JP2019096670A - Semiconductor device manufacturing apparatus and semiconductor device manufacturing method - Google Patents

Abstract

To provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method which can apply a load to be applied to a chip without being affected by variation in hardness of a pressing part elastic body of a collet, joining temperature change, collet size and/or work size (chip size).SOLUTION: A semiconductor device manufacturing method comprises the steps of: applying a load to a collet at a bonding position by load applying means; after completion of deformation of the collet by a load applied to the collet, further applying a load thereby to lift up the collet; comparing a load in the beginning of lifting up with preset load of load application means which is preliminarily set; and calculating excess or deficiency of the preset load to perform bonding of a chip by adjusting the excess or deficiency of the preset load.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method.

  In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are fabricated at once is diced and separated into individual semiconductor chips, which are bonded one by one to a predetermined position such as a lead frame. Is adopted. Then, a die bonder (a manufacturing apparatus of a semiconductor device) is used for this chip bonding.

  As shown in FIG. 6, the semiconductor device manufacturing apparatus includes a bonding arm (not shown) having a collet 3 for adsorbing the semiconductor chip 1 of the supply unit 2 and a confirmation camera for observing the semiconductor chip 1 of the supply unit 2 (not shown). (Not shown) and a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

  The supply unit 2 includes a semiconductor wafer 6 (see FIG. 7), and the semiconductor wafer 6 is divided into a large number of semiconductor chips 1. That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and the dicing sheet is held by an annular frame. Then, the wafer 6 on this dicing sheet is singulated using a circular blade (dicing saw) or the like to form chips 1. Further, the bonding arm holding the collet 3 can be moved between the pick-up position and the bonding position via the transport means.

  Further, in the collet 3, the chip 1 is vacuum-sucked through the suction hole opened in the lower end surface thereof, and the chip 1 is adsorbed on the lower end surface of the collet 3. In addition, if this vacuum suction (vacuum drawing) is cancelled | released, the chip | tip 1 will separate from the collet 3. FIG.

  Next, a method of manufacturing a die semiconductor device using this die bonder will be described. First, the chip 1 to be picked up is observed by the confirmation camera disposed above the supply unit 2 and the collet 3 is positioned above the chip 1 to be picked up, and then the collet 3 is taken as shown by arrow B. Lower to pick up this chip 1. Thereafter, the collet 3 is raised as shown by arrow A.

  Next, the island portion 5 of the lead frame 4 to be bonded is observed with a confirmation camera disposed above the bonding position, and the collet 3 is moved in the arrow E direction. After being positioned, the collet 3 is moved downward as shown by the arrow D to supply the chip 1 to the island portion 5. After the tip is supplied to the island portion 5, the collet 3 is raised as shown by the arrow C, and then returned to the standby position above the pick-up position as shown by the arrow F.

  The collet 3 is raised and lowered in the direction of arrow A on the pickup position P and lowered in the direction of arrow C and lowered in the direction of arrow D by the moving mechanism (not shown). Reciprocation in the directions of arrows E and F between the pickup position P and the bonding position Q is enabled. The movement mechanism controls the movement of the arrows A, B, C, D, E and F by control means (not shown). In addition, as a moving mechanism, it can comprise by various mechanisms, such as a cylinder mechanism, a ball screw mechanism, a linear motor mechanism, and an XYZ axial stage (stage apparatus) can be used.

  By the way, in such a bonding process, pickup is performed with a pickup load set in advance during pickup, and bonding is performed with a bonding load set in advance during bonding.

  Therefore, in the related art, there is one that detects whether a set load is applied to the collet by using a load cell as a load detector (Patent Document 1). Thus, with the load cell, it can be confirmed that the set load is applied to the collet.

  In addition, when such a set load is not monitored, the air pressure can be monitored by a mechanism that applies a load, for example, a mechanism that generates a load by the air pressure. In the case of applying a load by an electric mechanism, it is possible to monitor that a predetermined load is applied to the collet by measuring the load on the output side. That is, in the case where a load is provided by an electric mechanism, the load applied to the collet can be adjusted by voltage control.

JP 2004-200379 A

  The pressing portion of the collet is usually made of elastically deformable rubber, resin or the like. Therefore, when the chip is pressed by the pressing portion of the collet, this pressing portion is elastically deformed. When elastic deformation is performed as described above, even when the set load is applied to the collet, the set load may not be applied to the chip.

