JP7535930B2 - Bonding apparatus and bonding method - Google Patents

Description

The present invention relates to a bonding device and a bonding method.

In the manufacture of semiconductor devices, a chip bonding technique is used in which a wafer on which many elements are fabricated is diced to separate it into individual semiconductor chips, which are then bonded one by one to a designated position on a lead frame or the like. A bonding device (die bonder) is used for this chip bonding.

Generally, as shown in Figure 8, a bonding device (die bonder) picks up a chip (semiconductor chip) 1 cut from a wafer with a collet 3 at a pickup position P, and transfers (mounts) it to a bonding position Q on a substrate 2 such as a lead frame. The wafer is adhered to a wafer sheet (adhesive sheet 5) stretched over a metal ring (wafer ring), and is cut (divided) into multiple chips 1 by a dicing process.

As shown in FIG. 8, collet 3 can move upward in the direction of arrow A and downward in the direction of arrow B at pick-up position P, upward in the direction of arrow C and downward in the direction of arrow D at bonding position Q, and reciprocate in the directions of arrows E and F between pick-up position P and bonding position Q. Collet 3 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown).

In such a bonding device, it is necessary to replace the collet 3 due to differences in chip 1 size or deterioration of the collet 3. If the collet 3 is replaced, there is a risk that the chip adsorption surface 3a of the collet 3 will be tilted at an arbitrary angle relative to the chip 1.

If the collet is tilted in this way, the chip 1 cannot be stably picked up at the pick-up position P, and at the bonding position Q, the correct pressure cannot be applied to the chip 1 to adhere it to the bonding position on the substrate, etc.

For this reason, in the past, there have been proposals for a semiconductor manufacturing apparatus and a semiconductor device manufacturing method (Patent Document 1), and a bonding apparatus and a bonding method (Patent Document 2), etc., that are capable of detecting the inclination of a collet after replacing the collet.

In Patent Document 1, a fingerprint sensor is used to check the installation state (tilt) of the collet. In Patent Document 2, protrusions are provided at positions where the collet can come into contact, and the inclination of the collet is determined based on the heights of multiple points of the collet when they come into contact with the protrusions.

JP 2019-75446 A JP 2016-139629 A

However, the devices described in Patent Documents 1 and 2 detect (sense) the inclination of the collet. Therefore, in these devices, the inclination of the collet alone is enough to determine that the collet is not installed correctly.

However, if the collet is made of an elastically deformable rubber material, it may be possible to use it for production (bonding) even if it is tilted, as long as the elastic deformation of the collet is completed by a preset pushing amount.

Therefore, in the past, a collet would be judged to be improperly attached simply based on its inclination, and the collet would be temporarily removed from the bonding device (die bonder) and then reattached or a new one would be attached. However, even though it is necessary to individually set the allowable inclination based on the collet size and the load set for production, if the inclination of a collet deemed to be improperly attached is set to a specific value, as described above, unnecessary work (adjustments) would occur, such as reattaching the collet or replacing the collet.

In view of the above problem, the present invention provides a bonding device and bonding method that can determine whether the load that can be produced (production load) is reached with the set pushing amount even if the collet is tilted, and does not require unnecessary work (adjustments).

The bonding device of the present invention is a bonding device equipped with an elastically deformable collet that presses against the chip, and is equipped with a load setting means for setting a production load applied from the collet to the chip, a load applying means for applying a load to the collet, a reaction force detection means for detecting a reaction force acting on the collet from the chip side, a push-in amount detection means for detecting the amount of push-in of the collet when a load is applied to the collet by the load applying means, and a determination means for determining whether the load applied from the collet to the chip reaches the production load set by the load setting means, based on the push-in amount detected by the push-in amount detection means and the reaction force detected by the reaction force detection means.

According to the bonding device of the present invention, the load setting means can set the production load applied to the chip from the collet. Here, the production load is the load that occurs during normal pick-up or bonding. In addition, the load applying means can apply a load to the collet, and can put the collet in a state where it receives a reaction force from the chip side. As a result, the collet is pushed in by that reaction force.

At this time, the reaction force can be detected by the reaction force detection means, and the amount of pushing can be detected by the pushing amount detection means. This allows the determination means to determine whether the load applied to the tip from the collet has reached the production load, based on the pushing amount and the reaction force.

