JP2022091349A - Bonding device and bonding method - Google Patents

Abstract

To provide a bonding device and a bonding method that can determine whether a load (production load) that can be produced with a set pushing amount is achieved even when a collet is tilted, and does not cause unnecessary work (adjustment).SOLUTION: A bonding device includes load setting means, load applying means, reaction force detecting means, pushing amount detecting means, load setting means, and determining means. A production load applied to a chip from a collet is set by the load setting means. A load can be applied to the collet by the load applying means, and the collet is in a state of receiving reaction force from the chip side. The reaction force can be detected by the reaction force detecting means, and the pushing amount is detected by the pushing amount detecting means. The determining means determines whether the load applied to the chip from the collet has reached the production load on the basis of the pushing amount and the reaction force.SELECTED DRAWING: Figure 1

Description

The present invention relates to a bonding apparatus and a bonding method.

In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are built together is diced and separated into individual semiconductor chips, and these are bonded one by one to a predetermined position such as a lead frame. Has been adopted. A bonding device (die bonder) is used for this chip bonding.

Generally, as shown in FIG. 8, a bonding apparatus (die bonder) picks up a chip (semiconductor chip) 1 cut out from a wafer at a pickup position P by a collet 3, and a bonding position Q of a base material 2 such as a lead frame. It is to be transferred (mounted) to. The wafer is adhered on a wafer sheet (adhesive sheet 5) stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 1 by a dicing process.

As shown in FIG. 8, the collet 3 picks up ascending in the arrow A direction and descending in the arrow B direction on the pickup position P, ascending in the arrow C direction and descending in the arrow D direction on the bonding position Q. Reciprocating movement in the directions of arrows E and F between the position P and the bonding position Q is possible. The collet 3 is attached to a bonding head (not shown), and the bonding head is attached to a bonding arm (not shown).

In such a bonding device, it is necessary to replace it due to a difference in the size of the chip 1 or deterioration of the collet 3. If the collet 3 is replaced, the chip suction surface 3a of the collet 3 may be tilted at an arbitrary angle with respect to the chip 1.

If the collet is inclined in this way, stable adsorption is not achieved when the chip 1 is adsorbed at the pickup position P, and at the bonding position Q, the chip 1 is adhered to the bonding position of the substrate or the like. There will be a situation where the regular pressing force cannot be applied to the tip.

Therefore, conventionally, a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device (Patent Document 1), a bonding apparatus and a bonding method (Patent Document 2), etc., which can detect the inclination of the collet after the collet is replaced, have been used. Proposed.

In Patent Document 1, a fingerprint sensor is used to confirm the mounting state (tilt) of the collet. Further, in Patent Document 2, protrusions are provided at positions where the collet can be contacted, and the inclination of the collet is determined based on the heights of the plurality of collets when they come into contact with the protrusions.

JP-A-2019-75446 Japanese Unexamined Patent Publication No. 2016-139629

By the way, in those described in Patent Document 1 and Patent Document 2, the inclination of the collet is detected (detected). Therefore, in these cases, it is determined that the collet is not normally mounted only by the inclination of the collet.

However, if the collet is made of a rubber material that can be elastically deformed, it can be used for production (bonding) if the collet is elastically deformed with a preset pushing amount even if it is tilted. There is.

Therefore, in the past, it was judged that the collet was not properly mounted only by the tilt of the collet, and the collet was once removed from the bonding device (die bonder) and reattached, or another new one was attached. Will be. However, even though it is necessary to individually set the allowable tilt depending on the collet size and the load set for production, if the tilt of the collet, which is considered to be improperly installed, is set as an eigenvalue, as described above, the collet Unnecessary work (adjustment) such as reattachment and collet replacement work occurs.

Therefore, in view of the above problems, the present invention can determine whether or not the load (production load) that can be produced with the set pushing amount is achieved even if the collet is tilted, and unnecessary work (adjustment) is performed. A bonding apparatus and a bonding method that do not cause the above-mentioned problems are provided.