  That is, the stopping height of the bonding head that performs the operation of applying a load to the chip may not reach the deformation completion height of the collet due to the load. For this reason, it is necessary to further lower the height after setting the head height, or when the collet surface temperature rises, it is necessary to increase the head height by the collet expansion amount.

  When the load (pickup load or bonding load) set in this way can not be applied, the load becomes excessive and a crack occurs in the chip, or the chip can not be picked up due to insufficient load, or bonding bonding strength is insufficient.

  In addition, when monitoring the air pressure, if piping etc. is damaged, a so-called load drop occurs, resulting in deterioration of bonding quality. Also in the case where a predetermined load is applied to the collet by voltage control, the bonding quality is lowered due to disconnection or the like.

  In the present invention, in view of the above-mentioned subject, hardness of elastic body of pressing portion of collet, bonding temperature change, collet size, work size (chip size), height of bonded body (lead frame or substrate), and / or A semiconductor device manufacturing apparatus and a semiconductor device manufacturing apparatus capable of applying a load to be applied to a chip without being affected by such variation even if the chip height is unevenly mounted in advance on a substrate. Provide a way.

  The apparatus for manufacturing a semiconductor device according to the present invention is a manufacturing apparatus for a semiconductor device including a collet having an elastically deformable pressing portion for pressing a chip, which includes: a load applying unit that applies a load to the collet; The load is applied to the collet, and the load to which the collet rises after the elastic deformation of the collet pressing portion is applied, the rise detecting means for detecting the rise and the collet pressing portion contact the chip The reaction force from the load is input, and load detection means for detecting the load at which the collet has started to rise, the load detection value at the beginning of the rise detected by the load detection means, and the preset load for the load application means And the adjustment means for adjusting the excess or deficiency of the set load when the excess or deficiency is calculated by the calculation means.

  According to the semiconductor device manufacturing apparatus of the present invention, when load is applied to the collet by the load applying means, the collet having the pressing portion which elastically deforms elastically deforms the pressing portion by receiving the reaction force from the chip side. . For this reason, in order to apply the set bonding load to the chip, even when a load is applied to the collet by the load applying means, the set load may not be applied to the chip. Therefore, in the present invention, the load detecting means can detect the load at which the collet starts to rise, and the calculating means can set the preset load of the load applying means and the load detecting means. The excess and deficiency of the set load can be calculated by comparing the detected value with the detected value. When a load is applied to the collet by the load application means, at first, the pressing portion is elastically deformed, and if elastic deformation is performed in this way, the load to be applied by the load application means is not transmitted to the chip. When the elastic deformation is completed and a load is further applied, the collet is lifted (the load applying means is pushed back), and the lifted height is the height to which the load after deformation of the collet is applied. That is, when a load is applied to the collet by the load application means, the load for elastic deformation is subtracted from the load applied to the chip. Therefore, the load applied by the load applying means is corrected in consideration of the load of the elastic deformation. Therefore, excessive or insufficient load to be applied to the chip can be effectively prevented.

  The load application means may apply a pickup load at a pickup position where pickup is performed by a collet, or may apply a bonding load at a bonding position at a collet. As described above, if the load applying means applies the pickup load, the pickup process can be performed without the pickup load becoming excessive or insufficient. Further, if the load applying means applies a bonding load, the bonding process can be performed without the bonding load becoming excessive or insufficient.

  The load detecting means can use a load cell which is a load measuring device. The load cell is a load converter that converts an applied load into an electrical signal, and generally includes a magnetostrictive type, a capacitive type, a gyro type, a piezoelectric type, an electromagnetic type, a tuning fork type, a strain gauge type, and the like. In this case, it is preferable to use a strain gauge type having features such as high accuracy, small influence of temperature change, long-distance transmission with an output electric signal, and small size with respect to measurable load.

  The first method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device in which a chip is picked up by a collet elastically deformed at a pickup position, and a chip adsorbed by a collet elastically deformed at a bonding position is bonded. The collet is lifted by applying load to the collet at the pick-up position, and after the collet is completely deformed by applying a load to the collet, the collet is lifted by further applying a load, and a load at which the collet starts to rise; The excess and deficiency of the preset load is calculated by comparing the preset load of the load giving means, and the excess and deficiency of the preset load is adjusted to pick up the chip.

  According to the first method of manufacturing a semiconductor device of the present invention, when a load is applied to the collet by the load application means, the load for elastic deformation is subtracted from the load applied to the chip. Therefore, the load applied by the load applying means is corrected in consideration of the load of the elastic deformation. Therefore, excessive or insufficient pickup load to be applied to the chip can be effectively prevented.

