JP7772256B2 - コンデンサ内蔵基板 - Google Patents
コンデンサ内蔵基板Info
- Publication number
- JP7772256B2 JP7772256B2 JP2024565264A JP2024565264A JP7772256B2 JP 7772256 B2 JP7772256 B2 JP 7772256B2 JP 2024565264 A JP2024565264 A JP 2024565264A JP 2024565264 A JP2024565264 A JP 2024565264A JP 7772256 B2 JP7772256 B2 JP 7772256B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- capacitor
- conductor
- hole
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023123477 | 2023-07-28 | ||
| JP2023123477 | 2023-07-28 | ||
| PCT/JP2024/025509 WO2025028242A1 (ja) | 2023-07-28 | 2024-07-16 | コンデンサ内蔵基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025028242A1 JPWO2025028242A1 (https=) | 2025-02-06 |
| JPWO2025028242A5 JPWO2025028242A5 (https=) | 2025-07-08 |
| JP7772256B2 true JP7772256B2 (ja) | 2025-11-18 |
Family
ID=94395189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024565264A Active JP7772256B2 (ja) | 2023-07-28 | 2024-07-16 | コンデンサ内蔵基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250201486A1 (https=) |
| JP (1) | JP7772256B2 (https=) |
| CN (1) | CN120035873A (https=) |
| TW (1) | TWI885959B (https=) |
| WO (1) | WO2025028242A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020167361A (ja) | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| WO2021241325A1 (ja) | 2020-05-28 | 2021-12-02 | 株式会社村田製作所 | モジュール |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07221458A (ja) * | 1994-01-27 | 1995-08-18 | Cmk Corp | 多層プリント配線板 |
| TWI831226B (zh) * | 2021-07-16 | 2024-02-01 | 日商村田製作所股份有限公司 | 電容器 |
| CN119173972A (zh) * | 2022-05-13 | 2024-12-20 | 株式会社村田制作所 | 电容器 |
-
2024
- 2024-06-19 TW TW113122655A patent/TWI885959B/zh active
- 2024-07-16 CN CN202480004339.0A patent/CN120035873A/zh active Pending
- 2024-07-16 WO PCT/JP2024/025509 patent/WO2025028242A1/ja active Pending
- 2024-07-16 JP JP2024565264A patent/JP7772256B2/ja active Active
-
2025
- 2025-03-06 US US19/072,257 patent/US20250201486A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020167361A (ja) | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| WO2021241325A1 (ja) | 2020-05-28 | 2021-12-02 | 株式会社村田製作所 | モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120035873A (zh) | 2025-05-23 |
| TW202505953A (zh) | 2025-02-01 |
| WO2025028242A1 (ja) | 2025-02-06 |
| US20250201486A1 (en) | 2025-06-19 |
| TWI885959B (zh) | 2025-06-01 |
| JPWO2025028242A1 (https=) | 2025-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241106 |
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| A621 | Written request for application examination |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20251007 |
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| A61 | First payment of annual fees (during grant procedure) |
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| R150 | Certificate of patent or registration of utility model |
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