The bonding device of the present invention is a bonding device provided with an elastically deformable collet that presses the chip, and is a load setting means for setting a production load applied to the chip from the collet and a load for applying a load to the collet. The applying means, the reaction force detecting means for detecting the reaction force acting on the collet from the chip side, the pushing amount detecting means for detecting the pushing amount of the collet when the load is applied to the collet by the load applying means, and the pushing amount detecting means. Whether the load applied to the chip from the collet has reached the production load set by the load setting means from the pushing amount detected by the amount detecting means and the reaction force detected by the reaction force detecting means. It is provided with a determination means for determining whether or not it is present.

According to the bonding apparatus of the present invention, the production load applied to the chip from the collet can be set by the load setting means. Here, the production load is a load generated during normal normal pickup or normal bonding. Further, the load can be applied to the collet by the load applying means, and the collet can be in a state of receiving the reaction force from the chip side. Therefore, the collet is pushed by the reaction force.

At this time, the reaction force can be detected by the reaction force detecting means, and the pushing amount can be detected by the pushing amount detecting means. As a result, the determination means can determine whether or not the load applied to the chip from the collet has reached the production load from the pushing amount and the reaction force.

That is, for example, when the collet is tilted by a predetermined amount, the entire surface of the chip contact surface (lower surface) does not touch (contact) the chip unless it is pushed in by the predetermined amount. Moreover, the tip is loaded with only half the load (reaction force) of the predetermined amount of the collet that is not tilted. Therefore, if this reaction force can be detected (measured), the inclination can be determined. However, even in such a case (when tilting occurs), the production load may be reached with this pushing amount, and if it is reached, the tilt is not corrected, that is, the collet is reattached. The pickup process and the bonding process can be performed without exchanging with another collet. Here, the pickup step is a step of sucking the chip to the collet, raising the collet while maintaining the suction state, and picking up the chip from the pickup position. The bonding step is a step of bonding the chips adsorbed on the collet at the bonding position.

The determination means may have a function of calculating the elastic modulus of the collet. In this way, if the elastic modulus of the collet can be calculated, a defective collet with deterioration or damage is detected, or when the collet is replaced, the replaced collet picks up or bonds the chip. On the other hand, it is possible to detect when it is not optimal (that is, when the wrong collet is attached).

In this case, the elastic modulus of the collet is calculated by the production load, the arbitrarily set minimum load smaller than the production load, the tip contact area of the collet, the collet height at the production load, and the collet height at the minimum load. can do. This makes it possible to stably calculate the elastic modulus of the collet.

As a bonding device, it is a bonding device that sucks and picks up a chip with a collet that elastically deforms at the pickup position and bonds the chip that is adsorbed by a collet that elastically deforms at the bonding position. The determination means may be determined. In this case, the determination means may be determined at the pickup position as well. The production load can be referred to as a pickup load at the pickup position and a bonding load at the bonding position. Further, the pickup load and the bonding load may be the same or different.

Further, as a bonding device, a chip is attracted and picked up by a collet elastically deformed at the pickup position, the chip adsorbed by a collet elastically deformed at the bonding position is bonded, and the pickup position and the bonding position are combined. A bonding device having an intermediate stage in which chips are conveyed between them may be used to determine the determination means at at least one of a pickup position, an intermediate stage, and a bonding position. The production load in this case can be referred to as a pickup load and a bonding load in the pickup position and the bonding position, as in the case of those having no intermediate stage. Further, the intermediate stage requires a collet for transporting from the pickup position and the intermediate stage, and a collet for transporting from the intermediate stage to the bonding position. Therefore, in the intermediate stage, there is a production load on the collet for transporting to the intermediate stage and a production load on the collet for transporting to the bonding position. At this time, these production loads may be the same or different.

The production load at the bonding position can be set to be larger than the production load at the pickup position and the intermediate stage.

