JP7833552B2 - Ceramic wiring substrate and ceramic wiring member - Google Patents

Description

This disclosure relates to a ceramic wiring substrate and a ceramic wiring member.

A ceramic wiring member is known that includes a ceramic body having a plate-like portion and a conductive portion positioned in contact with the plate-like portion. Such a ceramic wiring member is used as a member for holding electronic components. The conductive portion constitutes part of the path for current to or from the electronic component. Such a ceramic wiring member can be manufactured by first producing a ceramic wiring member base substrate in which multiple ceramic wiring members are laid out and connected together, and then dividing it into multiple individual ceramic wiring members, from the viewpoint of streamlining the manufacturing process (see, for example, International Publication No. 2017/126596 (Patent Document 1), Japanese Patent Application Publication No. 2000-312060 (Patent Document 2), and Japanese Patent Application Publication No. 2016-66676 (Patent Document 3)).

International Publication No. 2017/126596 Japanese Patent Publication No. 2000-312060 Japanese Patent Publication No. 2016-66676

A ceramic wiring member is known that includes a ceramic body having a plate-like portion and a conductive portion positioned in contact with the body, and has a rectangular shape when viewed perpendicular to the plate-like portion. In such a ceramic wiring member, the conductive portion may have a structure in which a frame-like portion is arranged in an annular manner on the body along the outer circumference of the rectangle in a plan view of the top surface, and a ground terminal is arranged on the body in a plan view of the back surface. In a ceramic wiring member with such a structure, an electronic component such as a crystal element is housed in the space on the plate-like portion, which is sealed by joining a metal lid to the frame-like portion. Furthermore, the grounding of the lid is ensured by electrically connecting the frame-like portion and the ground terminal. The electrical connection between the frame-like portion and the ground terminal can be achieved, for example, by forming a through hole that penetrates the body from the frame-like portion to the ground terminal and filling the through hole with a conductor.

In response to the recent demand for miniaturization of electronic devices, ceramic wiring components are also required to be miniaturized. As ceramic wiring components are miniaturized, the width of the frame-like portion decreases, making it difficult to achieve electrical connection between the frame-like portion and the ground terminal by forming through-holes. To address this, instead of using through-holes, a method can be employed to achieve electrical connection between the frame-like portion and the ground terminal by forming a groove on the outer circumference of the main body that extends from the frame-like portion to the ground terminal, and arranging a conductor on the wall surface of the groove.

When manufacturing such ceramic wiring members using a manufacturing process that pre-fabricates the ceramic wiring member base, a process can be employed in which a ceramic wiring member base is created by arranging the ceramic wiring members in a matrix so that four ceramic wiring members share the vertices of a rectangle, then forming through holes at positions corresponding to the vertices of the rectangle, and placing conductors on the walls surrounding these through holes. The ceramic wiring members can then be manufactured by dividing the base along the outer perimeter of the rectangle.

However, according to the inventors' research, if the above process is adopted, a problem may arise in which the conductors placed on the walls surrounding the through-holes fall off when the ceramic wiring member is divided. This is thought to be because the conductors located at the vertices of the rectangle are separated into four by the division, reducing the contact area between the walls of the through-holes and the conductors, making them more prone to falling off. The falling off of the conductors leads to a decrease in the reliability of the electrical connection between the frame-like part and the ground terminal. On the other hand, by forming the through-holes and conductors at positions corresponding to sides away from the vertices of the rectangle, instead of at the vertices, the contact area between the conductors and the walls of the through-holes increases, and the falling off of the conductors can be suppressed. However, if two ceramic wiring members sharing the above-mentioned through-holes and conductors are separated, for example, into left and right sections in the ceramic wiring member base substrate state, a ceramic wiring member with the conductor on the left and a ceramic wiring member with the conductor on the right are obtained, resulting in two types of ceramic wiring members with different structures. In the manufacture of ceramic wiring members, it is preferable to mass-produce products with the same structure. Therefore, the manufacture of two types of ceramic wiring components with different structures necessitates the control of the structure of the ceramic wiring components, hindering the efficiency of the manufacturing process.

This disclosure aims to solve the above-mentioned problems, and one of its objectives is to provide a ceramic wiring substrate and a ceramic wiring member that can achieve increased efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal.

A ceramic wiring substrate according to this disclosure has a first surface which is one surface in the thickness direction and a second surface which is the surface opposite to the first surface in the thickness direction, and is a ceramic wiring substrate on which a plurality of ceramic wiring members having a rectangular shape when viewed in the thickness direction are laid out and integrally connected. The plurality of ceramic wiring members include a first ceramic wiring member and a second ceramic wiring member connected to the first ceramic wiring member.

Each of the first and second ceramic wiring members includes a ceramic body having a plate-like portion and a conductive portion positioned in contact with the body. The conductive portion includes, in a plan view from the first face side, a frame-like portion arranged annularly on the body along the outer circumference of a rectangle and a pair of internal terminals positioned on the region of the body surrounded by the frame-like portion; and, in a plan view from the second face side, a pair of external terminals positioned apart from each other on the body and a ground terminal positioned apart from the pair of external terminals on the body. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

Break grooves are formed on at least one of the first and second surfaces, extending along each side of the rectangles of a plurality of adjacent ceramic wiring members. The first and second ceramic wiring members are arranged such that the first side, which is one of the sides of the rectangle of the first ceramic wiring member, and the second side, which is one of the sides of the rectangle of the second ceramic wiring member, partially overlap, but the ends of the first side and the ends of the second side do not overlap. A first via hole is formed in the region where the first and second sides overlap, penetrating the ceramic wiring member base plate in the thickness direction. The conductive portion is formed on the wall surface surrounding the first via hole and further includes a first via conductor that connects the ground terminals of the first and second ceramic wiring members to the frame-shaped portions of the first and second ceramic wiring members. The first and second ceramic wiring members are arranged point-symmetrically with respect to the first via conductor when viewed in the thickness direction of the ceramic wiring member base plate. Multiple ceramic wiring members are constructed by using a first ceramic wiring member and a second ceramic wiring member, which are connected to each other, as unit structures, and arranging these unit structures without any gaps.