For example, if the collet is tilted by a certain amount, the entire chip contact surface (lower surface) will not touch the chip unless it is pushed in by that certain amount. Moreover, the chip is only subjected to a load (reaction force) that is half the predetermined load of a non-tilted collet. Therefore, if this reaction force can be detected (measured), the tilt can be determined. However, even in such a case (when tilt occurs), the pushing amount may reach the production load, and if so, the pick-up process and bonding process can be performed without correcting the tilt, that is, without reattaching the collet or replacing it with another collet. Here, the pick-up process is a process in which the chip is attracted to the collet, the collet is raised while maintaining the attracted state, and the chip is picked up from the pick-up position. Also, the bonding process is a process in which the chip attracted to the collet is bonded at the bonding position.

The determination means may have a function of calculating the elastic modulus of the collet. In this way, a means capable of calculating the elastic modulus of the collet can detect a defective collet that has deteriorated or been damaged, or, when a collet is replaced, detect that the replaced collet is not optimal for the chip being picked up or bonded (i.e., the wrong collet has been attached).

In this case, the elastic modulus of the collet can be calculated from the production load, an arbitrarily set minimum load that is smaller than the production load, the tip contact area of the collet, the collet height at the production load, and the collet height at the minimum load. This allows the elastic modulus of the collet to be calculated stably.

The bonding device may be a bonding device that picks up a chip by adsorbing it with a collet that elastically deforms at the pick-up position, and bonds the chip adsorbed by the collet that elastically deforms at the bonding position, and the judgment means may make a judgment at least at the bonding position. In this case, the judgment means may also make a judgment at the pick-up position. The production load may be called a pick-up load at the pick-up position, and a bonding load at the bonding position. The pick-up load and the bonding load may be the same or different.

The bonding device may also be one that picks up a chip by suction with a collet that elastically deforms at the pick-up position, bonds the chip that is suctioned with the collet that elastically deforms at the bonding position, and has an intermediate stage to which the chip is transported between the pick-up position and the bonding position, and the judgment means performs judgment at at least one of the pick-up position, the intermediate stage, and the bonding position. In this case, the production load at the pick-up position and the bonding position can be called the pick-up load and the bonding load, just like a device that does not have an intermediate stage. Also, the intermediate stage requires a collet for transporting to the pick-up position and the intermediate stage, and a collet for transporting from the intermediate stage to the bonding position. Therefore, at the intermediate stage, there is a production load for the collet for transporting to the intermediate stage and a production load for the collet for transporting to the bonding position. In this case, these production loads may be the same or different.

The production load at the bonding position can be set to be greater than the production load at the pick-up position and intermediate stage.

The bonding method of the present invention is a bonding method for bonding a chip using an elastically deformable collet that presses the chip, and includes a load setting process for setting a production load to be applied to the chip from the collet, a load application process for applying a load to the collet, a reaction force detection process for detecting a reaction force acting on the collet from the chip side, a push-in amount detection process for detecting the amount of push-in of the collet when a load is applied to the collet in the load application process, and a determination process for determining whether the load applied to the chip from the collet reaches the production load set in the load setting process based on the push-in amount detected in the push-in amount detection process and the reaction force detected in the reaction force detection process.

According to the bonding method of the present invention, the production load applied from the collet to the chip can be set in the load setting process. Also, in the load application process, a load can be applied to the collet, and the collet can be placed in a state where it receives a reaction force from the chip side. As a result, the collet is pushed in by the reaction force.

At this time, the reaction force can be detected in a reaction force detection process, and the amount of pushing can be detected in a push-in amount detection process. As a result, in the judgment process, it can be determined from the push-in amount and reaction force whether the load applied to the tip from the collet has reached the production load.

If the production load is reached in the judgment process, the bonding operation is performed, and if the production load is not reached, the bonding operation is not performed. Here, the bonding operation is a process that includes a pick-up process and a bonding process. Also, the pick-up process is a process of picking up the chip, and the bonding process is a process of bonding the chip.

The present invention can determine whether the load applied to the chip from the collet has reached the production load. Therefore, even if the collet is tilted, if the production load has been reached, the production process (pickup process and bonding process) can be carried out, reducing the frequency of reattaching the collet or installing other collets. Furthermore, existing equipment can be used as the bonding device, and a bonding device and bonding method with excellent productivity can be provided without increasing costs.

