JPH01100693U - - Google Patents
Info
- Publication number
- JPH01100693U JPH01100693U JP19784487U JP19784487U JPH01100693U JP H01100693 U JPH01100693 U JP H01100693U JP 19784487 U JP19784487 U JP 19784487U JP 19784487 U JP19784487 U JP 19784487U JP H01100693 U JPH01100693 U JP H01100693U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- fixing
- mounted component
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図及び第2図は、本考案の一実施例を説明
する図で、第1図は仮り止め用半田の斜視図、第
2図は仮り止め用半田の実装例の要部側断面図、
第3図は、従来のプリント板へ搭載部品の実装を
説明する要部側断面図である。
図において、1はプリント板、2はスルーホー
ル、3は搭載部品、4はリード、5は仮り止め用
半田、51はリード挿入孔、をそれぞれ示す。
Figures 1 and 2 are diagrams for explaining an embodiment of the present invention, in which Figure 1 is a perspective view of temporary solder, and Figure 2 is a side sectional view of the main part of an example of mounting solder for temporary attachment. ,
FIG. 3 is a side sectional view of a main part explaining mounting of components on a conventional printed board. In the figure, 1 is a printed board, 2 is a through hole, 3 is a mounting component, 4 is a lead, 5 is solder for temporary fixing, and 51 is a lead insertion hole.
Claims (1)
リード4を挿通し、半田付け実装するに際して予
め圧入により上記搭載部品を固定する仮止め用半
田であつて、 上記仮り止め用半田5は中心にリード4を挿入
し得る貫通孔51と、細径側の端部がスルーホー
ル2内に入り込み得る外径の截頭円錐形をしてな
ることを特徴とするプリント板搭載部品の仮り止
め用半田。[Scope of Claim for Utility Model Registration] A solder for temporarily fixing the mounted component by inserting the lead 4 of the mounted component 3 into the through hole 2 of the printed circuit board 1 and fixing the mounted component by press-fitting in advance when soldering and mounting, A printed board characterized in that the fixing solder 5 has a through hole 51 in the center into which the lead 4 can be inserted, and a truncated cone shape with an outer diameter that allows the narrow end to fit into the through hole 2. Solder for temporarily fixing mounted parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19784487U JPH01100693U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19784487U JPH01100693U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01100693U true JPH01100693U (en) | 1989-07-06 |
Family
ID=31488377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19784487U Pending JPH01100693U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01100693U (en) |
-
1987
- 1987-12-25 JP JP19784487U patent/JPH01100693U/ja active Pending
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