A ceramic wiring member according to this disclosure includes a ceramic main body having a plate-like portion and a conductive portion disposed in contact with the main body, and is a ceramic wiring member having a rectangular shape when viewed in a direction perpendicular to the plate-like portion. The plate-like portion has a first main surface which is one of the main surfaces in the thickness direction and a second main surface located on the opposite side of the first main surface in the thickness direction. The conductive portion includes, in a plan view from the first main surface side, a frame-like portion disposed annularly on the main body along the outer circumference of the rectangle and a pair of internal terminals disposed on the region of the main body surrounded by the frame-like portion, and, in a plan view from the second main surface side, a pair of external terminals disposed on the main body spaced apart from each other and a ground terminal disposed on the main body spaced apart from the pair of external terminals.

One of a pair of internal terminals is electrically connected to one of a pair of external terminals. The other of a pair of internal terminals is electrically connected to the other of a pair of external terminals. A first groove is formed on the outer circumference of the main body portion, penetrating the main body portion in the thickness direction, away from the vertices of the rectangle. The conductive portion further includes a first via conductor formed on the wall surface of the first groove portion, connecting the ground terminal and the frame-shaped portion. In at least one of the plan view of the first main surface side and the plan view of the second main surface side, a first notch is formed on the outer circumference of the ceramic wiring member, away from the vertices of the third side, which is a side of the rectangle in which the first groove portion is formed, and a second notch is formed on the fourth side opposite the third side, away from the vertices. The first notch and the second notch are located on the same straight line perpendicular to the third side and the fourth side, respectively. In this application, "rectangle" includes "square".

The above-described ceramic wiring substrate and ceramic wiring member make it possible to provide a ceramic wiring substrate and ceramic wiring member that can achieve increased efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal.

Figure 1 is a schematic plan view of the first surface side of the ceramic wiring member base plate in Embodiment 1. Figure 2 is a schematic plan view of the second surface side of the ceramic wiring member base plate in Embodiment 1. Figure 3 is a schematic plan view of the upper surface of the ceramic wiring member. Figure 4 is a schematic side view of a ceramic wiring member. Figure 5 is a schematic cross-sectional view along the line segment V-V in Figures 3 and 6. Figure 6 is a schematic plan view of the back side of the ceramic wiring member. Figure 7 is a schematic side view of a ceramic wiring member. Figure 8 is a schematic cross-sectional view along the line segment VIII-VIII in Figures 3 and 6. Figure 9 is a schematic plan view of the first surface side of the ceramic wiring member base plate in Embodiment 2. Figure 10 is a schematic plan view of the second surface side of the ceramic wiring member base plate in Embodiment 2.

[Summary of Embodiments]
First, embodiments of the present disclosure will be listed and described. The ceramic wiring member base substrate of the present disclosure has a first surface which is one surface in the thickness direction and a second surface which is the surface opposite to the first surface in the thickness direction, and is a ceramic wiring member base substrate on which a plurality of ceramic wiring members having a rectangular shape when viewed in the thickness direction are laid out and integrally connected. The plurality of ceramic wiring members include a first ceramic wiring member and a second ceramic wiring member connected to the first ceramic wiring member.

Each of the first and second ceramic wiring members includes a ceramic body having a plate-like portion and a conductive portion positioned in contact with the body. The conductive portion includes, in a plan view from the first face side, a frame-like portion arranged annularly on the body along the outer circumference of a rectangle and a pair of internal terminals positioned on the region of the body surrounded by the frame-like portion; and, in a plan view from the second face side, a pair of external terminals positioned apart from each other on the body and a ground terminal positioned apart from the pair of external terminals on the body. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

Break grooves are formed on at least one of the first and second surfaces, extending along each side of the rectangles of a plurality of adjacent ceramic wiring members. The first and second ceramic wiring members are arranged such that the first side, which is one of the sides of the rectangle of the first ceramic wiring member, and the second side, which is one of the sides of the rectangle of the second ceramic wiring member, partially overlap, but the ends of the first side and the ends of the second side do not overlap. A first via hole is formed in the region where the first and second sides overlap, penetrating the ceramic wiring member base plate in the thickness direction. The conductive portion is formed on the wall surface surrounding the first via hole and further includes a first via conductor that connects the ground terminals of the first and second ceramic wiring members to the frame-shaped portions of the first and second ceramic wiring members. The first and second ceramic wiring members are arranged point-symmetrically with respect to the first via conductor when viewed in the thickness direction of the ceramic wiring member base plate. Multiple ceramic wiring members are constructed by using a first ceramic wiring member and a second ceramic wiring member, which are connected to each other, as unit structures, and arranging these unit structures without any gaps.