The bonding method of the present invention is a bonding method for bonding chips using an elastically deformable collet that presses the chips, and is a load setting step for setting a production load applied to the chips from the collet and a load on the collet. Pushing amount detection that detects the pushing amount of the collet when the load is applied to the collet in the load applying step, the reaction force detecting step that detects the reaction force acting on the collet from the chip side, and the load applying step. The load applied to the chip from the collet from the process, the indentation amount detected in the indentation amount detection process, and the reaction force detected in the reaction force detection process is the production load set in the load setting process. It is provided with a determination step of determining whether or not it has been reached.

According to the bonding method of the present invention, the production load applied to the chip from the collet can be set in the load setting step. Further, in the load applying step, a load can be applied to the collet, and the collet can be in a state of receiving a reaction force from the chip side. Therefore, the collet is pushed by the reaction force.

At this time, the reaction force can be detected in the reaction force detecting step, and the pushing amount can be detected in the pushing amount detecting step. Thereby, in the determination step, it is possible to determine whether or not the load applied to the chip from the collet has reached the production load from the pushing amount and the reaction force.

In the determination step, if the production load is reached, the bonding operation can be performed, and if the production load is not reached, the bonding operation can be prevented. Here, the bonding operation is a process including a pick-up process and a bonding process. The pick-up process is a process of picking up chips, and the bonding process is a process of bonding chips.

INDUSTRIAL APPLICABILITY The present invention can determine whether or not the load applied to the chip from the collet reaches the production load. Therefore, even if the collet is tilted, the production process (pickup process and bonding process) can be performed as long as the production load is reached, and the frequency of reattaching the collet and attaching other collets can be reduced. Moreover, an existing device can be used as the bonding device, and a bonding device and a bonding method having excellent productivity can be provided without increasing the cost.

It is a main part block diagram which shows the control part which performs the pre-process before the bonding operation of the bonding apparatus of this invention. It is a simplified figure which shows the bonding operation of the bonding apparatus of this invention. (A) shows the relationship between the collet and the collet holder, and (b) is a simplified view of the state where the collet is attached to the collet holder without tilting, and (b) is a simplified view of the state where the collet is attached to the collet holder with the collet tilted. It is a figure. It is a graph which shows the relationship between a reaction force load and a pushing amount. It is a block diagram of the main part which shows the pre-process before the bonding operation of the bonding method of this invention. It is a float chart figure of the pre-process before the bonding operation of a bonding method. It is a simplified figure which shows the bonding operation of the other bonding apparatus of this invention. It is a simplified figure which shows the bonding operation of a general bonding apparatus.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 7.

FIG. 2 shows a bonding device (die bonder) according to the present invention, in which the bonding device picks up a chip 11 cut out from a wafer at (pickup position P) and a bonding position Q of a base material 12 such as a lead frame. It is to be transferred (mounted) to. The wafer is adhered on a wafer sheet (adhesive sheet 10) stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 11 by a dicing process. The chip 11 is made of a wafer, and the material is cut into a square or a strip (rectangle) to form a final product. Therefore, the chip 11 has a square shape or a strip shape (rectangular shape).

That is, the bonding device includes a bonding arm (not shown) capable of moving between the pickup position P and the bonding position Q via a transport means (moving mechanism), and the tip of the bonding arm is attached to the collet holder 14. It holds the mounted collet 13 (the collet 13 that adsorbs the semiconductor chip 11).

In this case, the collet holder 14 is moved by the moving mechanism to ascend in the arrow A direction and descend in the arrow B direction on the pickup position P, and ascend in the arrow C direction and descend in the arrow D direction on the bonding position Q. , Reciprocating movement in the directions of arrows E and F between the pickup position P and the bonding position Q is possible. The movement mechanism controls the movement of the arrows A, B, C, D, E, and F by the control means. As the moving mechanism, various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism can be used, and an XYZ θ-axis stage, a robot arm that can move in the XYZ θ direction, and the like can be used. ..

In the present embodiment, the step of picking up the chip 11 at the pickup position P via the collet 13 is called a pickup step, and the step of bonding the chip 1 to the bonding position Q is called a bonding step, which is a pickup step and a bonding step. The process including the above is called a bonding operation.

