JP7564092B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP7564092B2 JP7564092B2 JP2021510569A JP2021510569A JP7564092B2 JP 7564092 B2 JP7564092 B2 JP 7564092B2 JP 2021510569 A JP2021510569 A JP 2021510569A JP 2021510569 A JP2021510569 A JP 2021510569A JP 7564092 B2 JP7564092 B2 JP 7564092B2
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- JP
- Japan
- Prior art keywords
- transistor
- oxide
- insulator
- conductor
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/06—Modifications for ensuring a fully conducting state
- H03K17/063—Modifications for ensuring a fully conducting state in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0175—Coupling arrangements; Interface arrangements
- H03K19/0185—Coupling arrangements; Interface arrangements using field effect transistors only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/094—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/094—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
- H03K19/0944—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/06—Modifications for ensuring a fully conducting state
- H03K2017/066—Maximizing the OFF-resistance instead of minimizing the ON-resistance
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/0036—Means reducing energy consumption
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
- H10D30/797—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being in source or drain regions, e.g. SiGe source or drain
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Logic Circuits (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electronic Switches (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024167141A JP7767543B2 (ja) | 2019-03-29 | 2024-09-26 | 半導体装置 |
| JP2025182217A JP2026003064A (ja) | 2019-03-29 | 2025-10-29 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019066785 | 2019-03-29 | ||
| JP2019066785 | 2019-03-29 | ||
| PCT/IB2020/052186 WO2020201860A1 (ja) | 2019-03-29 | 2020-03-12 | 単極性トランジスタを用いて構成された論理回路、および、半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024167141A Division JP7767543B2 (ja) | 2019-03-29 | 2024-09-26 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020201860A1 JPWO2020201860A1 (https=) | 2020-10-08 |
| JPWO2020201860A5 JPWO2020201860A5 (ja) | 2023-03-06 |
| JP7564092B2 true JP7564092B2 (ja) | 2024-10-08 |
Family
ID=72666570
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021510569A Active JP7564092B2 (ja) | 2019-03-29 | 2020-03-12 | 半導体装置 |
| JP2024167141A Active JP7767543B2 (ja) | 2019-03-29 | 2024-09-26 | 半導体装置 |
| JP2025182217A Pending JP2026003064A (ja) | 2019-03-29 | 2025-10-29 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024167141A Active JP7767543B2 (ja) | 2019-03-29 | 2024-09-26 | 半導体装置 |
| JP2025182217A Pending JP2026003064A (ja) | 2019-03-29 | 2025-10-29 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11777502B2 (https=) |
| JP (3) | JP7564092B2 (https=) |
| WO (1) | WO2020201860A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7554673B2 (ja) * | 2018-12-20 | 2024-09-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7578594B2 (ja) * | 2019-07-05 | 2024-11-06 | 株式会社半導体エネルギー研究所 | 半導体装置、蓄電装置および半導体装置の動作方法 |
| CN116345891A (zh) * | 2021-12-22 | 2023-06-27 | 群创光电股份有限公司 | 电压转换器电路 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003115758A (ja) | 2001-10-03 | 2003-04-18 | Nec Corp | サンプリングレベル変換回路と2相及び多相展開回路並びに表示装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857984A (en) * | 1984-12-26 | 1989-08-15 | Hughes Aircraft Company | Three-terminal MOS integrated circuit switch |
| JPS61264820A (ja) | 1985-05-20 | 1986-11-22 | Fujitsu Ltd | ダイナミツク論理回路 |
| US5694061A (en) | 1995-03-27 | 1997-12-02 | Casio Computer Co., Ltd. | Semiconductor device having same conductive type MIS transistors, a simple circuit design, and a high productivity |
| JP2939865B2 (ja) | 1995-07-03 | 1999-08-25 | カシオ計算機株式会社 | 薄膜半導体装置およびそれを用いた表示装置 |
| JP3092506B2 (ja) | 1995-03-27 | 2000-09-25 | カシオ計算機株式会社 | 半導体装置およびこれを用いた表示駆動装置 |
| JP3734664B2 (ja) * | 2000-02-24 | 2006-01-11 | 株式会社日立製作所 | 表示デバイス |
| JP4785271B2 (ja) | 2001-04-27 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 液晶表示装置、電子機器 |
| US6788108B2 (en) | 2001-07-30 | 2004-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101721850B1 (ko) * | 2009-11-13 | 2017-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011070929A1 (en) * | 2009-12-11 | 2011-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| JP5447102B2 (ja) * | 2010-03-31 | 2014-03-19 | ソニー株式会社 | インバータ回路および表示装置 |
| US8300039B2 (en) | 2010-03-30 | 2012-10-30 | Sony Corporation | Inverter circuit and display |
| WO2012029638A1 (en) | 2010-09-03 | 2012-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN102789808B (zh) | 2011-05-20 | 2018-03-06 | 株式会社半导体能源研究所 | 存储器装置和用于驱动存储器装置的方法 |
| US8994439B2 (en) | 2012-04-19 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, image display device, storage device, and electronic device |
| JP6581765B2 (ja) | 2013-10-02 | 2019-09-25 | 株式会社半導体エネルギー研究所 | ブートストラップ回路、およびブートストラップ回路を有する半導体装置 |
| US9450581B2 (en) | 2014-09-30 | 2016-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, semiconductor device, electronic component, and electronic device |
| US9520872B2 (en) * | 2014-12-23 | 2016-12-13 | Qualcomm Incorporated | Linear equalizer with variable gain |
| US9935633B2 (en) | 2015-06-30 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, semiconductor device, electronic component, and electronic device |
| KR102588078B1 (ko) | 2016-11-21 | 2023-10-13 | 엘지디스플레이 주식회사 | 표시장치 |
| JP2018093483A (ja) | 2016-11-29 | 2018-06-14 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置及び電子機器 |
| JP7359754B2 (ja) | 2018-04-20 | 2023-10-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7554673B2 (ja) * | 2018-12-20 | 2024-09-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US11005475B1 (en) * | 2020-01-06 | 2021-05-11 | Innolux Corporation | Emission driver and pump unit |
-
2020
- 2020-03-12 JP JP2021510569A patent/JP7564092B2/ja active Active
- 2020-03-12 WO PCT/IB2020/052186 patent/WO2020201860A1/ja not_active Ceased
- 2020-03-12 US US17/441,804 patent/US11777502B2/en active Active
-
2024
- 2024-09-26 JP JP2024167141A patent/JP7767543B2/ja active Active
-
2025
- 2025-10-29 JP JP2025182217A patent/JP2026003064A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003115758A (ja) | 2001-10-03 | 2003-04-18 | Nec Corp | サンプリングレベル変換回路と2相及び多相展開回路並びに表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020201860A1 (ja) | 2020-10-08 |
| JP7767543B2 (ja) | 2025-11-11 |
| JP2025000776A (ja) | 2025-01-07 |
| US11777502B2 (en) | 2023-10-03 |
| US20220173737A1 (en) | 2022-06-02 |
| JPWO2020201860A1 (https=) | 2020-10-08 |
| JP2026003064A (ja) | 2026-01-08 |
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