JP7794844B2 - 放熱部材および電子装置 - Google Patents

放熱部材および電子装置

Info

Publication number
JP7794844B2
JP7794844B2 JP2023556433A JP2023556433A JP7794844B2 JP 7794844 B2 JP7794844 B2 JP 7794844B2 JP 2023556433 A JP2023556433 A JP 2023556433A JP 2023556433 A JP2023556433 A JP 2023556433A JP 7794844 B2 JP7794844 B2 JP 7794844B2
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation member
copper
diamond
diamond particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023556433A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023074633A1 (https=
JPWO2023074633A5 (https=
Inventor
基 永沢
孝眞 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023074633A1 publication Critical patent/JPWO2023074633A1/ja
Publication of JPWO2023074633A5 publication Critical patent/JPWO2023074633A5/ja
Application granted granted Critical
Publication of JP7794844B2 publication Critical patent/JP7794844B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023556433A 2021-10-29 2022-10-24 放熱部材および電子装置 Active JP7794844B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021177306 2021-10-29
JP2021177306 2021-10-29
PCT/JP2022/039554 WO2023074633A1 (ja) 2021-10-29 2022-10-24 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023074633A1 JPWO2023074633A1 (https=) 2023-05-04
JPWO2023074633A5 JPWO2023074633A5 (https=) 2024-05-24
JP7794844B2 true JP7794844B2 (ja) 2026-01-06

Family

ID=86157840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556433A Active JP7794844B2 (ja) 2021-10-29 2022-10-24 放熱部材および電子装置

Country Status (2)

Country Link
JP (1) JP7794844B2 (https=)
WO (1) WO2023074633A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021168376A (ja) 2020-01-31 2021-10-21 日亜化学工業株式会社 放熱基板の製造方法及び複合基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4148123B2 (ja) * 2003-12-08 2008-09-10 三菱マテリアル株式会社 放熱体及びパワーモジュール
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2013098491A (ja) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP6429108B2 (ja) * 2013-10-16 2018-11-28 株式会社アライドマテリアル 半導体素子実装用基板とそれを用いた半導体素子装置
CN111727266B (zh) * 2018-02-14 2021-11-02 住友电气工业株式会社 复合部件以及复合部件的制造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021168376A (ja) 2020-01-31 2021-10-21 日亜化学工業株式会社 放熱基板の製造方法及び複合基板の製造方法

Also Published As

Publication number Publication date
JPWO2023074633A1 (https=) 2023-05-04
WO2023074633A1 (ja) 2023-05-04

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