The collet 13 is an elastically deformable rubber collet or resin collet, and as shown in FIG. 3, a suction hole (not shown) for suction is formed in the lower end surface (suction surface) 13a, and the suction hole is formed. A vacuum generator (not shown) is connected via the collet holder 14 and the bonding arm. By driving this vacuum generator, the air in the suction holes is sucked, the tip 11 is vacuum sucked, and the tip 11 is sucked on the lower end surface 13a of the collet 13. If this vacuum suction (evacuation) is released, the tip 11 will come off from the collet 13. As the vacuum generator, a vacuum pump may be used, or an ejector type may be used in which high-pressure air is controlled to open and close and discharged from a nozzle to a diffuser to generate a negative pressure in the diffusion chamber.

Further, the wafer divided (divided) into a large number of chips 11 is arranged on, for example, an XYθ table, and a push-up means provided with a push-up pin is arranged on the XYθ table. That is, the tip 11 to be picked up is pushed up from below by the pushing-up means to be easily peeled off from the adhesive sheet. In this state, the chip 11 is adsorbed on the collet 13 that has descended.

As shown in FIGS. 3A and 3B, the collet holder 14 extends upward from the holder main body 15 having a fitting recess 15a into which the rectangular flat plate-shaped collet 13 is fitted, and the upper surface of the holder main body 15. A shaft portion 16 is provided. FIG. 3A shows a state in which the collet 13 is normally mounted on the collet holder 14, and FIG. 3B shows a state in which the lower surface (chip contact surface) 13a of the collet 13 is tilted. Shows. When the collet 13 is normally mounted on the collet holder 14, the tip contact surface 13a can maintain a parallel state with the upper surface (collet suction surface 11a) of the tip 11 to be adsorbed, and the tip contact surface 13a is in a state of being parallel to the tip contact surface 13a. In the tilted state, the tip contact surface 13a is tilted with respect to the upper surface (collet suction surface 11a) of the chip 11 to be sucked.

By the way, as shown in FIG. 3A, the collet 13 is rarely normally mounted on the collet holder 14 (inclination is 0). Therefore, if the collet 13 is tilted, even if a predetermined load is applied to the collet 13, the load (reaction force) may not be applied to the entire surface of the chip contact surface 13a. Further, even if there is an inclination, a load may be applied to the entire surface of the chip contact surface 13a.

Therefore, in the bonding apparatus according to the present invention, even if the collet 13 is tilted, it can be determined whether or not the load that can be produced (production load) is achieved with the set pushing amount, and unnecessary work (adjustment) is performed. It was decided not to cause it.

Therefore, the bonding apparatus according to the present invention has the configuration shown in FIG. That is, this bonding device acts on the load setting means 31 for setting the production load applied to the chip 11 from the collet 13, the load applying means 32 for applying the load to the collet 13, and the collet 13 from the chip side. The reaction force detecting means 33 for detecting the reaction force, the pushing amount detecting means 34 for detecting the pushing amount of the collet 13 when the load is applied to the collet 13 by the load applying means 32, and the pushing amount detecting means 34 for detecting. Whether or not the load applied to the chip 11 from the collet 13 reaches the production load set by the load setting means 31 from the pushing amount and the reaction force detected by the reaction force detecting means. A determination means 35 for determination is provided.

The production load set by the load setting means 31 is a preset production load, which is a pick pickup load applied to the chip 11 when the chip 11 is picked up, and is a pick pickup load when the chip 11 is bonded. Is the bonding load applied to the chip 11. By applying the set pickup load to the chip 11 in this way, the chip 11 at the pickup position can be stably picked up, and by applying the set bonding load to the chip 11, the chip 11 at the bonding position P can be picked up stably. The chip 11 can be stably bonded. Here, stable pick-up means that when picking up, the entire upper surface of the chip 11 does not come into contact with the chip contact surface 13a of the collet 13, and the chip to be picked up cannot be picked up. Therefore, the chip 11 can be adsorbed to the chip contact surface 13a and peeled off from the adhesive sheet without applying an unnecessary load, and stable bonding means that the chip 11 can be bonded to a substrate or the like. It is possible to pressurize to the extent that it is not damaged or bent.