2 is a block diagram showing the main configuration of a control unit that performs a pre-processing step before a bonding operation of the bonding apparatus of the present invention. FIG. 3 is a simplified diagram showing a bonding operation of the bonding apparatus of the present invention; 1A is a simplified diagram showing the relationship between a collet and a collet holder, in which FIG. 1A is a simplified diagram showing a state in which the collet is attached to the collet holder without tilting, and FIG. 1B is a simplified diagram showing a state in which the collet is attached to the collet holder with a tilt. FIG. 11 is a graph showing the relationship between reaction load and push-in amount. 2 is a block diagram of a main part showing a pre-process before a bonding operation in the bonding method of the present invention; FIG. FIG. 2 is a flow chart of a pre-process before a bonding operation in the bonding method. 5 is a simplified diagram showing a bonding operation of another bonding apparatus of the present invention. 1 is a simplified diagram showing a bonding operation of a typical bonding apparatus;

The following describes an embodiment of the present invention with reference to Figures 1 to 7.

2 shows a bonding apparatus (die bonder) according to the present invention, which picks up a chip 11 cut out from a wafer at a pick-up position P and transfers (mounts) it to a bonding position Q on a substrate 12 such as a lead frame. The wafer is adhered to a wafer sheet (adhesive sheet 10) stretched over a metal ring (wafer ring), and is cut (divided) into a number of chips 11 by a dicing process. The chips 11 are made from a wafer, and the final product is made by cutting this material into square or rectangular shapes. For this reason, the chips 11 can be square or rectangular.

That is, the bonding device is equipped with a bonding arm (not shown) that can move between a pickup position P and a bonding position Q via a transport means (moving mechanism), and the tip of the bonding arm holds a collet 13 (collet 13 that adsorbs a semiconductor chip 11) attached to a collet holder 14.

In this case, the collet holder 14 can be moved by the movement mechanism in the direction of arrow A and in the direction of arrow B at the pick-up position P, in the direction of arrow C and in the direction of arrow D at the bonding position Q, and in the directions of arrows E and F between the pick-up position P and the bonding position Q. The movement of the movement mechanism in the directions of arrows A, B, C, D, E, and F is controlled by a control means. The movement mechanism can be configured with various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism, and an XYZθ axis stage or a robot arm that can move in the XYZθ directions can be used.

In this embodiment, the process of picking up the chip 11 at the pickup position P via the collet 13 is called the pickup process, the process of bonding the chip 1 at the bonding position Q is called the bonding process, and the process including the pickup process and the bonding process is called the bonding operation.

The collet 13 is an elastically deformable rubber collet or resin collet, and as shown in FIG. 3, a suction hole (not shown) is formed in the lower end surface (suction surface) 13a for suction. A vacuum generator (not shown) is connected to the suction hole via the collet holder 14 and a bonding arm. The air in the suction hole is sucked by driving the vacuum generator, and the chip 11 is vacuum-sucked, and the chip 11 is sucked to the lower end surface 13a of the collet 13. When the vacuum suction (vacuum drawing) is released, the chip 11 is released from the collet 13. The vacuum generator may be one that uses a vacuum pump, or one that uses an ejector system that controls the opening and closing of high-pressure air and releases it from a nozzle to a diffuser to generate negative pressure in the diffusion chamber.

The wafer cut (divided) into many chips 11 is placed, for example, on an XYθ table, and a push-up means equipped with push-up pins is placed on this XYθ table. That is, the push-up means pushes up the chip 11 to be picked up from below, making it easier to peel off from the adhesive sheet. In this state, the chip 11 is attracted to the collet 13 that has been lowered.

As shown in Figs. 3(a) and (b), the collet holder 14 includes a holder body 15 having a fitting recess 15a into which the collet 13 having a rectangular flat shape is fitted, and a shaft portion 16 extending upward from the upper surface of the holder body 15. Fig. 3(a) shows the collet 13 normally attached to the collet holder 14, and Fig. 3(b) shows the collet 13 in a state in which the lower surface (chip contact surface) 13a of the collet 13 is tilted. When the collet 13 is normally attached to the collet holder 14, the chip contact surface 13a can be maintained parallel to the upper surface (collet adsorption surface 11a) of the chip 11 to be adsorbed, and when the chip contact surface 13a is tilted, the chip contact surface 13a is inclined relative to the upper surface (collet adsorption surface 11a) of the chip 11 to be adsorbed.