In the ceramic wiring member matrix of this disclosure, a first via hole is formed in the region where the first side of the first ceramic wiring member and the second side of the second ceramic wiring member overlap, and a first via conductor formed on the wall surface surrounding the first via hole connects the ground terminal to the frame-shaped portion. By arranging the first via hole and the first via conductor at positions corresponding to the sides of the rectangle, rather than at the vertices of the rectangle, the contact area between the first via conductor and the wall surface of the through hole is increased when the first ceramic wiring member and the second ceramic wiring member are separated along the first and second sides, thereby suppressing the detachment of the first via conductor. Furthermore, since the first ceramic wiring member and the second ceramic wiring member are arranged point-symmetrically with respect to the first via conductor, with the first and second sides partially overlapping, the separated first and second ceramic wiring members become ceramic wiring members with the same structure. As a result, the efficiency of the manufacturing process is improved.

Thus, the ceramic wiring substrate of this disclosure makes it possible to achieve increased efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal.

In the ceramic wiring member base substrate described above, a first through-hole extending from the first surface to the second surface may be formed at each vertex of the rectangle of the multiple ceramic wiring members. With this configuration, even if there is some error in the formation position of the break grooves extending along each side of the rectangle, the break grooves extending perpendicularly to each other can be connected at the desired position.

In a plan view of the first surface side of the ceramic wiring member base substrate, the pair of internal terminals of the first ceramic wiring member and the pair of internal terminals of the second ceramic wiring member may be arranged in opposite directions relative to each other within the region surrounded by the frame-shaped portion, along the first and second edges. This configuration makes it possible to improve the efficiency of the manufacturing process even when the internal terminals are arranged unevenly due to the structure of the electronic components to be held by the ceramic wiring member.

The ceramic wiring member of this disclosure includes a ceramic main body having a plate-like portion and a conductive portion disposed in contact with the main body, and is a ceramic wiring member having a rectangular shape when viewed in a direction perpendicular to the plate-like portion. The plate-like portion has a first main surface which is one of the main surfaces in the thickness direction and a second main surface located on the opposite side of the first main surface in the thickness direction. The conductive portion includes, in a plan view from the first main surface side, a frame-like portion disposed annularly on the main body along the outer circumference of the rectangle and a pair of internal terminals disposed on the region of the main body surrounded by the frame-like portion, and, in a plan view from the second main surface side, a pair of external terminals disposed on the main body spaced apart from each other and a ground terminal disposed on the main body spaced apart from the pair of external terminals.

One of a pair of internal terminals is electrically connected to one of a pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals. A first groove is formed on the outer circumference of the main body portion, penetrating the main body portion in the thickness direction, away from the vertices of the rectangle. The conductive portion further includes a first via conductor formed on the wall surface of the first groove portion, connecting the ground terminal and the frame-shaped portion. In at least one of the plan view of the first main surface side and the plan view of the second main surface side, a first notch is formed on the outer circumference of the ceramic wiring member, away from the vertices of the third side, which is the side of the rectangle in which the first groove portion is formed, and a second notch is formed on the fourth side opposite the third side, away from the vertices. The first notch and the second notch are located on the same straight line perpendicular to the third side and the fourth side, respectively.

The ceramic wiring member of this disclosure can be efficiently manufactured while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal by dividing the ceramic wiring member base substrate along the break groove into ceramic wiring members. Here, the first notch and the second notch are formed in accordance with the region where the break groove of the ceramic wiring member base substrate branches.

In the ceramic wiring member described above, the first notch and the second notch may penetrate the ceramic wiring member in the thickness direction of the main body. Such first and second notches are formed by forming a first through-hole in the ceramic wiring member base plate. With this configuration, break grooves extending perpendicularly to each other can be connected at desired positions in the ceramic wiring member base plate, thereby suppressing variations in the shape of the ceramic wiring member.

In the ceramic wiring member described above, the first and second notches may be positioned biased to one side in the direction along the third and fourth sides. With this configuration, even when electronic components are mounted on the ceramic wiring member and sealed by the lid, making the electronic components invisible, the orientation of the electronic components can be determined by the first and second notches.

[Specific examples of embodiments]
Next, specific embodiments of the ceramic wiring substrate and ceramic wiring member of this disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

(Embodiment 1)
Figure 1 is a schematic plan view of the first surface side of the ceramic wiring member base plate in Embodiment 1, which is one embodiment of the present disclosure. Figure 2 is a schematic plan view of the second surface side of the ceramic wiring member base plate in Embodiment 1. Figure 3 is a schematic plan view of the top surface side of the ceramic wiring member. Figure 4 is a schematic side view of the ceramic wiring member. Figure 5 is a schematic cross-sectional view taken along the line segment V-V in Figures 3 and 6. Figure 6 is a schematic plan view of the back side of the ceramic wiring member. Figure 7 is a schematic side view of the ceramic wiring member. Figure 8 is a schematic cross-sectional view taken along the line segment VIII-VIII in Figures 3 and 6.

Referring to Figures 1 and 2, the ceramic wiring member base substrate 100 of this embodiment has a first surface 100A (see Figure 1), which is one surface in the thickness direction (Z-axis direction), and a second surface 100B (see Figure 2), which is the surface opposite to the first surface 100A in the thickness direction. The ceramic wiring member base substrate 100 has a structure in which a plurality of rectangular-shaped ceramic wiring members 110, 120 are laid out and connected together when viewed in the thickness direction (along the Z-axis direction). The plurality of ceramic wiring members 110, 120 include a first ceramic wiring member 110 and a second ceramic wiring member 120 connected to the first ceramic wiring member 110. Although the first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged in different orientations within the ceramic wiring member base substrate 100, they are ceramic wiring members 1 having the same structure, as will be explained below with reference to Figures 3 to 8.