By the way, a bonding arm is attached to the tip of the bonding head (not shown), and the collet holder 14 is attached to the bonding arm. Apply a load. The load applying means 32 includes a drive mechanism (not shown) and a power transmission mechanism (not shown) for transmitting the driving force of the drive mechanism from the bonding arm side to the collet 13 via the collet holder 14. Here, the drive mechanism can be configured by various mechanisms such as a ball screw mechanism, a cylinder mechanism, and a linear motor mechanism, and the power transmission mechanism can be configured by a link mechanism, a crank mechanism, or the like.

The reaction force detecting means 33 can be configured by a load cell. Here, the load cell is a load converter that converts the applied load into an electric signal, and generally includes a magnetostrictive type, a capacitance type, a gyro type, a piezoelectric type, an electromagnetic type, a sound fork type, a strain gauge type, and the like. .. In this case, it is preferable to use a strain gauge type having features such as high accuracy, small influence of temperature change, long-distance transmission with an electric signal as an output, and small size with respect to a measurable load.

In this case, for example, the collet holder 14 of the collet 13 is housed in a state of being suspended from the bonding arm, and a load cell as a reaction force detecting means 33 is arranged on the upper portion of the collet holder 14. Therefore, if a load for pressing the chip 11 is applied to the collet while the chip 11 is adsorbed by the collet 13, the load cell will rise as the collet 13 tries to rise. It will receive a load (reaction force). Therefore, the load cell is pressed against the load cell receiving portion of the bonding arm, whereby the load cell can detect the reaction force from the chip 11.

The indentation amount detecting means 34 can be configured by a displacement sensor (not shown) such as an optical displacement sensor or an ultrasonic displacement sensor.

The determination means 35 can be configured by a computer (not shown). By the way, a computer basically includes an input means having an input function, an output means having an output function, a storage means having a storage function, a calculation means having a calculation function, and a control function. It is composed of control means. The input function is for reading information from the outside to a computer, and the read data or program is converted into a signal in a format suitable for a computer system. The output function displays the calculation results and stored data to the outside. The storage means stores and stores programs, data, processing results, and the like. The arithmetic function processes data by calculation, comparison, and processing according to the instructions of the program. The control function decodes the instruction of the program and gives an instruction to each means, and this control function controls all the means of the computer.

Input means include a keyboard, mouse, tablet, microphone, joystick, scanner, capture board and the like. Further, the output means includes a monitor, a speaker, a printer and the like. The storage means includes a memory, a hard disk, a CD / CD-R, a PD / MO, and the like. The arithmetic means includes a CPU and the like, and the control means includes a CPU, a motherboard and the like.

Therefore, such a computer can be used for controlling the means 31, 32, 33, 34, the transport means (moving mechanism), and the like. The load setting means 31 can be configured by the input means.

When the bonding operation is performed using the bonding device configured as described above, it is necessary to replace the collet 13 when the chip size to be bonded is changed or when the collet 13 is used for the same predetermined time (period). .. However, the replaced collet 13 may have its chip contact surface 13a inclined with respect to the collet suction surface 11a of the chip 11. In such a case, the tip 11 may not be pressed with the preset pushing amount.

That is, as shown in FIG. 3B, when the tip contact surface 13a of the collet 13 has an inclination θ, for example, the difference between the lowest point 13a1 and the highest point 13a2 of the chip contact surface 13a is a predetermined dimension. When there is an inclination of S (for example, 60 μm), the entire surface of the chip contact surface 13a does not come into contact with the collet suction surface 11a of the chip 11 unless it is pushed in by this 60 μm. In this case, as shown in FIG. 4, a load equivalent to 30 μm is applied only to the case of the collet 13 normally mounted (assuming that there is no inclination).