As shown in FIG. 3(a), the collet 13 is almost never normally attached (with zero tilt) to the collet holder 14. For this reason, if the collet 13 is tilted, even if a specified load is applied to the collet 13, the load (reaction force) may not be applied to the entire chip contact surface 13a. Even if there is a tilt, the load may be applied to the entire chip contact surface 13a.

Therefore, with the bonding device of the present invention, even if the collet 13 is tilted, it is possible to determine whether the load that can be produced (production load) is achieved with the set pushing amount, and unnecessary work (adjustments) is not required.

For this reason, the bonding device according to the present invention has the configuration shown in Fig. 1. That is, this bonding device includes a load setting means 31 for setting the production load applied from the collet 13 to the chip 11, a load applying means 32 for applying a load to the collet 13, a reaction force detection means 33 for detecting a reaction force acting on the collet 13 from the chip side, a push-in amount detection means 34 for detecting the amount of push-in of the collet 13 when a load is applied to the collet 13 by the load applying means 32, and a determination means 35 for determining whether the load applied from the collet 13 to the chip 11 reaches the production load set by the load setting means 31, based on the push-in amount detected by the push-in amount detection means 34 and the reaction force detected by the reaction force detection means.

The production load set by the load setting means 31 is a load for production that is set in advance, and is a pick-up load applied to the chip 11 when picking up the chip 11, and is a bonding load applied to the chip 11 when bonding the chip 11. In this way, by applying the set pickup load to the chip 11, the chip 11 can be stably picked up at the pick-up position, and by applying the set bonding load to the chip 11, the chip 11 can be stably bonded at the bonding position P. Here, being able to stably pick up means that when picking up the chip 11, the entire upper surface of the chip 11 does not come into contact with the chip contact surface 13a of the collet 13, so that the chip to be picked up cannot be picked up, and no unnecessary load is applied to the chip 11, and the chip 11 can be adsorbed to the chip contact surface 13a and peeled off from the adhesive sheet, and being able to stably bond means that the chip 11 can be pressurized to an extent that it can be bonded to a substrate or the like and is not damaged or bent.

A bonding arm is attached to the tip of the bonding head (not shown), and the collet holder 14 is attached to this bonding arm, and the load applying means 32 applies a load to the collet 13 from the bonding arm side via the collet holder 14. The load applying means 32 includes a drive mechanism (not shown) and a power transmission mechanism (not shown) for transmitting the drive force of this drive mechanism from the bonding arm side to the collet 13 via the collet holder 14. Here, the drive mechanism can be composed of various mechanisms such as a ball screw mechanism, a cylinder mechanism, a linear motor mechanism, etc., and the power transmission mechanism can be composed of a link mechanism, a crank mechanism, etc.

The reaction force detection means 33 can be configured with a load cell. Here, a load cell is a load converter that converts an applied load into an electrical signal, and generally includes magnetostrictive, capacitive, gyro, piezoelectric, electromagnetic, tuning fork, and strain gauge types. In this case, it is preferable to use a strain gauge type, which has features such as high accuracy, low influence of temperature changes, long-distance transmission of output as an electrical signal, and small size compared to the load that can be measured.

In this case, for example, the collet holder 14 of the collet 13 is housed in a state suspended from the bonding arm, and a load cell is disposed on the top of this collet holder 14 as a reaction force detection means 33. Therefore, if the load application means 32 is caused to apply a load that presses the chip 11 against the collet while the chip 11 is being attracted to the collet 13, the collet 13 will attempt to rise, and the load cell will receive a rising load (reaction force). As a result, the load cell is pressed against the load cell receiving portion of the bonding arm, and this allows the load cell to detect the reaction force from the chip 11.

The push-in amount detection means 34 can be configured with a displacement sensor (not shown), such as an optical displacement sensor or an ultrasonic displacement sensor.

The determination means 35 can be configured as a computer (not shown). A computer is basically configured with an input means having an input function, an output means having an output function, a storage means having a storage function, a calculation means having a calculation function, and a control means having a control function. The input function is for reading information from the outside into the computer, and the read data and programs are converted into signals in a format suitable for the computer system. The output function is for displaying the results of calculations and stored data to the outside. The storage means is for storing and saving programs, data, processing results, etc. The calculation function is for processing data by calculating and comparing according to program instructions. The control function is for decoding program instructions and issuing instructions to each means, and this control function is for overseeing all the means of the computer.