Referring to Figures 3 to 8, the ceramic wiring member 1 (the first ceramic wiring member 110 and the second ceramic wiring member 120, respectively) includes a ceramic body portion 10 and a conductive portion 20 that is positioned in contact with the body portion 10. The ceramic constituting the body portion 10 is not particularly limited, but for example, alumina (aluminum oxide) can be used. The body portion 10 includes a plate-like portion 11 having a flat plate shape and a frame 12. The plate-like portion 11 has a rectangular shape when viewed in the thickness direction (Z-axis direction). The plate-like portion 11 includes a first main surface 11A and a second main surface 11B located on the opposite side of the first main surface 11A in the thickness direction. The thickness t of the body portion 10 can be, for example, 0.1 mm or more and 0.6 mm or less.

The frame 12 has a frame-like shape that rises from the outer edge of the first main surface 11A of the plate-like portion 11. More specifically, it has an annular shape along the outer edge of the first main surface 11A of the plate-like portion 11, which has a rectangular planar shape. Viewed in a direction perpendicular to the first main surface 11A, the frame 12 surrounds the cavity 50, which is the space on the first main surface 11A. The frame 12 includes a planar first end surface 12A and a second end surface 12B, which is a planar end surface on the opposite side of the first end surface 12A in the thickness direction of the plate-like portion 11. The frame 12 is connected to the first main surface 11A of the plate-like portion 11 at the second end surface 12B. The first end surface 12A is located on a single plane throughout its entire area. As a result, the cavity 50 can be closed by placing a flat plate-shaped lid member on the first end surface 12A. The cavity 50 can house electronic components such as quartz elements that require airtightness. Such ceramic wiring members 1 can be used as ceramic packages for housing electronic components. For example, when electrodes attached to both sides of a quartz element are connected to a pair of internal terminals 22, a quartz oscillator is formed.

The conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via conductor 28, a second via conductor 25, a third via conductor 27, a first connection portion 26, and a second connection portion 29. The frame-shaped portion 21 is arranged to cover the first end face 12A of the frame body 12. The frame-shaped portion 21 has an annular shape corresponding to the first end face 12A of the frame body 12. That is, in a plan view from the first surface 100A side (viewpoint in Figures 1 and 3), the frame-shaped portion 21 is arranged annularly on the frame body 12 of the main body portion 10 along the outer circumference of the rectangular ceramic wiring member 1. The pair of internal terminals 22 are arranged in contact with the first main surface 11A of the plate-shaped portion 11 surrounded by the frame body 12. In other words, in a plan view of the first surface 100A, the pair of internal terminals 22 are arranged on the region of the first main surface 11A of the plate-shaped portion 11 included in the main body portion 10 that is surrounded by the frame-shaped portion 21.

Note that the frame 12 may be omitted. That is, the conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via conductor 28, a second via conductor 25, a third via conductor 27, a first connection portion 26, and a second connection portion 29. In a plan view from the first surface 100A side (viewpoint in Figures 1 and 3), the frame-shaped portion 21 is arranged in an annular manner on the first main surface 11A of the main body portion 10 (plate-shaped portion 11) along the outer circumference of the rectangular ceramic wiring member 1. The pair of internal terminals 22 are arranged in contact with the first main surface 11A. In a plan view from the first surface 100A side, the pair of internal terminals 22 are arranged on the region of the first main surface 11A of the plate-shaped portion 11 included in the main body portion 10 that is surrounded by the frame-shaped portion 21.

As a result, by placing a bathtub-shaped lid member having a cavity on the frame-shaped portion 21, electronic components such as quartz elements that require airtightness can be housed in the cavity of the lid member. Such a ceramic wiring member 1 can be used as a ceramic package for housing electronic components. For example, when electrodes attached to both sides of a quartz element are connected to a pair of internal terminals 22, a quartz oscillator is formed.

The pair of external terminals 23 are positioned in contact with the second main surface 11B of the plate-shaped portion 11. That is, in a plan view from the second surface 100B side (viewpoint in Figures 2 and 6), the pair of external terminals 23 are positioned apart from each other on the second main surface 11B of the plate-shaped portion 11 included in the main body portion 10. The pair of ground terminals 24 are positioned apart from the pair of external terminals 23, and in contact with the second main surface 11B of the plate-shaped portion 11. That is, in a plan view from the second surface 100B side, the pair of ground terminals 24 are positioned apart from the pair of external terminals 23, and also apart from each other on the second main surface 11B of the plate-shaped portion 11 included in the main body portion 10. In a plan view from the second surface 100B side, the pair of external terminals 23 are positioned on one diagonal of the rectangle, and the pair of ground terminals 24 are positioned on the other diagonal of the rectangle. The pair of external terminals 23 and the pair of ground terminals 24 are positioned at the four corners of the rectangle, respectively. Such a terminal arrangement can facilitate the wiring design of the external substrate to which the ceramic wiring member 1 is to be attached.

The second via conductor 25 is positioned to extend from the first main surface 11A to the second main surface 11B of the plate-shaped portion 11. More specifically, the second via conductor 25 is formed to fill a through-hole formed in the plate-shaped portion 11. The second via conductor 25 is physically and electrically connected to one of the pair of external terminals 23 at the end of the plate-shaped portion 11 on the second main surface 11B side. The first connection portion 26 is formed on the first main surface 11A of the plate-shaped portion 11. The first connection portion 26 connects one of the pair of internal terminals 22 to the second via conductor 25. The second via conductor 25 is physically and electrically connected to one of the pair of internal terminals 22 at the end of the plate-shaped portion 11 on the first main surface 11A side. That is, one of the pair of internal terminals 22 and one of the pair of external terminals 23 are electrically connected via the first connection portion 26 and the second via conductor 25.

The third via conductor 27 is positioned to extend from the first main surface 11A to the second main surface 11B of the plate-shaped portion 11. More specifically, the third via conductor 27 is formed to fill a through-hole formed in the plate-shaped portion 11. The third via conductor 27 is physically and electrically connected to the other of the pair of external terminals 23 at the end of the plate-shaped portion 11 on the second main surface 11B side. The third via conductor 27 is physically and electrically connected to the other of the pair of internal terminals 22 at the end of the plate-shaped portion 11 on the first main surface 11A side. That is, the other of the pair of internal terminals 22 and the other of the pair of external terminals 23 are electrically connected via the third via conductor 27.

The second connection portion 29 electrically connects a pair of ground terminals 24 inside the plate-shaped portion 11. The second connection portion 29 may be formed on the second main surface 11B of the plate-shaped portion 11. In this case, it is preferable that a portion of the longitudinal direction of the second connection portion 29 is covered with an insulator. This prevents connection failures that occur when soldering the ground terminals 24 to the wiring of an external substrate, where the ground terminals 24 are connected by solder. The second connection portion 29 may also be omitted. In this case, the ground terminal 24 that is not connected to the first via conductor 28 does not function as a ground. As a result, only one ground terminal 24 functions as a ground.

Referring to Figures 1 and 2, break grooves 151 are formed on the first surface 100A and the second surface 100B, extending along each side of the rectangles of the adjacent ceramic wiring members 110 and 120. In this embodiment, break grooves 151 are formed on both the first surface 100A and the second surface 100B, but one of them may be omitted. The ceramic wiring member base plate 100 is separable along the break grooves 151. The depth of the break grooves 151 can be, for example, 0.025 mm or more and 0.200 mm or less. In addition, a dummy part made of the same material may be provided around the ceramic wiring member base plate 100. Providing a dummy part can prevent unintended damage to the ceramic wiring member base plate 100.

Next, we will focus on the unit structure consisting of the first ceramic wiring member 110 located in the center of the leftmost column in Figure 1 and the second ceramic wiring member 120 located in the center of the second column from the left, and describe the details of the arrangement of the multiple ceramic wiring members 110 and 120. The first ceramic wiring member 110 includes side 111 as the first side, which is one of the sides of a rectangle, side 112 opposite side 111, side 113 perpendicular to sides 111 and 112, and side 114 opposite side 113. Sides 111 and 112 correspond to the longer sides extending along the Y-axis. Sides 113 and 114 correspond to the shorter sides extending along the X-axis. The second ceramic wiring member 120 includes side 121 as a second side which is one of the sides of a rectangle, side 122 opposite side 121, side 123 perpendicular to sides 121 and 122, and side 124 opposite side 123. Sides 121 and 122 correspond to the longer sides extending along the Y-axis. Sides 123 and 124 correspond to the shorter sides extending along the X-axis.

The first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged such that the first side 111 of the first ceramic wiring member 110 and the second side 121 of the second ceramic wiring member 120 partially overlap, but the ends 111A and 111B of side 111 and the ends 121A and 121B of side 121 do not overlap. More specifically, sides 111 and 121 are offset in the Y-axis direction such that approximately half of their respective lengths overlap. When the ceramic wiring member base plate 100 is divided along the break groove 151, sides 111 and 121 become sides 71, which are the third sides of the ceramic wiring member 1 (see Figures 3 and 6). Similarly, sides 112 and 122 become sides 72, which are the fourth sides of the ceramic wiring member 1. Sides 113 and 123 become sides 73 of the ceramic wiring member 1. Sides 114 and 124 become sides 74 of the ceramic wiring member 1.

In the region where the first side 111 and the second side 121 overlap, a first via hole 131 is formed, penetrating the ceramic wiring member base plate 100 in the thickness direction. When the ceramic wiring member base plate 100 is divided along the break groove 151, the first via hole 131 becomes the first groove portion 31 of the ceramic wiring member 1 (see Figures 3, 4, and 6). The first groove portion 31 is formed on the outer circumference of the main body portion 10. The first groove portion 31 is away from the vertices of the rectangle and penetrates the main body portion 10 in the thickness direction. The first groove portion 31 penetrates the frame-shaped portion 21, the frame body 12, the plate-shaped portion 11, and one of the pair of ground terminals 24.

Referring to Figures 1 and 2, the first via conductor 28 is formed on the wall surface surrounding the first via hole 131. In this embodiment, the first via conductor 28 fills the first via hole 131. The first via conductor 28 may cover the wall surface of the first via hole 131 without filling it. The first via conductor 28 physically and electrically connects one of the pair of ground terminals 24 of the first ceramic wiring member 110 and the second ceramic wiring member 120 to the frame-shaped portion 21 of the first ceramic wiring member 110 and the second ceramic wiring member 120. When the ceramic wiring member base plate 100 is divided along the break groove 151, the first via conductor 28 of the ceramic wiring member base plate 100 becomes the first via conductor 28 formed on the wall surface defining the first groove portion 31 (see Figures 3, 4, and 6). The first via conductor 28 physically and electrically connects one of the pair of ground terminals 24 to the frame-shaped portion 21.

Referring to Figures 1 and 2, a first through-hole 161 is formed at each vertex of the rectangle of the multiple ceramic wiring members 110 and 120, extending from the first surface 100A to the second surface 100B. The first through-hole 161 is positioned on a straight line 191 extending in the X-axis direction so as to include the short sides 113 and 114 of the first ceramic wiring member 110, and on a straight line 192 extending in the X-axis direction so as to include the short sides 123 and 124 of the second ceramic wiring member 120. When the ceramic wiring member base plate 100 is divided along the break groove 151, the first through-hole 161 becomes a first notch 41, a second notch 42, a third notch 43, a fourth notch 44, a fifth notch 45, and a sixth notch 46 (see Figures 3 and 6). The first notch 41 is formed on side 71, which is the third side on which the first groove 31 is formed, away from the vertex. The second notch 42 is formed on side 72, which is the fourth side opposite side 71, away from the vertex. The third notch 43 is formed at a position corresponding to the intersection of side 71 and side 74. The fourth notch 44 is formed at a position corresponding to the intersection of side 71 and side 73. The fifth notch 45 is formed at a position corresponding to the intersection of side 72 and side 73. The sixth notch 46 is formed at a position corresponding to the intersection of side 72 and side 74. The first notch 41, the second notch 42, the third notch 43, the fourth notch 44, the fifth notch 45, and the sixth notch 46 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. The first notch 41 and the second notch 42 are located on a straight line 91 that is perpendicular to the third side 71 and the fourth side 72. The width w of the first notch 41 and the second notch 42 can be, for example, greater than 0 μm and 40 μm or less. The depth d of the first notch 41 and the second notch 42 can be, for example, greater than 0 μm and 50 μm or less.

Referring to Figures 1 and 2, the first through-hole 161 can be omitted. In this case, when the ceramic wiring member base plate 100 is divided along the break groove 151, the first notch 41 and the second notch 42 are formed without penetrating the ceramic wiring member 1 in the thickness direction (see Figures 3 and 6). More specifically, the first notch 41 and the second notch 42 are formed to have a depth corresponding to the depth of the break groove 151. This is because, when forming the break groove 151 in the manufacturing process, the break grooves 151 are intentionally formed to slightly intersect in the region where they branch, in order to avoid interruption in that region. From the viewpoint of forming the first notch 41 and the second notch 42 more clearly, the break grooves 151 only need to intersect for a distance corresponding to the desired size of the first notch 41 and the second notch 42. Furthermore, during the manufacturing process, when the break grooves 151 are formed on the green sheet by laser irradiation, the irradiated areas volatilize. In the regions where the break grooves 151 intersect, the laser is irradiated twice, so volatilization progresses more rapidly. As a result, in the regions where the break grooves 151 intersect, the depth of the break grooves 151 becomes, for example, more than 1 time and less than or equal to 1.2 times deeper than in other parts.

As described above, the first ceramic wiring member 110 and the second ceramic wiring member 120, which are ceramic wiring members 1 having the same structure, are arranged point-symmetrically with respect to the first via conductor 28 when viewed in the thickness direction of the ceramic wiring member base substrate 100, as shown in Figures 1 and 2 (so that they overlap over the entire length when rotated 180° around the first via conductor 28). The multiple ceramic wiring members 110 and 120 included in the ceramic wiring member base substrate 100 are constructed by using the first ceramic wiring member 110 and the second ceramic wiring member 120 connected to each other as unit structures, and tiling these unit structures without gaps. More specifically, in adjacent unit structures in the direction of the long side of the rectangle (Y-axis direction), sides 113 and 114 overlap over the entire length, and sides 124 and 123 overlap over the entire length. In adjacent unit structures in the direction of the short side of the rectangle (X-axis direction), sides 112 and 122 overlap over approximately half of the entire length. In this way, unit structures composed of the first ceramic wiring member 110 and the second ceramic wiring member 120, which have the same structure, are arranged in a matrix. This allows for the efficient use of raw materials.

In the ceramic wiring member base substrate 100 of this embodiment, a first via hole 131 is formed in the region where the side 111 of the first ceramic wiring member 110 and the side 121 of the second ceramic wiring member 120 overlap, and the ground terminal 24 and the frame-shaped portion 21 are connected by a first via conductor 28 formed on the wall surface surrounding the first via hole 131. By arranging the first via hole 131 and the first via conductor 28 at positions corresponding to the sides of the rectangle, rather than at the vertices of the rectangle, the contact area between the first via conductor 28 and the wall surface of the first via hole 131 is increased when the first ceramic wiring member 110 and the second ceramic wiring member 120 are separated along the break groove 151 along the sides 111 and 121, thereby suppressing the detachment of the first via conductor 28. Furthermore, the first ceramic wiring member 110 and the second ceramic wiring member 120 are positioned point-symmetrically with respect to the first via conductor 28, with their edges 111 and 121 partially overlapping and offset from each other. As a result, the separated ceramic wiring member 1 and the second ceramic wiring member 120 have the same structure. Consequently, the efficiency of the manufacturing process is improved. Moreover, even when electronic components are mounted on the ceramic wiring member 1 and sealed by the lid, making the electronic components invisible, the orientation of the electronic components can still be determined by the first via hole 131 (first groove 31 after separation) and the first via conductor 28.

Thus, the ceramic wiring substrate 100 of this embodiment is a ceramic wiring substrate that can achieve increased efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion 21 and the ground terminal 24.

Furthermore, in the ceramic wiring member base substrate 100 of this embodiment, a first through hole 161 is formed at each vertex of the rectangle of the plurality of ceramic wiring members 110, 120, extending from the first surface 100A to the second surface 100B. This makes it possible to connect the break groove 151 extending in the X-axis direction and the break groove 151 extending in the Y-axis direction at the desired position, even if there is some error in the formation position of the break groove 151 extending along each side of the rectangle.

Furthermore, in a plan view of the first surface 100A side of the ceramic wiring member base substrate 100 of this embodiment, the pair of internal terminals 22 of the first ceramic wiring member 110 and the pair of internal terminals 22 of the second ceramic wiring member 120 are arranged in opposite directions within the region surrounded by the frame-shaped portion 21, in the direction along the sides 111 and 121 (Y-axis direction). This makes it possible to achieve increased efficiency in the manufacturing process even when the internal terminals 22 are unevenly arranged due to the structure of the electronic components to be held by the ceramic wiring member 1.

In this embodiment, the ceramic wiring member 1 is manufactured efficiently while maintaining the reliability of the electrical connection between the frame-shaped portion 21 and the ground terminal 24 by dividing the ceramic wiring member base substrate 100 along the break groove 151.

Furthermore, in the ceramic wiring member 1 of this embodiment, the first notch 41 and the second notch 42 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. This allows the break grooves 151 extending perpendicularly to each other in the ceramic wiring member base plate 100 to be connected at desired positions, thereby suppressing variations in the shape of the ceramic wiring member 1.

Furthermore, in the ceramic wiring member 1 of this embodiment, the first notch 41 and the second notch 42 are positioned biased to one side in the direction along the sides 111 and 121 (Y-axis direction). As a result, even when electronic components are mounted on the ceramic wiring member 1 and sealed by the lid, making the electronic components invisible, the orientation of the electronic components can be determined by the first notch 41 and the second notch 42.

The ceramic wiring member base substrate 100 of the above embodiment can be manufactured, for example, by the following procedure. First, a green sheet to be made into the main body 10 is prepared. Specifically, ceramic powder constituting the main body 10, such as alumina powder, is mixed with resin, solvent, etc., in a ball mill to obtain a slurry. This slurry is processed into a green sheet using the doctor blade method. This gives the green sheet to be made into the main body 10. Multiple green sheets are prepared on the premise that they will be stacked to form the main body 10.

Next, a paste that will become the conductive part 20 is printed onto the prepared green sheet. The paste is made by mixing and kneading a conductive powder such as metal with additives, resin, solvent, etc. This paste is printed onto multiple green sheets, for example by screen printing. Then, the multiple green sheets are stacked to form a laminate having the structure of the desired ceramic wiring member base substrate 100, and first via holes 131 and first through holes 161 are formed. The first via holes 131 are filled with the paste. Furthermore, break grooves 151 are formed, for example by laser irradiation. After that, the ceramic wiring member base substrate 100 can be manufactured by firing the laminate.

Furthermore, the ceramic wiring member 1 of this embodiment can be manufactured by dividing the ceramic wiring member base plate 100 along the break groove 151.

(Embodiment 2)
Next, another embodiment of the present disclosure, Embodiment 2, will be described. Figure 9 is a schematic plan view of the first surface side of the ceramic wiring member base plate in Embodiment 2. Figure 10 is a schematic plan view of the second surface side of the ceramic wiring member base plate in Embodiment 2.

Referring to Figures 9 and 10, and Figures 1 and 2, the ceramic wiring member base plate 100 in Embodiment 2 has basically the same configuration as in Embodiment 1, achieves the same effects, and can be manufactured in the same manner. However, the ceramic wiring member base plate 100 in Embodiment 2 differs from that in Embodiment 1 in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120. The differences from Embodiment 1 will be explained below.

Referring to Figures 9 and 10, the first ceramic wiring member 110 and the second ceramic wiring member 120 constituting the unit structure are positioned offset in the Y-axis direction such that the first side 111 of the first ceramic wiring member 110 and the second side 121 of the second ceramic wiring member 120 overlap by a portion corresponding to 3/4 of their respective lengths. Furthermore, for adjacent unit structures in the direction of the shorter side of the rectangle (X-axis direction), the sides 122 and 112 overlap by 3/4 of their total length. Even when this positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120 is adopted, the same effects as in Embodiment 1 can be obtained. Furthermore, the ceramic wiring member 1 of Embodiment 2 has the same structure as that of Embodiment 1 and achieves the same effects, except that the formation positions of the first notch 41 and the second notch 42 change in the Y-axis direction as a result of the change in the formation position of the first through hole 161 due to the difference in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120.

The embodiments disclosed herein should be understood to be illustrative in all respects and not restrictive in any way. The scope of the invention is defined by the claims and not by the foregoing description, and all modifications within the meaning and scope of the claims are intended to be included.