As shown in FIG. 4, for example, when the collet inclination is 0 μm, the load cell load (the reaction force that the collet 13 receives from the tip 11 when the collet 13 is pushed) is 10 N when the collet pushing amount is 100 μm. Then, if the collet 13 is pushed in by 50 μm, the load cell load becomes 5N. In FIG. 4, the collet inclination is the difference (predetermined dimension S) between the lowest point 13a1 and the highest point 13a2 of the chip contact surface 13a. Note that FIG. 3B shows a portion where the cross-hatched portion is pushed in when a certain reaction force is applied.

As can be seen from FIG. 4, when the collet inclination is 20 μm, if the pushing amount is 50 μm, the load cell load (reaction force) is about 3N, and when the collet tilt is 40 μm, the pushing amount is 50 μm. When the load cell load (reaction force) is about 1.8 N and the collet inclination is 60 μm, and when the pushing amount is 50 μm, the load cell load (reaction force) is about 1 N and the collet inclination is 80 μm. If the pushing amount is 50 μm, the load cell load (reaction force) is about 0.4N, and if the collet inclination is 100 μm, the pushing amount is 50 μm, the load cell load (reaction force) is about 0.2N. Is.

Therefore, if the load cell load can be measured, the collet inclination can be determined. In this case, if the load for production (production load) is reached with the set pushing amount (for example, 100 μm), even if the collet 13 has a collet tilt, the bonding operation is performed without correcting the tilt. be able to.

Therefore, in the present bonding apparatus, even if the collet 13 is tilted, it can be determined whether or not the bonding operation can be performed without correcting the tilt. For this purpose, first, a predetermined low load (minimum load) is applied to a collet whose inclination is adjusted within the specified value (for example, a collet whose inclination of the four corners is within 10 μm) with respect to the inclination measurement surface (chip contact surface 13a). ) Is applied, and the collet contact height is measured. The minimum load is a load in which the lowest point 13a1 of the collet 13 comes into contact with the chip 11 and is pushed in by a minute amount, and can be arbitrarily set. That is, the load with this minute amount of pushing may be smaller than the production load.

After that, the load is switched to a set load for production (for example, in the pickup process performed at the pickup position P, it is the pickup load required at the time of pickup, and in the bonding process performed at the bonding position, it is the bonding load required at the time of bonding). And measure the collet contact height.

Thereby, the rubber elastic modulus of the collet 13 is calculated. That is, the rubber elasticity coefficient of the collet 13 can be obtained by (production load-minimum load) / collet tip contact surface area / (production load contact height-minimum load contact height). Therefore, the computer is provided with a table of rubber elastic modulus for each production load. Here, the ground contact height is the height (collet height) from the reference position to the collet 13.

Next, a method (preliminary step) for determining whether or not the bonding operation can be performed without correcting the tilt even if the collet 13 is tilted will be described. That is, as shown in FIG. 5, this previous step includes a load setting step 51, a load applying step 52, a reaction force detecting step 53, a pushing amount detecting step 54, and a determination step 55.

These pre-processes will be described with reference to the flowchart shown in FIG. 6 below. First, the production load is set (step S1) (in the pickup process performed at the pickup position, it is the pickup load required at the time of pickup, and in the bonding process performed at the bonding position, it is the bonding load required at the time of bonding).

Next, a load is applied to the collet 13 by the load applying means 32 (step S2), and the reaction force (load cell load) received by the collet 13 is detected (step S3). Then, the pushing amount due to the reaction force is detected by the pushing amount detecting means 34 (step S4). After that, the process proceeds to step S5, and it is determined in step S5 whether or not the production load has been reached. This judgment is made by using the table stored in the control means.

If it is determined in step S5 that the result has been reached, the process proceeds to step S6 and the bonding operation is performed (step S6). If it is determined in step S5 that the production load has not been reached, the process proceeds to step S7, the bonding operation is not performed, and this operation is terminated.

