JP7660676B2 - 配線基板、電子部品収納用パッケージ及び電子装置 - Google Patents

配線基板、電子部品収納用パッケージ及び電子装置 Download PDF

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Publication number
JP7660676B2
JP7660676B2 JP2023530429A JP2023530429A JP7660676B2 JP 7660676 B2 JP7660676 B2 JP 7660676B2 JP 2023530429 A JP2023530429 A JP 2023530429A JP 2023530429 A JP2023530429 A JP 2023530429A JP 7660676 B2 JP7660676 B2 JP 7660676B2
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Japan
Prior art keywords
recess
signal electrode
ground conductor
arc
wiring board
Prior art date
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JP2023530429A
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English (en)
Japanese (ja)
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JPWO2022270429A1 (https=
JPWO2022270429A5 (https=
Inventor
茂典 高谷
朋哉 今
匡祐 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Publication of JPWO2022270429A5 publication Critical patent/JPWO2022270429A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023530429A 2021-06-21 2022-06-17 配線基板、電子部品収納用パッケージ及び電子装置 Active JP7660676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021102349 2021-06-21
JP2021102349 2021-06-21
PCT/JP2022/024287 WO2022270429A1 (ja) 2021-06-21 2022-06-17 配線基板、電子部品収納用パッケージ及び電子装置

Publications (3)

Publication Number Publication Date
JPWO2022270429A1 JPWO2022270429A1 (https=) 2022-12-29
JPWO2022270429A5 JPWO2022270429A5 (https=) 2024-03-25
JP7660676B2 true JP7660676B2 (ja) 2025-04-11

Family

ID=84545692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023530429A Active JP7660676B2 (ja) 2021-06-21 2022-06-17 配線基板、電子部品収納用パッケージ及び電子装置

Country Status (5)

Country Link
US (1) US20240292530A1 (https=)
JP (1) JP7660676B2 (https=)
CN (1) CN117546613A (https=)
TW (1) TW202310686A (https=)
WO (1) WO2022270429A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238640A (ja) 2011-05-10 2012-12-06 Shinko Electric Ind Co Ltd 光半導体素子用パッケージ及び光半導体装置
JP2014197086A (ja) 2013-03-29 2014-10-16 コニカミノルタ株式会社 光通信用モジュール又は光通信ユニット
WO2020138209A1 (ja) 2018-12-26 2020-07-02 京セラ株式会社 配線基体、電子部品収納用パッケージおよび電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3570887B2 (ja) * 1998-04-28 2004-09-29 京セラ株式会社 高周波用配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238640A (ja) 2011-05-10 2012-12-06 Shinko Electric Ind Co Ltd 光半導体素子用パッケージ及び光半導体装置
JP2014197086A (ja) 2013-03-29 2014-10-16 コニカミノルタ株式会社 光通信用モジュール又は光通信ユニット
WO2020138209A1 (ja) 2018-12-26 2020-07-02 京セラ株式会社 配線基体、電子部品収納用パッケージおよび電子装置

Also Published As

Publication number Publication date
JPWO2022270429A1 (https=) 2022-12-29
TW202310686A (zh) 2023-03-01
CN117546613A (zh) 2024-02-09
US20240292530A1 (en) 2024-08-29
WO2022270429A1 (ja) 2022-12-29

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