Input means include keyboards, mice, tablets, microphones, joysticks, scanners, capture boards, etc. Output means include monitors, speakers, printers, etc. Storage means include memory, hard disks, CDs/CD-Rs, PDs/MOs, etc. Calculation means include CPUs, etc., and control means include CPUs and motherboards, etc.

For this reason, such a computer can be used to control each of the means 31, 32, 33, 34 and the transport means (movement mechanism), etc. The load setting means 31 can be configured by the input means.

When performing a bonding operation using a bonding device configured as described above, it is necessary to replace the collet 13 when the chip size to be bonded is changed or when the same collet 13 has been used for a certain time (period). However, the chip contact surface 13a of the replaced collet 13 may be inclined relative to the collet adsorption surface 11a of the chip 11. In such cases, it may not be possible to press the chip 11 with the preset pressing amount.

That is, as shown in FIG. 3(b), if the chip contact surface 13a of the collet 13 has an inclination θ, for example, if the difference between the lowest point 13a1 and the highest point 13a2 of the chip contact surface 13a is a predetermined dimension S (for example, 60 μm), the entire chip contact surface 13a will not come into contact with the collet adsorption surface 11a of the chip 11 unless it is pressed in by this 60 μm. In this case, as shown in FIG. 4, only a load of 30 μm is applied to the collet 13 when it is properly attached (assuming there is no inclination).

As shown in Figure 4, for example, if the collet inclination is 0 μm, the collet push-in amount is 100 μm, and the load cell load (the reaction force that the collet 13 receives from the tip 11 when it is pushed in) is 10 N, pushing the collet 13 in by 50 μm will result in a load cell load of 5 N. In Figure 4, the collet inclination is the difference (predetermined dimension S) between the lowest point 13a1 and the highest point 13a2 of the tip contact surface 13a. Note that in Figure 3(b), the cross-hatched portion indicates the part that is pushed in when a certain reaction force is received.

As can be seen from Figure 4, when the collet inclination is 20 μm, if the push-in amount is 50 μm, the load cell load (reaction force) is about 3 N; when the collet inclination is 40 μm, if the push-in amount is 50 μm, the load cell load (reaction force) is about 1.8 N; when the collet inclination is 60 μm, if the push-in amount is 50 μm, the load cell load (reaction force) is about 1 N; when the collet inclination is 80 μm, if the push-in amount is 50 μm, the load cell load (reaction force) is about 0.4 N; and when the collet inclination is 100 μm, if the push-in amount is 50 μm, the load cell load (reaction force) is about 0.2 N.

Therefore, if the load cell load can be measured, the collet tilt can be determined. In this case, if the production load (production load) is reached at the set push-in amount (e.g., 100 μm), even if the collet 13 is tilted, the bonding operation can be performed without correcting the tilt.

Therefore, with this bonding device, even if the collet 13 is tilted, it is possible to determine whether or not bonding can be performed without correcting the tilt. To do this, first, the collet ground height is measured when a specified low load (minimum load) is applied to a collet whose tilt has been adjusted to within a specified value (for example, a collet whose four corners have a tilt of 10 μm or less) relative to the tilt measurement surface (chip contact surface 13a). Note that the minimum load is the load at which the lowest point 13a1 of the collet 13 comes into contact with the chip 11 and there is a minute amount of indentation, and can be set arbitrarily. In other words, the load at which there is this minute amount of indentation needs only to be smaller than the production load.

Then, switch to the load set for production (for example, in the pick-up process performed at pick-up position P, this is the pick-up load required for picking up, and in the bonding process performed at the bonding position, this is the bonding load required for bonding) and measure the collet ground height.

This allows the rubber elasticity coefficient of the collet 13 to be calculated. In other words, the rubber elasticity coefficient of the collet 13 can be calculated by (production load - minimum load) / collet tip contact surface area / (production load ground contact height - minimum load ground contact height). For this reason, the computer is provided with a table of rubber elasticity coefficients for each production load. Here, the ground contact height is the height from the reference position to the collet 13 (collet height).

Next, a method (pre-process) for determining whether or not bonding can be performed without correcting the inclination even if the collet 13 is inclined will be described. That is, as shown in FIG. 5, this pre-process includes a load setting process 51, a load application process 52, a reaction force detection process 53, a push-in amount detection process 54, and a judgment process 55.