Further, from step S6, the process proceeds to step S7 to determine whether to end the bonding operation. If the bonding operation is completed, this step is ended. If the bonding operation is not completed in step S7, the process proceeds to step S1. return.

By the way, the bonding operation in the flowchart shown in FIG. 6 means that the chip 11 is sucked and picked up by the collet 13 elastically deformed at the pickup position P, and the chip 11 is sucked by the collet 13 elastically deformed at the bonding position Q. Is the process of bonding.

Therefore, the production load includes the production load at the pickup position P and the production load at the bonding position Q. Generally, the production load at the bonding position Q is larger than the production load at the pickup position P. .. In this case, if a production load is applied at the bonding position Q, the chip 11 can be stably bonded to the bonding portion. Therefore, it is preferable to determine whether the production load is reached at the bonding position Q. However, as the bonding device, it may be determined whether or not the production load is reached at the pickup position P. In this case, it may be determined whether the production load is reached only at the pickup position P, or it may be determined whether the production load is reached at the pickup position P and the bonding position Q.

In this bonding device, the production load applied to the chip 11 from the collet 13 can be set by the load setting means 31. Further, the load applying means 32 can apply a load to the collet 13, and the collet 13 can be in a state of receiving a reaction force from the chip side. Therefore, the collet 13 is pushed by the reaction force.

At this time, the reaction force can be detected by the reaction force detecting means 33, and the pushing amount thereof can be detected by the pushing amount detecting means 34. As a result, the determination means 35 can determine whether or not the load applied to the chip 11 from the collet 13 has reached the production load from the pushing force and the reaction force.

That is, for example, when the collet 13 is tilted by a predetermined amount, the entire surface of the chip contact surface (lower surface) 13a does not touch the chip 11 unless it is pushed in by the predetermined amount. Moreover, the tip 11 is subjected to only half the load (reaction force) of the predetermined amount of the collet 13 that is not tilted. Therefore, if this reaction force can be detected (measured), the inclination can be determined. However, even in such a case, the production load may be reached by this pushing amount, and if it is reached, the pickup process and the bonding process can be performed without reattaching the collet 13 or replacing it with another collet 13. It can be carried out.

Therefore, the present invention can determine whether or not the load applied to the chip 11 from the collet 13 has reached the production load. Therefore, even if the collet 13 is tilted, the production process (pickup process and bonding process) can be performed as long as the production load is reached, and the frequency of reattaching the collet 13 and attaching other collets 13 is reduced. can. Moreover, an existing device can be used as the bonding device, and a bonding device and a bonding method having excellent productivity can be provided without increasing the cost.

By the way, in this bonding apparatus, the determination means 35 has a function of calculating the elastic modulus of the collet 13. In this way, if the elastic modulus of the collet 13 can be calculated, a defective collet 13 having deterioration or damage is detected, or when the collet 13 is replaced, the replaced collet 13 picks up or bonds. It is possible to detect when the chip 11 is not optimal for the chip 11 (that is, when the wrong collet 13 is attached).

In this case, the elasticity coefficient of the collet 13 is the production load, an arbitrarily set minimum load smaller than the production load, the chip contact area of the collet 13, the collet height at the production load, and the collet height at the minimum load. Can be calculated with. This makes it possible to stably calculate the elastic modulus of the collet 13.

By the way, the calculation of the collet elastic modulus is preferably performed in a region at room temperature, for example, in an intermediate stage 63 or the like described later, but may be performed in a bonding region where the chip 11 is bonded. Alternatively, both may be used. Since the bonding region is generally heated in temperature, the collet 13 is accompanied by a temperature change and thermal expansion, so that the elastic modulus and the reaction force for each pressing amount may not match the calculation results at room temperature. Therefore, it is possible to have two reaction force change tables and change the pushing amount at the start of production (collet room temperature) and at the time of stable production (collet temperature rise).

