/14 4 5 2 4 五、發明說明（1) 本發明係關於一種製造電路板的技術領域，尤指一種 可有效減少電路板製造不良率之製造方法。 按，在電子設備中' 為了減少不必要的電線佈設，現 在大都使用電路板來代替電線，以便於組裝内部零件及縮 小電器設備的空間，因此電路板對現有的機電設備而言， 是非常重要的，而現有電路板的製造方法主要係如第二圖 所示，該電路板可為單層板或多層板，其中本創作第二圖 以多層板為實施例，多層板之電路板結構層（A )係包括 有一内層板（1〇)，該内層板（10)之上、下表面分 別貼設有若干薄層狀的P. P膠片層（1 1 )，然後再於内層 板（1 0 )之各膠片層（1 1 )表面，分別再舖設有薄片 狀的銅板（3 0 )，而習用此種多層板之製造方法，主要 !係於一上熱壓模（4 0 )及一下熱壓模（4 1 )之間，依 序舖設疊置形成多數個電路板結構層（A )(其中一般製 造時可疊置到十層來製造，為便於圖面說明，故而第二圖 僅以三片電路板之製造來表示），而各個電路板結構層 (A )之間則隔設有一鏡板（3 1 )，並使位於最上層及 最下層的電路板結構層（A )外，再設墊設有一鏡板（3 1)，並使最上、下層之鏡板（31)外層再舖設一牛皮 紙（32)，使最上、下表面之牛皮紙（32)連同電路 板結構層（A )再置於一承蓋（3 3 )上，使上、下熱壓 模（40) 、 （41)可對上、下承蓋（33)進行熱壓 I作業，而使銅板（30)、膠片層（11)因受熱及受壓 丨而結合於内層板（1 0)之上、下表面而構成一電路板。/ 14 4 5 2 4 V. Description of the invention (1) The present invention relates to the technical field of manufacturing circuit boards, and particularly to a manufacturing method that can effectively reduce the manufacturing defect rate of circuit boards. Press, in electronic equipment 'In order to reduce unnecessary wiring, nowadays most of them use circuit boards instead of wires to facilitate the assembly of internal parts and reduce the space of electrical equipment. Therefore, circuit boards are very important for existing electromechanical equipment. The existing method of manufacturing a circuit board is mainly shown in the second figure. The circuit board can be a single-layer board or a multi-layer board. The second picture of this creation uses the multi-layer board as an example, and the circuit board structure layer of the multi-layer board. (A) is composed of an inner layer board (10). The upper and lower surfaces of the inner layer board (10) are respectively pasted with a number of thin P.P film layers (1 1), and then the inner layer board (1) 0) on the surface of each film layer (1 1), respectively, a sheet-like copper plate (30) is laid, and the manufacturing method of this multilayer board is mainly used on a hot press mold (40) and below Between the hot stamping dies (4 1), a plurality of circuit board structural layers (A) are sequentially laid and stacked (of which ten layers can be stacked for general manufacturing, for the convenience of illustration, the second figure is only Represented by the manufacture of three circuit boards), and each electrical A mirror plate (3 1) is arranged between the board structure layers (A), and the mirror plate (3 1) is arranged on the pad outside the uppermost and lowermost circuit board structure layers (A), and the uppermost Kraft paper (32) is laid on the outer layer of the lower mirror plate (31), so that the kraft paper (32) on the upper and lower surfaces together with the circuit board structure layer (A) is placed on a cover (3 3), so that the upper and lower The hot stamping dies (40) and (41) can perform hot pressing on the upper and lower bearing covers (33), so that the copper plate (30) and the film layer (11) are combined with the inner layer board due to heat and pressure. 10) The upper and lower surfaces constitute a circuit board.