  A second method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device in which a chip is picked up by a collet elastically deformed at a pickup position, and a chip adsorbed by a collet elastically deformed at a bonding position is bonded. The collet is lifted by applying a load to the collet at the bonding position by a load application means, and a load is applied to the collet to complete the deformation of the collet. The excess and deficiency of the preset load is calculated by comparing the preset load of the load application means, and the excess and deficiency of the preset load is adjusted to bond the chip.

  According to the second method for manufacturing a semiconductor device of the present invention, when a load is applied to the collet by the load application means, the load for elastic deformation is subtracted from the load applied to the chip. Therefore, the load applied by the load applying means is corrected in consideration of the load of the elastic deformation. Therefore, excessive or insufficient bonding load to be applied to the chip can be effectively prevented.

  In the present invention, excessive or insufficient load to be applied to the chip can be effectively prevented. That is, the hardness of the elastic body at the collet pressing portion, the change in bonding temperature, the collet size, the work size (chip size), the height of the object to be bonded (lead frame or substrate), and / or the chip mounted in advance on the substrate Even if there is a variation in height, the load to be applied can be applied to the chip without being affected by such variation, and a stable pickup process and a stable bonding process are possible. In particular, each load can be correctly applied also in a bonding step (for example, a step of starting bonding with a low load and switching to a high load halfway) which switches the load during bonding.

It is a simplified block diagram which shows the manufacturing apparatus of the semiconductor device of this invention. It is principal part simplified sectional drawing of the manufacturing apparatus of the semiconductor device shown in FIG. It is a graph which shows the load given to a chip. It is a flowchart of the manufacturing method of the semiconductor device of this invention. FIG. 6 is a simplified view showing the operation of the semiconductor device manufacturing apparatus of the present invention. FIG. 10 is a simplified view showing the entire manufacturing method of the conventional semiconductor device. It is a simplified perspective view which shows a chip | tip.

  Hereinafter, an embodiment of the present invention will be described based on FIGS. 1 to 5.

  FIG. 5 shows a die bonder (an apparatus for manufacturing a semiconductor device) according to the present invention. The manufacturing apparatus of such a semiconductor device picks up the chip (semiconductor chip) 21 cut out from the wafer by the collet 23 at the pickup position P, and transfers (mounts) it to the bonding position Q of the base material 22 such as a lead frame. It is a thing. The wafer is adhered on a wafer sheet (adhesive sheet 25) stretched in a metal ring (wafer ring), and divided (divided) into a large number of chips 21 by a dicing process.

  As shown in FIG. 5, the collet 23 ascends in the arrow A direction and descends in the arrow B direction on the pickup position P, ascends in the arrow C direction and descends in the arrow D direction on the bonding position Q, and picks up Reciprocation in the directions of arrows E and F between the position P and the bonding position Q is enabled. The collet 23 is attached to a bonding head 34 described later, and the bonding head 34 is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by control means (not shown) to control the movement of the collet 23 in the directions of the arrows A, B, C, D, E and F. The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are connected to each other via a bus with a central processing unit (CPU) as a center. The ROM stores programs and data to be executed by the CPU.

  In this semiconductor device manufacturing apparatus, as shown in FIG. 1, a load application means 30 for applying a load to the collet 23, a rise detection means 31 for detecting the rise of the collet 23, and a load at which the collet 23 has started to rise. Compare the load detection value at the beginning of the rise detected by the load detection means 32 to be detected, the load detection means 32, and the preset load of the load application means, and calculate excess or deficiency of the preset load. The calculating means 33 and the adjusting means 34 for adjusting the excess and deficiency of the set load when the excess and deficiency are calculated by the calculating means 33 are provided.

  As shown in FIG. 2, the load applying means 30 includes an approximately L-shaped arm 35 and a drive mechanism 36 for swinging the arm 35. That is, the arm 35 comprises a first bar 35a extending in the horizontal direction, and a second bar 35b extending from the base end of the first bar 35a so as to be perpendicular to the first bar 35a. A load fulcrum 35c is provided at the corner with the second bar 35b. Also, the first bar 35 a is provided on the top of the bonding head 39 that supports the collet 23.