These pre-processing steps will be explained using the flow chart shown in Figure 6. First, the production load is set (step S1). (In the pick-up process performed at the pick-up position, this is the pick-up load required during pick-up, and in the bonding process performed at the bonding position, this is the bonding load required during bonding.)

Next, a load is applied to the collet 13 by the load application means 32 (step S2), and the reaction force (load cell load) received by the collet 13 is detected (step S3). The amount of pushing caused by the reaction force is then detected by the push-in amount detection means 34 (step S4). After that, the process proceeds to step S5, where it is determined whether the production load has been reached. This determination is made using a table stored in the control means.

If it is determined in step S5 that the load has been reached, the process moves to step S6, where the bonding operation is performed (step S6). If it is determined in step S5 that the production load has not been reached, the process moves to step S7, where the bonding operation is not performed, and the operation ends.

The process also proceeds from step S6 to step S7, where it is determined whether to end the bonding operation. If the bonding operation is to be ended, the process ends. If the bonding operation is not to be ended in step S7, the process returns to step S1.

The bonding operation in the flowchart shown in FIG. 6 is a process in which the chip 11 is picked up by the collet 13, which elastically deforms at the pick-up position P, and the chip 11 that is adsorbed by the collet 13, which elastically deforms at the bonding position Q, is bonded.

Therefore, there are production loads at pick-up position P and at bonding position Q, and generally, the production load at bonding position Q is greater than the production load at pick-up position P. In this case, if the production load is applied at bonding position Q, the chip 11 can be stably bonded to the bonding site. Therefore, it is preferable to determine whether the production load has been reached at bonding position Q. However, the bonding device may also be one that determines whether the production load has been reached at pick-up position P. In this case, it may be one that determines whether the production load has been reached only at pick-up position P, or one that determines whether the production load has been reached at pick-up position P and bonding position Q.

In this bonding device, the load setting means 31 can set the production load applied from the collet 13 to the chip 11. In addition, the load applying means 32 can apply a load to the collet 13, making it possible to place the collet 13 in a state in which it receives a reaction force from the chip side. As a result, the collet 13 is pushed in by that reaction force.

At this time, the reaction force can be detected by the reaction force detection means 33, and the amount of pushing can be detected by the pushing amount detection means 34. This allows the determination means 35 to determine, from the pushing and the reaction force, whether the load applied to the tip 11 from the collet 13 has reached the production load.

That is, for example, if the collet 13 is tilted by a certain amount, the entire chip contact surface (lower surface) 13a will not ground (contact) the chip 11 unless it is pushed in by that certain amount. Moreover, the chip 11 is only subjected to half the load (reaction force) of a non-tilted collet 13. Therefore, if this reaction force can be detected (measured), the tilt can be determined. However, even in such cases, the production load may be reached with this pushing amount, and if so, the pick-up process and bonding process can be performed without reattaching the collet 13 or replacing it with another collet 13.

Therefore, the present invention can determine whether the load applied to the chip 11 from the collet 13 has reached the production load. Therefore, even if the collet 13 is tilted, if the production load has been reached, the production process (pick-up process and bonding process) can be performed, reducing the frequency of reattaching the collet 13 or installing another collet 13. Furthermore, existing equipment can be used as the bonding device, and a bonding device and bonding method with excellent productivity can be provided without increasing costs.

In this bonding device, the determination means 35 has a function of calculating the elastic modulus of the collet 13. In this way, the ability to calculate the elastic modulus of the collet 13 makes it possible to detect a defective collet 13 that has deteriorated or been damaged, and to detect when the replaced collet 13 is not optimal for the chip 11 being picked up or bonded (i.e., when the wrong collet 13 is attached).

In this case, the elastic modulus of the collet 13 can be calculated from the production load, an arbitrarily set minimum load smaller than the production load, the tip contact area of the collet 13, the collet height at the production load, and the collet height at the minimum load. This allows the elastic modulus of the collet 13 to be calculated stably.

The calculation of the collet elastic modulus is preferably performed in an area at room temperature, such as the intermediate stage 63 described below, but it may also be performed in the bonding area where the chip 11 is attached. Or it may be performed in both areas. The bonding area is generally heated, which is accompanied by temperature changes and thermal expansion of the collet 13, and so the elastic modulus and reaction force for each amount of depression may not match the calculation results at room temperature. Therefore, it is possible to have two reaction force change tables and change the amount of depression at the start of production (collet at room temperature) and when production is stable (collet heated).