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aa^2A 五、發明說明（2) 然而上述此種習用電路板之 缺點· 1 、熱傳導之耗損’易 完全： 上述此種電路板之熱壓 模（4 〇 ) 、 （ 4 1 )來對 )進行加熱加壓，熱源係由 )向中心的部份傳遞’故而 數量越多時’愈靠中間的電 程度亦相對較少，故而便造 全而形成不良品。 2、熱壓結構及製法繁 由於上述此種電路板之 板結構層（A )間墊設鏡板 (4 0 )上設置承蓋（3 3 外侧的電路板結構層（A ) 繁鎖而麻煩。 經由上述可知，由於現 麻煩，甚至製造出的電路板 此一情況，係為一般製造廠 目的者。 緣是，本發明人乃藉由 經驗’針對上述電路板熱壓 討，並積極尋求解決之方案 熱壓方法，卻存在有以下數項 造成位於争間的電路板結合不 方法’由於係利用上、下熱壓 多個疊置之電路板結構層（A 上、下熱壓模（40) (41 當電路板結構層（A)疊置之 路板結構層（A)受壓及受熱 成位於中間的電路板結合不完 鎖麻煩： 熱壓方法，不但要在各個電路 (31) ’更要上、下熱壓模 )與牛皮紙（3 2 )以避免最 過熱’使得熱壓之結構及製法 有之電路板熱壓方法不但繁鎖 不良率亦頗高’因此如何解決 所期待者’亦係本發明之主要 多年從事電路板研發與製造的 時溫度不均勻的問題深入探 ’經不斷努力之研發與試作， 五、發明說明（3) 終於成功的發明出一種可使加熱更為均勻之電路板熱壓方 法，藉以提升電路板的品質。 因此，本發明之主要目的係在提供一種可有效提升電 路板製造妥善率，而提升電路板經濟效益之電路板熱壓方 法。 為使 貴審查委員能進一步瞭解本發明之結構，特徵 及其他目的，玆附以較佳實施例及圖式詳細說明如后： 板 路 電 明。 發係 本關 明對 說相 以其。 用及圖 ’態音？ 圖狀示 意施壓 示實熱 壓體的 熱整板 :之的路 份明時電 部發壓有 式本熱現 圖係於係 (二）·圖號部份： (A )電路板結構層 (1 0 )内層板 (1 1 )膠片層 (1 2 )銅片 (2 0 )上壓模 (2 1 )下壓模 (3 0 )銅板 (3 1 )鏡板 (3 2 )牛皮紙 (3 3 )承蓋aa ^ 2A 5. Description of the invention (2) However, the shortcomings of the conventional circuit board described above 1. The heat dissipation loss is easy to complete: The hot stamping die (4 0), (4 1) of the above-mentioned circuit board) When heating and pressurizing, the heat source is transmitted from) to the center. Therefore, the more the quantity is, the more the electricity level in the middle is relatively small, so it is complete and defective. 2. Hot pressing structure and manufacturing method are troublesome because the board structure layer (A) of the circuit board described above is provided with a cover (3 3 outside the circuit board structure layer (A)) on the mirror plate (40). From the above, it can be known that due to the current troubles, even the manufactured circuit board is a general manufacturer's purpose. The reason is that the inventor has discussed the above-mentioned circuit board by experience and actively sought to solve it. Solution of the hot pressing method, but there are several methods that cause the circuit board located in the middle of the contention to fail. 'Because the upper and lower hot pressing of multiple stacked circuit board structural layers (A upper and lower hot pressing die (40) (41 When the circuit board structural layer (A) is superimposed, the circuit board structural layer (A) is pressed and heated to form a circuit board in the middle, which is incompletely locked. The hot pressing method must not only be used in each circuit (31) 'more The upper and lower hot stamping dies) and kraft paper (3 2) are used to avoid the most overheating. 'Making the hot pressing structure and the method of making some circuit boards. The hot pressing method not only has a high lock failure rate but also' how to solve the expectations'. Circuit board The problem of uneven temperature during production and manufacturing is explored in depth. 'After continuous research and development and trial work, V. Description of the invention (3) Finally successfully invented a method of hot pressing the circuit board to make the heating more uniform, thereby improving the circuit. The quality of the board. Therefore, the main purpose of the present invention is to provide a circuit board hot pressing method which can effectively improve the manufacturing efficiency of the circuit board and increase the economic efficiency of the circuit board. In order to allow your reviewers to further understand the structure of the present invention, The characteristics and other purposes are attached with the preferred embodiment and the detailed description of the drawings as follows: Board Road Electric Ming. The hair is related to this guanming. Use the picture 'state sound? The hot plate of the hot-pressed body: the road part of the Ming Dynasty Electricity Department issued the heat map shown in the system (two) · drawing number part: (A) circuit board structure layer (1 0) inner layer board ( 1 1) Film layer (1 2) Copper sheet (2 0) Upper stamper (2 1) Lower stamper (3 0) Copper plate (3 1) Mirror plate (3 2) Kraft paper (3 3) Cover