  The drive mechanism 36 can be configured by various mechanisms such as a ball screw mechanism, a cylinder mechanism, and a linear motor mechanism. That is, by driving of the drive mechanism 36, the second bar 35b receives a load in the direction of arrow G, whereby the arm 35 swings in the direction of arrow H about the load fulcrum 35c, and the first bar 35a is arrow I Receive a load of When the first bar 35 a receives the load of arrow I, the load of arrow I can be applied to the collet 23 through the bonding head 39.

  The collet 23 includes a pressing portion 23 a and a shaft member 23 b that supports the pressing portion 23 a. The shaft member 23b includes a shaft main body 37a and a main body receiving portion 37b provided below the shaft main body 37a. The pressing portion 23a is made of an elastic material such as a rubber material or a resin material. And the adsorption hole (illustration omitted) opened to the adsorption | suction surface 23a1 which is a lower surface of the press part 23a is formed in the collet 23, and a vacuum generator (illustration omitted) is connected to this adsorption hole. Therefore, if the suction surface 23a1 of the collet 23 is brought into contact with the chip and the vacuum generator is driven, air in the suction holes can be sucked and the chip 21 can be suctioned onto the suction surface 23a1. The vacuum generator may be a vacuum generator using a vacuum pump or an ejector-type vacuum generator composed of basic parts called a nozzle and a diffuser.

  By the way, the shaft main body 37a of the shaft member 23b of the collet 23 is accommodated in the bonding head 39 in a suspended state. Further, a load cell 41 as the load detection means 32 is disposed on the upper portion of the shaft main body 37a. For this reason, as shown in FIG. 3, when the load of the arrow I is applied to the collet 23 in a state where the chip 21 is adsorbed by the collet 23, the collet 23 receives the reaction force from the chip 21. The force can be detected by the load cell 41.

  That is, in a state where the collet 23 does not receive a reaction force, the collet 23 is suspended relative to the bonding head 39 by the engagement structure M provided between the shaft body 37 a and the bonding head 39. The collet 23 can be raised relative to the bonding head 39. However, since the load cell 41 is interposed between the shaft body portion 37a and the receiving member 38 of the bonding head 39, if the collet 23 receives a reaction force, the collet 23 tends to rise and the load cell 41 rises. receive. Therefore, the load cell 41 is pressed against the receiving member 38 of the bonding head 39, whereby the load cell 41 can detect the reaction force from the chip 21.

  The load cell is a load converter that converts an applied load into an electrical signal, and generally includes a magnetostrictive type, a capacitive type, a gyro type, a piezoelectric type, an electromagnetic type, a tuning fork type, a strain gauge type, and the like. In this case, it is preferable to use a strain gauge type having features such as high accuracy, small influence of temperature change, long-distance transmission with an output electric signal, and small size with respect to measurable load.

  The load of the second bar 35b in the direction of the arrow G by the drive mechanism 36, that is, the application of the load in the direction of the arrow I to the collet 23, is controlled by a load control means 45 comprising, for example, a microcomputer. In this embodiment, the engagement structure M includes a flange 42 provided with the shaft main body 37a, a large diameter portion 43 provided on the inner diameter surface of the bonding head 39, and the like. The diameter portion 43 is fitted as vertically movable.

  The rise detection means 31 can be configured by a contact type or non-contact type displacement sensor or the like, and the calculation means 33 can be configured by a microcomputer. Further, the adjusting means 34 adjusts the pressing force to be applied by the drive mechanism 36 according to a command from the calculating means 33. If the drive mechanism 36 is a ball screw mechanism, the number of rotations of the nut member is adjusted. In the case of a piston mechanism, the projection amount of the piston rod is adjusted. Therefore, the load control means 45 doubles as the adjusting means 34.

  In this case, the control means (not shown) for controlling the movement of the bonding load calculation means 33 and the collet 23, the adjustment means 34 and the calculation means 33 may be used in common, or different control means may be used. It is also possible to share one or two and use another control means.

  Next, a method of picking up the chip 21 at the pickup position P in the semiconductor device manufacturing apparatus configured as described above will be described first with reference to FIGS. 4 and 5. As shown in FIG. 5, the collet 23 is lowered from the state of being disposed above the pickup position P as shown by an arrow B and brought into contact with the chip 21 at the pickup position P.

  Thereafter, a load (pickup load) set in advance by the load application means 30 is applied to the collet 23 (step S1 in FIG. 4). At this time, the vacuum generator is driven to suck the air of the suction holes so that the chip 21 is suctioned to the suction surface 23a1 (see FIG. 2).