The bonding device shown in Figures 7(a) and (b) has an intermediate stage 63 between a pickup position P and a bonding position Q, to which the chip 11 is transported. That is, the chip 11 is picked up by a pickup side collet 62 at the pickup position P, the chip 11 adsorbed by the pickup side collet 62 is supplied to the intermediate stage 63, the chip 11 supplied to the intermediate stage 63 is picked up by a bonding side collet 64, and the chip 11 adsorbed by the bonding side collet 64 is supplied to a bonding position Q of a substrate 65 or the like. The chip 11 at the pickup position P is divided into many pieces from a wafer 66.

The pickup side collet 62 is connected to an arm (not shown) via a collet holder, and this arm can be driven in the X, Y, Z, and θ directions by a pickup side transport means (not shown). In this case, the pickup side transport means can be configured with a robot arm mechanism, an XYZθ axis stage, etc.

The pickup side collet 62 can move as shown in FIG. 7(a). That is, it can move from the standby position, that is, the upper position between the pickup position P and the intermediate stage 63, along the direction of the arrow C1 to a position above the pickup position P, move from this position down along the direction of the arrow D1 to pick up the chip 11 at the pickup position P, move from this position up along the direction of the arrow D2 to a position above the pickup position P, and move from this position back along the direction of the arrow C2 to the standby position. It can also move from the standby position to a position above the intermediate stage 63 along the direction of the arrow C3, move from this position down along the direction of the arrow D3 to supply the chip to the chip supply position on the intermediate stage 63, move from this position up along the direction of the arrow D4 to a position above the intermediate stage 63, and move from this position back to the standby position along the direction of the arrow C4.

The bonding side collet 64 is connected to an arm (not shown) via a collet holder, and this arm can be driven in the X, Y, Z, and θ directions by the bonding side collet transport means. This bonding side collet transport means can also be composed of a robot arm mechanism, an XYZθ axis stage, etc.

This allows the bonding collet 64 to move as shown in Fig. 7B. It is possible to move from an upper position between the bonding position Q and the intermediate stage 63 along the direction of the arrow E1 to a position above the intermediate stage 63, to move from this position down along the direction of the arrow F1 to pick up the chip 11 on the intermediate stage 63, to move from this position up along the direction of the arrow F2 to a position above the intermediate stage 63, and to move from this position back to the standby position along the direction of the arrow E2. It is also possible to move from the standby position to a position above the bonding position Q along the direction of the arrow E3, to move from this position down along the direction of the arrow F3 to supply the chip 11 to the bonding position Q, to move from this position up along the direction of the arrow F4 to a position above the bonding position Q, and to move from this position back to the standby position along the direction of the arrow E4.

In this bonding device, the pick-up side collet 62 picks up the chip 11 at the pick-up position P and supplies (places) the chip 11 on the intermediate stage 63, while the bonding side collet 64 picks up the chip on the intermediate stage 63 and bonds the chip 11 at the bonding position Q.

For this reason, in a bonding device equipped with an intermediate stage 63, it is sufficient that the judgment means 35 can make a judgment at at least one of the pickup position P, the intermediate stage 63, or the bonding position Q.

In this case, the judgment means 35 may perform judgment at the pick-up position P, the intermediate stage 63, and the bonding position Q, or may perform judgment at any two of the pick-up position P, the intermediate stage 63, and the bonding position Q, or may perform judgment at any one of the pick-up position P, the intermediate stage 63, and the bonding position Q.

The production load at bonding position Q is set to be larger than the production load at other locations. Also, at the intermediate stage 63, the pick-up side collet 62 supplies chip 11 onto the intermediate stage 63, and the bonding side collet 64 picks up chip 11 on the intermediate stage. Therefore, at the intermediate stage 63, there is a production load for the pick-up side collet 62 to supply chips, and a production load for the bonding side collet 64 to pick up chip 11, and these production loads may be different or the same.

Therefore, even if the bonding device has an intermediate stage 63 as shown in FIG. 7, it has the same effect as a bonding device that does not have such an intermediate stage 63.

The present invention is not limited to the above-described embodiment and various modifications are possible. For example, the present bonding apparatus and bonding method are used to manufacture a semiconductor device, but the semiconductor device may be one in which multiple chips 11 are stacked, or one in which a single chip 11 is bonded to a substrate. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices.

