JP7833657B2 - 撮像装置及びその駆動方法 - Google Patents

撮像装置及びその駆動方法

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Publication number
JP7833657B2
JP7833657B2 JP2023506841A JP2023506841A JP7833657B2 JP 7833657 B2 JP7833657 B2 JP 7833657B2 JP 2023506841 A JP2023506841 A JP 2023506841A JP 2023506841 A JP2023506841 A JP 2023506841A JP 7833657 B2 JP7833657 B2 JP 7833657B2
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JP
Japan
Prior art keywords
potential
impurity region
transistor
contact hole
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023506841A
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English (en)
Japanese (ja)
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JPWO2022196155A5 (https=
JPWO2022196155A1 (https=
Inventor
好弘 佐藤
貴幸 西谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
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Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2022196155A1 publication Critical patent/JPWO2022196155A1/ja
Publication of JPWO2022196155A5 publication Critical patent/JPWO2022196155A5/ja
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/65—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures by techniques other than CDS
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/709—Circuitry for control of the power supply
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2023506841A 2021-03-16 2022-02-03 撮像装置及びその駆動方法 Active JP7833657B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021042047 2021-03-16
JP2021042047 2021-03-16
PCT/JP2022/004158 WO2022196155A1 (ja) 2021-03-16 2022-02-03 撮像装置及びその駆動方法

Publications (3)

Publication Number Publication Date
JPWO2022196155A1 JPWO2022196155A1 (https=) 2022-09-22
JPWO2022196155A5 JPWO2022196155A5 (https=) 2023-12-13
JP7833657B2 true JP7833657B2 (ja) 2026-03-23

Family

ID=83320317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506841A Active JP7833657B2 (ja) 2021-03-16 2022-02-03 撮像装置及びその駆動方法

Country Status (3)

Country Link
US (1) US12348884B2 (https=)
JP (1) JP7833657B2 (https=)
WO (1) WO2022196155A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022124088A1 (ja) * 2020-12-11 2022-06-16 パナソニックＩｐマネジメント株式会社 撮像装置および駆動方法
WO2026053822A1 (ja) * 2024-09-09 2026-03-12 ソニーセミコンダクタソリューションズ株式会社 半導体素子および電子機器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119441A (ja) 2009-12-03 2011-06-16 Sony Corp 撮像素子およびカメラシステム
JP2016127593A (ja) 2014-12-26 2016-07-11 パナソニックＩｐマネジメント株式会社 撮像装置
JP2019091937A (ja) 2019-02-27 2019-06-13 パナソニックＩｐマネジメント株式会社 撮像装置
WO2020045121A1 (ja) 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその駆動方法、並びに電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5449242B2 (ja) 2011-03-29 2014-03-19 富士フイルム株式会社 固体撮像素子及び撮像装置
JP6213743B2 (ja) 2014-10-08 2017-10-18 パナソニックＩｐマネジメント株式会社 撮像装置およびその駆動方法
US9967501B2 (en) 2014-10-08 2018-05-08 Panasonic Intellectual Property Management Co., Ltd. Imaging device
CN111901540B (zh) 2014-12-26 2023-05-23 松下知识产权经营株式会社 摄像装置
JP2017135693A (ja) 2016-01-21 2017-08-03 パナソニックＩｐマネジメント株式会社 撮像装置
JP7511187B2 (ja) 2019-02-22 2024-07-05 パナソニックＩｐマネジメント株式会社 撮像装置
JP7668464B2 (ja) 2019-09-26 2025-04-25 パナソニックＩｐマネジメント株式会社 撮像装置
US20240155826A1 (en) * 2022-11-08 2024-05-09 International Business Machines Corporation Fet dram with backside bitline

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119441A (ja) 2009-12-03 2011-06-16 Sony Corp 撮像素子およびカメラシステム
JP2016127593A (ja) 2014-12-26 2016-07-11 パナソニックＩｐマネジメント株式会社 撮像装置
WO2020045121A1 (ja) 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその駆動方法、並びに電子機器
JP2019091937A (ja) 2019-02-27 2019-06-13 パナソニックＩｐマネジメント株式会社 撮像装置

Also Published As

Publication number Publication date
JPWO2022196155A1 (https=) 2022-09-22
WO2022196155A1 (ja) 2022-09-22
US12348884B2 (en) 2025-07-01
US20230403479A1 (en) 2023-12-14

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