  By the way, since the pressing portion 23a is made of an elastic material, if a load is applied to the collet 23 by the load applying means 30, it elastically deforms and is in a squeezed state. That is, in the collet 23 having the pressing portion 23a which is elastically deformed, the pressing portion 23a is elastically deformed by receiving a reaction force from the tip side. For this reason, if this elastic deformation is completed, the collet 23 starts to ascend. Then, it is determined whether the collet 23 has started to rise (step S2). If it has not started to rise in step S2, the process returns to step S1. In addition, when it starts to rise in step S2, the process proceeds to step S3 and the load detection unit 32 detects the load when it starts to rise. At this time, the load applying means 30 applies a load set in advance.

  Thereafter, the process proceeds to step S4, and the load (detection value) measured in step S3 is compared with the preset load (set load) to determine whether there is an excess or deficiency (step S5). . That is, when a load is applied to the collet 23 by the load application means 30, the pressing portion 23a is elastically deformed in the initial stage. If elastic deformation is performed in this manner, the load to be applied by the load applying means 30 is not transmitted to the tip 21. When the elastic deformation is completed and a load is further applied, if the collet 23 floats up, the floating height becomes the height to which the load after deformation of the collet 23 is applied. That is, when a load is applied to the collet 23 by the load application means 30, the load for elastic deformation is subtracted from the load applied to the chip 21.

  Therefore, in consideration of the load of the elastic deformation, the correction of the load applied by the load applying unit 30 is adjusted by the adjusting unit 34, and the pickup process is performed with the adjusted load. That is, if there is an excess or deficiency in step S5, the process proceeds to step S6 to adjust the excess or deficiency and perform a pickup step of applying the adjusted load. If no excess or deficiency is detected in step S5, the process proceeds to step S7, and the load is applied with the set value without adjusting the load.

  By the way, the excess / deficit means that even if the load of the preset setting value is applied to the collet 23, the pickup load applied to the chip 21 does not become set. In FIG. 3, when a load having a preset setting value is applied to the collet 23 and when a pickup load to be applied to the chip 23 is W, actually, loads of W1 and W2 are applied to the chip 21. It may have been. For this reason, in W1, the load of (W-W1) runs short, and in W2, the load of (W2-W) is excessive.

  Therefore, if this semiconductor device manufacturing apparatus is used, excessive or insufficient load to be applied to the chip 21 can be effectively prevented, and a stable pickup process can be performed.

  Next, a method of bonding the chip 21 to the bonding position Q will be described. Also in the bonding position Q, a load applying unit 30, a rise detecting unit 31, a load detecting unit 32, a calculating unit 33, and an adjusting unit 34 are provided. In this case, even if each means is used in the pickup step, one different from that used in the pickup step may be used. However, at least the load cell as the load detection means 32 can be shared. When various means are shared, it is necessary to follow the movement of the collet 23 between the pickup position P and the bonding position Q.

  In this case, the collet 23 holding the chip 21 is positioned above the bonding position Q as shown in FIG. 5 and lowered as shown by arrow D to place the chip 21 on the base material 22. . At this time, the set load (the load by the load applying means 30 set in advance) is applied to the collet 23. At this time, the vacuum generator is stopped to stop the suction of air in the suction holes.

  If a load is applied to the collet 23 by the load application means 30, it will be elastically deformed and will be in a squeezed state. That is, in the collet 23 having the pressing portion 23a which is elastically deformed, the pressing portion 23a is elastically deformed by receiving a reaction force from the tip side. Therefore, the process shown in FIG. 4 similar to the pick-up process is performed.

  Therefore, if this semiconductor device manufacturing apparatus is used, excessive or insufficient load to be applied to the chip 21 can be effectively prevented, and a stable bonding process can be performed.

  In the semiconductor device manufacturing apparatus according to the present invention, the load detecting means 30 can detect the load at which the collet 23 starts to rise, and the calculating means 33 sets the preset load of the load applying means 30 and the like. The excess and deficiency of the set load can be calculated by comparing the detection value detected by the load detection means 32. When a load is applied to the collet by the load application means 31, the pressing portion 23a is elastically deformed in the initial stage. If elastic deformation is performed in this manner, the load to be applied by the load applying means 30 is not transmitted to the tip 21. When the elastic deformation is completed and a load is further applied, if the collet 23 floats up, the floating height becomes the height to which the load after deformation of the collet 23 is applied. That is, when a load is applied to the collet 23 by the load application means, the load for elastic deformation is subtracted from the load applied to the tip 21. Therefore, the load applied by the load applying means 30 is corrected in consideration of the load of the elastic deformation. Therefore, excessive or insufficient load to be applied to the chip 21 can be effectively prevented.

