. An ultrasonic vibration polishing or grinding machine characterized by incorporating a vibration generator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62260791A JP2625768B2 (en) | 1987-10-17 | 1987-10-17 | Ultrasonic vibration polishing or grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62260791A JP2625768B2 (en) | 1987-10-17 | 1987-10-17 | Ultrasonic vibration polishing or grinding machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01103253A true JPH01103253A (en) | 1989-04-20 |
JP2625768B2 JP2625768B2 (en) | 1997-07-02 |
Family
ID=17352786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62260791A Expired - Lifetime JP2625768B2 (en) | 1987-10-17 | 1987-10-17 | Ultrasonic vibration polishing or grinding machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2625768B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107363648A (en) * | 2017-08-08 | 2017-11-21 | 北京交通大学 | A kind of ultra-magnetic telescopic ultrasonic vibration burnishing device |
CN109333175A (en) * | 2018-11-08 | 2019-02-15 | 太原理工大学 | A kind of round tube inner wall ultrasonic vibration auxiliary abrasive stream precision finishing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS545160A (en) * | 1977-06-14 | 1979-01-16 | Akira Washida | Shaft sealing device |
JPS61252056A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
JPS61252055A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
-
1987
- 1987-10-17 JP JP62260791A patent/JP2625768B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS545160A (en) * | 1977-06-14 | 1979-01-16 | Akira Washida | Shaft sealing device |
JPS61252056A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
JPS61252055A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107363648A (en) * | 2017-08-08 | 2017-11-21 | 北京交通大学 | A kind of ultra-magnetic telescopic ultrasonic vibration burnishing device |
CN109333175A (en) * | 2018-11-08 | 2019-02-15 | 太原理工大学 | A kind of round tube inner wall ultrasonic vibration auxiliary abrasive stream precision finishing method |
Also Published As
Publication number | Publication date |
---|---|
JP2625768B2 (en) | 1997-07-02 |
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