JP7750635B2 - 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体 - Google Patents

硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

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Publication number
JP7750635B2
JP7750635B2 JP2022543302A JP2022543302A JP7750635B2 JP 7750635 B2 JP7750635 B2 JP 7750635B2 JP 2022543302 A JP2022543302 A JP 2022543302A JP 2022543302 A JP2022543302 A JP 2022543302A JP 7750635 B2 JP7750635 B2 JP 7750635B2
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component
heat dissipation
mass
group
curable organopolysiloxane
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JPWO2022038888A1 (https=
Inventor
健治 太田
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Dow Toray Co Ltd
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Dow Toray Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022543302A 2020-08-21 2021-06-21 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体 Active JP7750635B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020139762 2020-08-21
JP2020139762 2020-08-21
PCT/JP2021/023451 WO2022038888A1 (ja) 2020-08-21 2021-06-21 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

Publications (2)

Publication Number Publication Date
JPWO2022038888A1 JPWO2022038888A1 (https=) 2022-02-24
JP7750635B2 true JP7750635B2 (ja) 2025-10-07

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JP2022543302A Active JP7750635B2 (ja) 2020-08-21 2021-06-21 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

Country Status (7)

Country Link
US (1) US12454615B2 (https=)
EP (1) EP4203012A4 (https=)
JP (1) JP7750635B2 (https=)
KR (1) KR20230053635A (https=)
CN (1) CN115885381A (https=)
TW (1) TW202219185A (https=)
WO (1) WO2022038888A1 (https=)

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KR20240008853A (ko) * 2021-05-17 2024-01-19 헨켈 아게 운트 코. 카게아아 열 전도성 실리콘 조성물
JP7778030B2 (ja) * 2022-04-06 2025-12-01 旭化成ワッカーシリコーン株式会社 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
CN115109562B (zh) * 2022-08-09 2024-03-12 广州白云科技股份有限公司 一种双组分高散热高导电有机硅灌封胶及其制备方法
WO2025080439A1 (en) * 2023-10-13 2025-04-17 Henkel Ag & Co. Kgaa Thermally conductive silicone adhesive
TWI902358B (zh) * 2024-07-19 2025-10-21 台虹應用材料股份有限公司 用於巨量轉移的黏著劑組成物及膠膜結構
CN119570115B (zh) * 2024-12-03 2025-12-26 深圳市新亚新材料有限公司 一种复合导热填料及其制备方法、导热硅橡胶及其制备方法及导热硅橡胶的应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002092693A1 (en) 2001-05-14 2002-11-21 Dow Corning Toray Silicone Co., Ltd. Heat-conductive silicone composition
JP2006274155A (ja) 2005-03-30 2006-10-12 Dow Corning Toray Co Ltd 熱伝導性シリコーンゴム組成物
JP2008239719A (ja) 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
WO2016038836A1 (ja) 2014-09-10 2016-03-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2019021825A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2019021824A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2019061290A1 (en) 2017-09-29 2019-04-04 Dow Silicones Corporation SILICONE COMPOSITION COMPRISING A LOAD
WO2020093258A1 (en) 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used

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JPS528854B2 (https=) 1972-01-13 1977-03-11
JP3831481B2 (ja) 1996-11-18 2006-10-11 東レ・ダウコーニング株式会社 カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5445415B2 (ja) * 2010-09-21 2014-03-19 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物及び熱伝導性シリコーンエラストマー成形品
TW201439264A (zh) * 2012-12-20 2014-10-16 道康寧公司 製造電子裝置的方法
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002092693A1 (en) 2001-05-14 2002-11-21 Dow Corning Toray Silicone Co., Ltd. Heat-conductive silicone composition
JP2006274155A (ja) 2005-03-30 2006-10-12 Dow Corning Toray Co Ltd 熱伝導性シリコーンゴム組成物
JP2008239719A (ja) 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
WO2016038836A1 (ja) 2014-09-10 2016-03-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2019021825A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2019021824A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2019061290A1 (en) 2017-09-29 2019-04-04 Dow Silicones Corporation SILICONE COMPOSITION COMPRISING A LOAD
WO2020093258A1 (en) 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used

Also Published As

Publication number Publication date
WO2022038888A1 (ja) 2022-02-24
KR20230053635A (ko) 2023-04-21
TW202219185A (zh) 2022-05-16
US12454615B2 (en) 2025-10-28
CN115885381A (zh) 2023-03-31
EP4203012A1 (en) 2023-06-28
JPWO2022038888A1 (https=) 2022-02-24
US20230357571A1 (en) 2023-11-09
EP4203012A4 (en) 2024-10-09

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