  As described above, according to the present invention, excessive or insufficient load to be applied to the tip 21 can be effectively prevented. That is, the hardness of the elastic body of the pressing portion 23a of the collet 23, the change in bonding temperature, the collet size, the work size (chip size), the height of the object to be bonded (lead frame or substrate), and / or Even if there are variations in the height of the chip, the load to be applied can be applied to the chip 21 without being affected by such variations, and a stable pick-up process and a stable bonding process are possible. In particular, each load can be correctly applied also in a bonding step (for example, a step of starting bonding with a low load and switching to a high load halfway) which switches the load during bonding.

  In the present embodiment, a load cell 41 which is a load measuring device is used as the load detection means 32. The load cell is a load converter that converts an applied load into an electrical signal, and generally includes a magnetostrictive type, a capacitive type, a gyro type, a piezoelectric type, an electromagnetic type, a tuning fork type, a strain gauge type, and the like. In this case, it is preferable to use a strain gauge type having features such as high accuracy, small influence of temperature change, long-distance transmission with an output electric signal, and small size with respect to measurable load.

  The present invention can be variously modified without being limited to the above embodiment. For example, as the load applying means 30, in the above embodiment, an arm having a substantially L shape is used coaxially with the collet 23 Although the drive mechanism 36 is not provided, the drive mechanism 36 may be provided coaxially with the collet 23. In addition, when an approximately L-shaped arm is used, there are advantages such as being excellent in the device layout property and enabling amplification of the load.

  The semiconductor device to be bonded in the manufacturing apparatus of the semiconductor device may include a stacked body in which a plurality of chips 21 are stacked. In this case, the semiconductor device manufacturing apparatus of the present invention is not used in the pickup step. Note that a semiconductor device refers to any device that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices.

Reference Signs List 21 chip 23 collet 23 a pressing portion 30 load applying means 31 ascent detecting means 32 load detecting means 33 calculating means 34 adjusting means 41 load cell P pickup position Q bonding position

Claims (6)

An apparatus for manufacturing a semiconductor device comprising a collet having an elastically deformable pressing portion for pressing a chip, the apparatus comprising:
Load applying means for applying a load to the collet,
A load detecting means for detecting a rise of the collet in a state where the load is applied to the collet and the collet lifts the load after the elastic deformation of the pressing portion of the collet is completed;
Load detection means for detecting a load at which the collet has started to rise, to which a reaction force after the collet pressing portion comes in contact with the tip is inputted;
Calculating means for comparing excess / deficiency of the set load by comparing the load detection value at the beginning of the rise detected by the load detection means with the preset load of the load provider set in advance;
An apparatus for manufacturing a semiconductor device, comprising: adjustment means for adjusting the excess or deficiency of the set load when the excess or deficiency is calculated by the calculation means.   The apparatus for manufacturing a semiconductor device according to claim 1, wherein the load applying means applies a pickup load at a pickup position for picking up by a collet.   The apparatus for manufacturing a semiconductor device according to claim 1, wherein the load applying means applies a bonding load at the bonding position in the collet.   The apparatus for manufacturing a semiconductor device according to any one of claims 1 to 3, wherein the load detecting means uses a load cell which is a load measuring device. A method of manufacturing a semiconductor device, comprising: picking up a chip by a collet elastically deformed at a pickup position; and bonding a chip adsorbed by the collet elastically deformed at a bonding position;
A load is applied to the collet at the pick-up position by a load application means, a load is applied to the collet, and after completion of deformation of the collet, the collet is lifted by further applying a load. A method of manufacturing a semiconductor device, comprising comparing the set load of the load applying means with the set load to calculate excess or deficiency of the set load and adjusting the excess or deficiency of the set load to pick up the chip. A method of manufacturing a semiconductor device, comprising: picking up a chip by a collet elastically deformed at a pickup position; and bonding a chip adsorbed by the collet elastically deformed at a bonding position;
A load is applied to the collet at the bonding position by a load application means, a load is applied to the collet, and after completion of deformation of the collet, the collet is lifted by further applying a load, and the load starting to rise is set in advance. A method of manufacturing a semiconductor device, comprising comparing the set load of the load applying means with the set load to calculate excess or deficiency of the set load, adjusting the excess or deficiency of the set load, and bonding the chip.

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