JPH01100176U - - Google Patents
Info
- Publication number
- JPH01100176U JPH01100176U JP1987196303U JP19630387U JPH01100176U JP H01100176 U JPH01100176 U JP H01100176U JP 1987196303 U JP1987196303 U JP 1987196303U JP 19630387 U JP19630387 U JP 19630387U JP H01100176 U JPH01100176 U JP H01100176U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- dot matrix
- matrix display
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987196303U JPH01100176U (US20080293856A1-20081127-C00150.png) | 1987-12-24 | 1987-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987196303U JPH01100176U (US20080293856A1-20081127-C00150.png) | 1987-12-24 | 1987-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100176U true JPH01100176U (US20080293856A1-20081127-C00150.png) | 1989-07-05 |
Family
ID=31486927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987196303U Pending JPH01100176U (US20080293856A1-20081127-C00150.png) | 1987-12-24 | 1987-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100176U (US20080293856A1-20081127-C00150.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066132A (ja) * | 2006-09-07 | 2008-03-21 | Sharp Corp | 発光装置及びその発光装置を用いた表示装置 |
| JP2019174807A (ja) * | 2018-03-29 | 2019-10-10 | 群創光電股▲ふん▼有限公司Ｉｎｎｏｌｕｘ Ｃｏｒｐｏｒａｔｉｏｎ | 電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838180B2 (ja) * | 1975-04-26 | 1983-08-20 | フクバコウギヨウ カブシキガイシヤ | ジユウタンソウジキノ カイテンブラシソウジソウチ |
-
1987
- 1987-12-24 JP JP1987196303U patent/JPH01100176U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838180B2 (ja) * | 1975-04-26 | 1983-08-20 | フクバコウギヨウ カブシキガイシヤ | ジユウタンソウジキノ カイテンブラシソウジソウチ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066132A (ja) * | 2006-09-07 | 2008-03-21 | Sharp Corp | 発光装置及びその発光装置を用いた表示装置 |
| JP4711916B2 (ja) * | 2006-09-07 | 2011-06-29 | シャープ株式会社 | 発光装置及びその発光装置を用いた表示装置 |
| JP2019174807A (ja) * | 2018-03-29 | 2019-10-10 | 群創光電股▲ふん▼有限公司Ｉｎｎｏｌｕｘ Ｃｏｒｐｏｒａｔｉｏｎ | 電子装置 |
