JP7561842B2 - Ledディスプレイ装置 - Google Patents

Ledディスプレイ装置 Download PDF

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Publication number
JP7561842B2
JP7561842B2 JP2022524054A JP2022524054A JP7561842B2 JP 7561842 B2 JP7561842 B2 JP 7561842B2 JP 2022524054 A JP2022524054 A JP 2022524054A JP 2022524054 A JP2022524054 A JP 2022524054A JP 7561842 B2 JP7561842 B2 JP 7561842B2
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Prior art keywords
light
light emitting
emitting
led subunit
type semiconductor
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JP2022524054A
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English (en)
Japanese (ja)
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JP2022553986A5 (OSRAM
JP2022553986A (ja
Inventor
ミン ジャン,ジョン
ヨン キム,チャン
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Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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Priority claimed from US17/075,636 external-priority patent/US11810944B2/en
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of JP2022553986A publication Critical patent/JP2022553986A/ja
Publication of JP2022553986A5 publication Critical patent/JP2022553986A5/ja
Priority to JP2024163598A priority Critical patent/JP7863146B2/ja
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Publication of JP7561842B2 publication Critical patent/JP7561842B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/34—Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/852—Encapsulations
    • H10H29/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/962—Stacked configurations of light-emitting semiconductor components or devices, the components or devices emitting at different wavelengths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
JP2022524054A 2019-10-23 2020-10-21 Ledディスプレイ装置 Active JP7561842B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024163598A JP7863146B2 (ja) 2019-10-23 2024-09-20 Ledディスプレイ装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962924737P 2019-10-23 2019-10-23
US62/924,737 2019-10-23
US17/075,636 2020-10-20
US17/075,636 US11810944B2 (en) 2019-10-23 2020-10-20 LED display apparatus
PCT/KR2020/014397 WO2021080311A1 (ko) 2019-10-23 2020-10-21 Led 디스플레이 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024163598A Division JP7863146B2 (ja) 2019-10-23 2024-09-20 Ledディスプレイ装置

Publications (3)

Publication Number Publication Date
JP2022553986A JP2022553986A (ja) 2022-12-27
JP2022553986A5 JP2022553986A5 (OSRAM) 2023-10-19
JP7561842B2 true JP7561842B2 (ja) 2024-10-04

Family

ID=75311507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524054A Active JP7561842B2 (ja) 2019-10-23 2020-10-21 Ledディスプレイ装置

Country Status (7)

Country Link
US (1) US20230369385A1 (OSRAM)
EP (1) EP4024452A4 (OSRAM)
JP (1) JP7561842B2 (OSRAM)
KR (1) KR20220088675A (OSRAM)
CN (2) CN114467178A (OSRAM)
BR (1) BR112022007494A2 (OSRAM)
MX (1) MX2022003387A (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2022003387A (es) * 2019-10-23 2022-07-01 Seoul Viosys Co Ltd Dispositivo de visualizacion de led.
US12438132B2 (en) 2021-04-14 2025-10-07 Seoul Viosys Co., Ltd. Unit pixel for LED display and LED display apparatus having the same
CN114725150B (zh) * 2022-03-14 2023-10-03 湖南大学 Micro-LED器件及微显示屏
CN114725276B (zh) * 2022-03-14 2023-10-03 湖南大学 Micro-LED分立器件
JP2026511883A (ja) * 2023-03-31 2026-04-14 京東方科技集團股▲ふん▼有限公司 発光デバイス、表示装置、およびバックライト装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016312A (ja) 2000-06-27 2002-01-18 Sanyo Electric Co Ltd 窒化物系半導体素子およびその製造方法
US20030047742A1 (en) 2001-09-11 2003-03-13 Hen Chang Hsiu Package structure of full color LED form by overlap cascaded die bonding
JP2006216933A (ja) 2005-02-03 2006-08-17 Epistar Corp 発光素子及びその製造方法
JP2007227820A (ja) 2006-02-27 2007-09-06 Stanley Electric Co Ltd 半導体装置及びその製造方法
JP2014507804A (ja) 2011-01-28 2014-03-27 ソウル バイオシス カンパニー リミテッド ウエハーレベル発光ダイオードパッケージ及びそれを製造する方法
US20170288093A1 (en) 2016-04-04 2017-10-05 Samsung Electronics Co., Ltd. Led light source module and display device
US20190165207A1 (en) 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190164944A1 (en) 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070170444A1 (en) * 2004-07-07 2007-07-26 Cao Group, Inc. Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
KR101100579B1 (ko) * 2005-01-06 2012-01-13 엘지이노텍 주식회사 반도체 발광 다이오드 및 그의 제조 방법과 반도체 발광다이오드를 이용한 디스플레이의 제조 방법
US10886327B2 (en) * 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552057B2 (en) * 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
MX2022003387A (es) * 2019-10-23 2022-07-01 Seoul Viosys Co Ltd Dispositivo de visualizacion de led.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016312A (ja) 2000-06-27 2002-01-18 Sanyo Electric Co Ltd 窒化物系半導体素子およびその製造方法
US20030047742A1 (en) 2001-09-11 2003-03-13 Hen Chang Hsiu Package structure of full color LED form by overlap cascaded die bonding
JP2006216933A (ja) 2005-02-03 2006-08-17 Epistar Corp 発光素子及びその製造方法
JP2007227820A (ja) 2006-02-27 2007-09-06 Stanley Electric Co Ltd 半導体装置及びその製造方法
JP2014507804A (ja) 2011-01-28 2014-03-27 ソウル バイオシス カンパニー リミテッド ウエハーレベル発光ダイオードパッケージ及びそれを製造する方法
US20170288093A1 (en) 2016-04-04 2017-10-05 Samsung Electronics Co., Ltd. Led light source module and display device
US20190165207A1 (en) 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190164944A1 (en) 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same

Also Published As

Publication number Publication date
CN212934611U (zh) 2021-04-09
JP2022553986A (ja) 2022-12-27
JP2024180402A (ja) 2024-12-26
US20230369385A1 (en) 2023-11-16
EP4024452A1 (en) 2022-07-06
MX2022003387A (es) 2022-07-01
KR20220088675A (ko) 2022-06-28
BR112022007494A2 (pt) 2022-07-12
CN114467178A (zh) 2022-05-10
EP4024452A4 (en) 2023-10-04

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