JP803H - Method for manufacturing plastic sheet products - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a plastic sheet product by high-frequency adhesion of various plastic sheets, and more specifically, it relates to a method in which an adhesive-free portion and an adhesive-necessary portion are separately provided. The present invention relates to a method for producing a product by simultaneously processing the sheets. <Prior art> Conventionally, when a file is manufactured by high-frequency bonding in various combinations such as a cover made of a plastic sheet and a plurality of bags or a plurality of bags, a bag is bonded to the back side of one cover with a high frequency. Then, stack the required number of bags on the bag adhered to the cover sheet while high-frequency bonding the next bag and the next bag one by one, and then stack the other bag on the final layer. The cover of this is high-frequency bonded. <Problems to be Solved by the Invention> Therefore, unlike the case where the adhered polymers of a plurality of bags are adhered to each other, it is not possible to simultaneously adhere a part having a bonding required part and a part having a bonding unnecessary part at the same time. That is, for example, since the bags are replenished one by one to the cover and the other cover is sequentially bonded to the final bag by high frequency, remarkably time-consuming and inefficient, there is a problem that mass production is impossible. Further, when the bag is high-frequency-bonded to the back side of the cover sheet, heat-bonding marks appear on the surface of the cover sheet. The present invention has been made in view of the above various problems, and an object thereof is to bond a polymer having a bonding unnecessary portion and a polymer having a bonding necessary portion to each other when heating and bonding a plastic sheet, and to bond a complicated shape. The present invention provides a method for adhering a plastic sheet, which is easy to perform and does not have a defective portion of the polymer due to adhesive finish. <Means for Solving the Problems> The present inventor has made various studies to solve the above-mentioned problems, and arranges a non-heat-bondable non-conductor in a bonding unnecessary portion of a plastic sheet, and requires bonding. It was found that complicated adhesion can be achieved at the same time by arranging an insulator and a conductor plate on the part. That is, according to the present invention, in a method of adhering a plastic sheet having a necessary adhesion portion and a non-adhesion portion with a high-frequency welder, a non-conductive adhesive that cannot be heat-adhered is provided on one side corresponding to an electrode by sandwiching the unnecessary plastic sheet. It is characterized by placing an insulator and a conductor plate between the positive electrode plate and the negative electrode plate that face each other with a plastic sheet required for adhesion between them, and applying a high frequency voltage to the bonded part under pressure. It exists in the method of manufacturing plastic sheet products. In the present invention, the above problems can be achieved even if only one of the insulator and the conductor plate is used. Hereinafter, the structure and operation of the present invention will be described in detail based on embodiments. <Embodiment> FIG. 1 is a cross-sectional view showing an example of an array of electrode boards and the like for carrying out the present invention. Conductive plates C that are not connected to the positive and negative electrodes, insulators D'and D used for the purpose of adhering at the time of heating and adhering, and an adhering pressing surface are arranged so that they are sequentially stacked on the negative lower electrode board B. Positive electrode board A above and below,
The non-conductor E and the negative upper electrode plate B'are arranged to face each other.
On the other hand, the polymer Z composed of the sheet units U ² and U ₁ connected by V ¹ is installed between the sheet Z and the non-conductor E via the positive electrode board A, and the sheet units U ⁵ and U ⁴ which need to be adhered , U ³ are arranged via C, D ′ and D respectively, and the whole is pressed into contact with each other. When a high frequency voltage is applied to pressurize and heat the upper electrode board B ′ and the positive electrode board A, which are negative conductors. Since there is a non-conductor E between,
In the meantime, U ^{2 to} U ⁵ are not bonded and the sheet units U ^{1 to} U ⁵ are connected by the bonding positions V ^{1 to} V ⁴ to form a multi-unit polymer Y as shown in FIG. Here first
Even if A and B'in the figure are the same electrode board or B'is an electrode mold which is not connected positively and negatively, B'is removed and non-conductor E is removed.
Even if only alone, the multi-unit polymer shown in FIG. 2 is formed. FIG. 3 shows the polymer Z of the sheet units U ¹ and U ₂ and U ³ and U ₄
The polymer Z ′ is bonded to the polymer Z ′ according to
A polymer Z'consisting of a sheet unit U ³ U ₄ is disposed on the negative lower electrode board B, a conductor plate C is provided inside U ₄ , an insulator D is provided inside U ³ , and a sheet unit U is further provided thereon. Another polymer Z composed of ¹ and U ₂ is arranged, and a mold A having an adhesive surface inside U ² is used as a positive electrode plate, and a non-conductor E is put on one side thereof to be stacked. And a mold A'with an adhesive surface on U ¹ of polymer Z
4 is arranged as a positive electrode plate and pressed against the whole, and when a high frequency voltage is applied to apply pressure and heat, the sheet between A and A'is not adhered, but the sheet between AD is adhered, and FIG. As shown in ( ^1), a polymer Y'having an adhesion position of V ^{1 to} V ³ is obtained.
In this case, between DC, the already-adhered polymer is already used, but a new adhesive force is exhibited. In addition, here, unless a conductive plate (including an electrode plate) facing each other, for example, between C and B in FIGS. 1 and 3 has at least one bonding surface (bonding protrusion), Adhesion does not occur due to the characteristics of high-frequency adhesion. <Effects of the Invention> According to the present invention, even in the case of adhering the already-adhered polymers of a plurality of bags having the adhesion-necessary portion and the adhesion-unnecessary portion to each other,
Since it can be easily bonded, it requires few steps and can be mass-produced. It is also possible to make a polymer of a plastic sheet having no defective adhesion finish.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 3 are cross-sectional views showing the arrangement of an electrode board and the like used when carrying out the present invention, and FIGS. 2 and 4 show the bonding position of the adhesive polymer. It is sectional drawing shown. A ... Positive electrode board, B ... Negative lower electrode board C ... Conductor plate, D ... Insulator E ... Non-conductor, U ... Sheet unit

Claims (1)

[Corrected description] [Claims] [Claim 1] In a method of adhering a plastic sheet having a portion requiring adhesion and a portion requiring no adhesion by a high-frequency welder, while facing the electrode with the plastic sheet not requiring adhesion sandwiched therebetween. On the side, place a non-heat-bondable non-conductor,
A plastic sheet characterized by placing an insulator and an introduction plate between a positive electrode plate and a negative electrode plate that face each other across a plastic sheet that needs to be bonded and applying a high frequency voltage to the bonded part under pressure. Product manufacturing method. 2. A method of adhering a plastic sheet having a necessary adhesion portion and a non-adhesion necessary portion with a high frequency welder, wherein a non-heat-adhesive non-conductor is arranged on one side facing the electrode with the unnecessary adhesion plastic sheet sandwiched therebetween. Then, place either an insulator or a conductor plate between the positive and negative electrode plates that face each other with a plastic sheet that requires bonding between them, and apply a high-frequency voltage to the bonded part under pressure. A method for producing a plastic sheet product, characterized by: