JP7798807B2 - 電波吸収体、および電波吸収体の製造方法 - Google Patents

電波吸収体、および電波吸収体の製造方法

Info

Publication number
JP7798807B2
JP7798807B2 JP2022576759A JP2022576759A JP7798807B2 JP 7798807 B2 JP7798807 B2 JP 7798807B2 JP 2022576759 A JP2022576759 A JP 2022576759A JP 2022576759 A JP2022576759 A JP 2022576759A JP 7798807 B2 JP7798807 B2 JP 7798807B2
Authority
JP
Japan
Prior art keywords
radio wave
dielectric layer
thickness
frequency
absorbed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022576759A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022158562A1 (https=
JPWO2022158562A5 (https=
Inventor
将之 豊田
真男 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Ltd filed Critical Maxell Ltd
Publication of JPWO2022158562A1 publication Critical patent/JPWO2022158562A1/ja
Publication of JPWO2022158562A5 publication Critical patent/JPWO2022158562A5/ja
Application granted granted Critical
Publication of JP7798807B2 publication Critical patent/JP7798807B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
JP2022576759A 2021-01-22 2022-01-21 電波吸収体、および電波吸収体の製造方法 Active JP7798807B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021008913 2021-01-22
JP2021008913 2021-01-22
PCT/JP2022/002171 WO2022158562A1 (ja) 2021-01-22 2022-01-21 電波吸収体、および電波吸収体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022158562A1 JPWO2022158562A1 (https=) 2022-07-28
JPWO2022158562A5 JPWO2022158562A5 (https=) 2023-10-17
JP7798807B2 true JP7798807B2 (ja) 2026-01-14

Family

ID=82548785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576759A Active JP7798807B2 (ja) 2021-01-22 2022-01-21 電波吸収体、および電波吸収体の製造方法

Country Status (3)

Country Link
US (1) US12349328B2 (https=)
JP (1) JP7798807B2 (https=)
WO (1) WO2022158562A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250063707A1 (en) * 2023-08-16 2025-02-20 Awl-Electricity Inc Assembly for electric field generation or electric field conversion via capacitive coupling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
JP2020145278A (ja) 2019-03-05 2020-09-10 出光興産株式会社 電磁波吸収シート及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018088492A1 (ja) 2016-11-10 2018-05-17 マクセルホールディングス株式会社 電磁波吸収シート
EP3595422B1 (en) * 2017-03-10 2024-11-27 Maxell, Ltd. Electromagnetic wave absorbing sheet
JP6524356B1 (ja) * 2017-10-19 2019-06-05 関西ペイント株式会社 ミリ波帯域用電波吸収シート及びミリ波電波吸収方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
JP2020145278A (ja) 2019-03-05 2020-09-10 出光興産株式会社 電磁波吸収シート及びその製造方法

Also Published As

Publication number Publication date
JPWO2022158562A1 (https=) 2022-07-28
WO2022158562A1 (ja) 2022-07-28
US20240098954A1 (en) 2024-03-21
US12349328B2 (en) 2025-07-01

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