1 Ceramic wiring member, 10 Main body, 11 Plate-shaped part, 11A First main surface, 11B Second main surface, 12 Frame, 12A First end surface, 12B Second end surface, 20 Conductive part, 21 Frame-shaped part, 22 Internal terminal, 23 External terminal, 24 Ground terminal, 25 Second via conductor, 26 First connection part, 27 Third via conductor, 28 First via conductor, 29 Second connection part, 31 First groove, 41 First notch, 42 Second notch, 43 Third notch, 44 Fourth notch, 45 Fifth notch, 46 Sixth notch, 50 Cavity, 71-74 Sides, 91 Straight line, 100 Ceramic wiring member base plate, 100A First surface, 100B Second surface, 110 First ceramic wiring member, sides 111-114, both ends 111A, 111B, 120 Second ceramic wiring member, sides 121-124, both ends 121A, 121B, 131 First via hole, 151 Break groove, 161 First through hole.

Claims (6)

A ceramic wiring substrate having a first surface which is one surface in the thickness direction and a second surface which is the surface opposite to the first surface in the thickness direction, and having a rectangular shape when viewed in the thickness direction, wherein a plurality of ceramic wiring members are laid out and connected together,
The plurality of ceramic wiring members are
First ceramic wiring member and
The first ceramic wiring member is connected to a second ceramic wiring member,
Each of the first ceramic wiring member and the second ceramic wiring member is,
A ceramic body having a plate-like portion,
Includes a conductive part that is positioned in contact with the main body,
The conductive part is
In the plan view of the first surface,
A frame-shaped portion is arranged in a ring shape on the main body along the outer circumference of the rectangle,
It includes a pair of internal terminals arranged on the area of the main body surrounded by the frame-shaped portion,
In the plan view of the second surface,
A pair of external terminals are arranged on the main body, separated from each other,
It includes a ground terminal located on the main body, separate from the pair of external terminals,
One of the pair of internal terminals and one of the pair of external terminals are electrically connected.
The other of the pair of internal terminals and the other of the pair of external terminals are electrically connected.
Break grooves are formed on at least one of the first surface and the second surface, extending along each side of the rectangle of the adjacent plurality of ceramic wiring members.
The first ceramic wiring member and the second ceramic wiring member are arranged such that one side of the rectangle of the first ceramic wiring member, which is a first side, and one side of the rectangle of the second ceramic wiring member, which is a second side, partially overlap, but the ends of the first side and the ends of the second side do not overlap.
In the region where the first side and the second side overlap, a first via hole is formed that penetrates the ceramic wiring member base substrate in the thickness direction.
The conductive portion is formed on the wall surface surrounding the first via hole and further includes a first via conductor that connects the ground terminal of the first ceramic wiring member and the second ceramic wiring member to the frame-shaped portion of the first ceramic wiring member and the second ceramic wiring member.
The first ceramic wiring member and the second ceramic wiring member are arranged point-symmetrically with respect to the first via conductor when viewed in the thickness direction of the ceramic wiring member base substrate.
The plurality of ceramic wiring members are constructed by using the first ceramic wiring member and the second ceramic wiring member, which are connected to each other, as unit structures, and arranging these unit structures without any gaps.
In a plan view of the first surface, the first via hole is located outside the inner circumference of the frame-shaped portion, on the ceramic wiring substrate. The ceramic wiring member matrix according to claim 1, wherein a first through-hole is formed at each vertex of the rectangle of the plurality of ceramic wiring members, extending from the first surface to the second surface. In the plan view of the first surface,
The ceramic wiring member base substrate according to claim 1 or claim 2, wherein the pair of internal terminals of the first ceramic wiring member and the pair of internal terminals of the second ceramic wiring member are arranged in a manner that is offset from each other in opposite directions in the direction along the first side and the second side within the region surrounded by the frame-shaped portion. A ceramic wiring member comprising a ceramic main body having a plate-like portion and a conductive portion positioned in contact with the main body, wherein the ceramic wiring member has a rectangular shape when viewed in a direction perpendicular to the plate-like portion,
The plate-like portion has a first main surface which is one of the main surfaces in the thickness direction, and a second main surface which is located on the opposite side of the first main surface in the thickness direction.
The conductive part is
In the plan view of the first main surface,
A frame-shaped portion is arranged in a ring shape on the main body along the outer circumference of the rectangle,
It includes a pair of internal terminals arranged on the area of the main body surrounded by the frame-shaped portion,
In the plan view of the second main surface,
A pair of external terminals are arranged on the main body, separated from each other,
It includes a ground terminal located on the main body, separate from the pair of external terminals,
One of the pair of internal terminals and one of the pair of external terminals are electrically connected.
The other of the pair of internal terminals and the other of the pair of external terminals are electrically connected.
The outer circumference of the main body is
A first groove is formed that penetrates the main body in the thickness direction, away from the vertices of the rectangle.
The conductive portion further includes a first via conductor formed on the wall surface of the first groove and connecting the ground terminal and the frame-shaped portion.
In at least one of the plan view of the first main surface and the plan view of the second main surface, the outer circumference of the ceramic wiring member is
A first notch is formed on the third side of the rectangle in which the first groove is formed, away from the vertex,
A second notch is formed on the fourth side opposite the third side, away from the vertex,
The first notch and the second notch are located on the same straight line perpendicular to the third side and the fourth side,
In a plan view of the first main surface, the first groove is located outside the inner circumference of the frame-shaped portion, in the ceramic wiring member. The ceramic wiring member according to claim 4, wherein the first and second notches penetrate the ceramic wiring member in the thickness direction of the main body. The ceramic wiring member according to claim 4 or 5, wherein the first and second notches are arranged with an bias to one side in the direction along the third and fourth sides.