The size of the chip contact surface 13a of the collet 13 is preferably smaller than the size of the collet suction surface 11a of the chip 11, but when manufacturing a product in which several chips 11 are stacked, in cases in which the upper chip 11 protrudes (overhangs) beyond the lower chip 11, it is preferable to make the size smaller than the amount of overhang. The shape of the chip contact surface 13a of the collet 13 may also be a square, rectangle (oblong), triangle, pentagon or more. The number, arrangement, aperture, and cross-sectional shape of the suction holes formed in the collet 13 can be changed in various ways depending on the size of the chip 11 to be picked up, etc.

The pre-processing step shown in FIG. 6 is preferably performed when the collet is replaced, but it may also be performed after a predetermined time has elapsed.

In the embodiment, for the sake of simplicity, a two-dimensional tilt has been described as occurring when the chip contact surface 13a of the collet 13 is tilted. However, tilt is not limited to two-dimensional tilt, and can also occur in three dimensions. However, even when there is a three-dimensional tilt, this bonding device and bonding method can be configured to "determine whether the load that can be produced with the set amount of pressure (production load) has been achieved even when the collet is tilted, as in the case of a two-dimensional tilt, and unnecessary work (adjustments) is not required."

11 semiconductor chip 13 collet 31 load setting means 32 load applying means 33 reaction force detection means 34 push-in amount detection means 35 judgment means 51 load setting step 52 load applying step 53 reaction force detection step 54 push-in amount detection step 55 judgment step 62 pickup side collet 63 intermediate stage 64 bonding side collet

Claims (10)

A bonding apparatus comprising an elastically deformable collet for pressing a chip , the collet being replaceably mounted on a collet holder ,
a load setting means for setting a production load applied to the tip from the collet;
A load applying means for applying a load to the collet;
a reaction force detection means for detecting a reaction force acting on the collet from the tip side;
a push-in amount detection means for detecting a push-in amount of the collet when a load is applied to the collet by the load application means;
A bonding apparatus characterized by comprising a judgment means for judging whether or not the load applied to the chip from the collet reaches the production load set by the load setting means, based on the push-in amount detected by the push-in amount detection means and the reaction force detected by the reaction force detection means. The bonding device according to claim 1, characterized in that the determining means has a function of calculating the elastic modulus of the collet. The bonding device according to claim 2, characterized in that the elastic coefficient of the collet is calculated from the production load, an arbitrarily set minimum load smaller than the production load, the chip contact area of the collet, the collet height at the production load, and the collet height at the minimum load. A bonding apparatus that picks up a chip by suction with a collet that elastically deforms at a pickup position, and bonds the chip that is sucked up by the collet that elastically deforms at a bonding position,
4. The bonding apparatus according to claim 1, wherein the determination by the determining means is performed at least at the bonding position. A bonding apparatus that picks up a chip by suction with an elastically deformable collet at a pick-up position, bonds the chip that is sucked by the elastically deformable collet at a bonding position, and has an intermediate stage along which the chip is transported between the pick-up position and the bonding position,
4. The bonding apparatus according to claim 1, wherein the determination by the determination means is performed at least in one of a pick-up position, an intermediate stage, and a bonding position. The bonding apparatus according to claim 5, characterized in that the production load at the bonding position is greater than the production load at the pick-up position and the intermediate stage. A bonding method for bonding a chip using a collet that is replaceably attached to a collet holder and that is elastically deformable to press a chip, comprising:
a load setting step for setting a production load to be applied to the tip from the collet;
a load applying step of applying a load to the collet;
a reaction force detection step of detecting a reaction force acting on the collet from the tip side;
a push-in amount detection step of detecting a push-in amount of the collet when a load is applied to the collet in the load application step;
A bonding method characterized by comprising a judgment process for judging whether or not the load applied to the chip from the collet reaches the production load set in the load setting process based on the push-in amount detected in the push-in amount detection process and the reaction force detected in the reaction force detection process. The bonding method according to claim 7, characterized in that the determination step is performed after replacing the collet. The bonding method according to claim 7 or 8, characterized in that, if the production load is reached in the determination process, a bonding operation is performed. The bonding method according to claim 7 or 8, characterized in that, if the production load is not reached in the determination step, the bonding operation is not performed.

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