第6頁 五、發明說明（4) (4 0 )上熱壓模 (4 1 )下熱壓模 首先 法，主要 内，依序 中各内層 P膠片層 使該銅片 膠片層（ (12) 時，則可 )，以避 使銅片〔 )進行加 藉此 壓模（2 對銅片（ 片式的銅 板（1 0 片層（1 使銅片（ 膠片層（ (20) 請參看第一圖所示，本發明較佳實施例之熱壓方 係於上、下壓模（2 0 ) 、 （ 2 1 )之加壓空間 設有數個呈上、下疊置狀之内層板（1 〇 )，其 板（1 0 )之上、下面，係各舖設有薄片狀的P, ；1 1 )，並設有一軟性之長形銅片（20)， (1 2 )係彎折繞設於各内層板（1 〇 )上、下 1 1 )之表面（如第一圖中所示），而該銅片 於繞設時，若有銅片（1 2 )之繞設面相疊合 於銅片（1 2 )的兩繞設面間隔設一鏡板（3 1 免加熱時銅片（1 2 )之兩繞設面形成熔合，並 2 0 )的兩端分別連接至加熱源來對銅片（2 0 熱； ，當本發明之電路板進行熱壓時，則係將上、下 0 ) ( 2 1 )形成夾合，並在同一時間以加熱源 1 2 )進行加熱，使加熱源之加熱溫度可藉由一 片（12)1可確實且有效的傳遞到每一個内層 )之上、下方，而使每一内層板（1 0)與各膠 1 )均可受到相同銅片（1 2 )的加熱效果，並 1 2 )在加熱後亦則熔著於各内層板（1 0 )的 1 1 )外側，待加熱加壓完畢後，最後再將銅片 凸出内層板（1 0 )的部份予以裁切，即形成本Page 6 V. Description of the invention (4) (4 0) Upper hot stamping die (4 1) Lower hot stamping die first method, mainly in the inner P film layer in order to make the copper film layer ((12) When you can, you can) to avoid the addition of copper sheet () and press the mold (2 pairs of copper sheet (sheet copper sheet (10 sheet layer (1 sheet of copper sheet (film sheet ((20) Please refer to the first As shown in the figure, the hot-pressing method of the preferred embodiment of the present invention is arranged in the pressurizing space of the upper and lower dies (20) and (21) with a plurality of upper and lower inner-layer plates (10). ), Above and below the plate (1 0), each is laid with sheet-like P,; 1 1), and is provided with a flexible long copper sheet (20), (1 2) is bent and arranged on The upper and lower surfaces of each inner layer plate (1 0) (as shown in the first figure), and when the copper sheet is wound, if the winding surface of the copper sheet (1 2) is superimposed on the copper, The two winding surfaces of the sheet (1 2) are provided with a mirror plate spaced apart (the two winding surfaces of the copper sheet (1 2) are fused when heated without heating, and both ends of the copper sheet (2) are connected to a heating source to align the copper sheet). (2 0 heat; when the circuit board of the present invention is hot-pressed, then The upper and lower 0) (2 1) are sandwiched and heated at the same time by the heating source 1 2), so that the heating temperature of the heating source can be surely and effectively transferred to each one by (12) 1 Inner layer) above and below, so that each inner layer board (1 0) and each glue 1) can be heated by the same copper sheet (1 2), and 1 2) is also fused to each inner layer after heating 1 1) outside of the plate (1 0). After heating and pressing are completed, finally the part of the copper sheet protruding from the inner layer plate (1 0) is cut to form the sheet.
第7頁 五、發明說明〔5) 發明多數個 而本發 計，可使電 使電路板的 並可大幅降 益。 歸納上 繞於各層的 如此於熱壓 每一層均可 均勻的現象 生，達到降 綜上所 作，而可達 路板的經濟 創作於同類 符合發明專 電路板一體熱壓之製造方法； 明藉由以銅片（1 2 )繞設並成為加熱源之設 路板於熱壓時，可獲得有效且均句的加熱，可 結合品質提升，減少電路板製造時的不良率， 低電路板的製造成本，提高電路板的經濟效 述之說明可知，由於本發明使銅片呈一體狀環 膠片上，同時令銅片的兩端連接至加熱器上， 電路板時，可透過銅片的熱傳遞，使多層板的 獲得均勻的加熱，而不會發生如現有者加熱不 ，有效提升電路板的品質，減少不良率的產 低電路板製造成本之目的。 述，由於本發明係為利用自然法則之高度創 到減少不良率及降低製造成本之目的，提升電 效益，同時可供產業高度利用，且未見類似之 產品令發表，乃兼具新穎性與進步性，故應已 利之要件，爰依法提出申請。Page 7 V. Description of the invention [5] Many inventions and the present invention can make the circuit board electric and can greatly reduce the profits. It can be summarized that the phenomenon that each layer is wound around each layer can be uniformly generated by hot pressing, which can be achieved on the comprehensive reduction, and the economic creation of reachable road boards is based on the same method of integrated hot pressing according to the invention of a dedicated circuit board; The circuit board which is wound with copper sheet (12) and becomes a heating source can obtain effective and uniform heating during hot pressing, which can be combined with quality improvement to reduce the defective rate during circuit board manufacturing and low circuit board manufacturing. It can be known from the description of the cost and the economic efficiency of the circuit board that the copper sheet is integrated into the ring film and the two ends of the copper sheet are connected to the heater at the same time. When the circuit board is used, heat can be transmitted through the copper sheet. The purpose is to make the multi-layer board obtain uniform heating without the purpose of effectively improving the quality of the circuit board and reducing the defective rate and reducing the manufacturing cost of the circuit board. It is stated that, because the present invention is to use the height of natural law to achieve the purpose of reducing the defective rate and reducing the manufacturing cost, improve the electrical efficiency, and at the same time, it can be highly utilized by the industry, and no similar product order has been published. Progressive, therefore, should apply for the benefits according to law.
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