The bonding apparatus shown in FIGS. 7A and 7B has an intermediate stage 63 in which the chip 11 is conveyed between the pickup position P and the bonding position Q. That is, the chip 11 is picked up by the pickup side collet 62 at the pickup position P, the chip 11 adsorbed by the pickup side collet 62 is supplied to the intermediate stage 63, and the chip supplied onto the intermediate stage 63 is supplied. 11 is picked up by the bonding side collet 64, and the chip 11 adsorbed by the bonding side collet 64 is supplied to the bonding position Q such as the substrate 65. The chip 11 at the pickup position P is divided into a large number from the wafer 66.

An arm (not shown) is connected to the pickup side collet 62 via a collet holder, and this arm can be driven in the X, Y, Z and θ directions by the pickup side transport means (not shown). In this case, the pick-up side transport means can be configured by a robot arm mechanism, an XYZ θ-axis stage, or the like.

The pickup-side collet 62 can be moved as shown in FIG. 7A. That is, it moves from the standby position, that is, the upper position of the intermediate position between the pickup position P and the intermediate stage 63 to the upper position of the pickup position P along the arrow C1 direction, and descends from this position along the arrow D1 direction. Then, the movement for sucking the chip 11 in the pickup position P, the movement from this position to the upper position of the pickup position P by rising along the arrow D2 direction, and returning from this position to the standby position along the arrow C2 direction. It is possible to move. Further, the movement from the standby position to the upper position of the intermediate stage 63 along the arrow C3 direction, the movement to descend from this position along the arrow D3 direction, and to supply the chip to the chip supply position on the intermediate stage 63. It is possible to move from this position to the upper position of the intermediate stage 63 by ascending along the arrow D4 direction, and to return from this position to the standby position along the arrow C4 direction.

An arm (not shown) is connected to the bonding side collet 64 via a collet holder, and this arm can be driven in the X, Y, Z and θ directions by the bonding side collet transport means. The bonding side collet transfer means can also be configured by a robot arm mechanism, an XYZ θ-axis stage, or the like.

As a result, the bonding side collet 64 can be moved as shown in FIG. 7 (b). Movement from the upper position of the intermediate position between the bonding position Q and the intermediate stage 63 to the upper position of the intermediate stage 63 along the arrow E1 direction, descending from this position along the arrow F1 direction, and on the intermediate stage 63. It is possible to move to suck the chip 11, move up from this position along the arrow F2 direction to the upper position of the intermediate stage 63, and move from this position back to the standby position along the arrow E2 direction. Further, the movement from the standby position to the upper position of the bonding position Q along the arrow E3 direction, the movement to descend from this position along the arrow F3 direction and supply the chip 11 to the bonding position Q, from this position. It is possible to move up along the direction of the arrow F4 to a position above the bonding position Q, and move back from this position to the standby position along the direction of the arrow E4.

By the way, in this bonding apparatus, the pick-up side collet 62 picks up the chip 11 at the pickup position P, and the chip 11 is supplied (mounted) at the intermediate stage 63. In the bonding side collet 64, the chip 11 is supplied (mounted) at the intermediate stage 63. The chip is picked up and the chip 11 is bonded at the bonding position Q.

Therefore, in the bonding apparatus provided with the intermediate stage 63 as described above, it is sufficient that the determination means 35 can be determined by at least one of the pickup position P, the intermediate stage 63, and the bonding position Q.

In this case, even if the determination means 35 can be determined by the pickup position P, the intermediate stage 63, and the bonding position Q, the determination is performed at any two of the pickup position P, the intermediate stage 63, and the bonding position Q. It may be the one that performs the determination at any one place.

As the production load, the production load at the bonding position Q is set to be larger than the production load at other parts. Further, in the intermediate stage 63, the pickup side collet 62 supplies the chip 11 onto the intermediate stage 63, and the bonding side collet 64 picks up the chip 11 on the intermediate stage. Therefore, in the intermediate stage 63, there is a production load for supplying the chip of the pickup side collet 62 and a production load for picking up the chip 11 at the bonding side collet 64, and these production loads are different. May be the same as.

Therefore, even a bonding device having an intermediate stage 63 as shown in FIG. 7 has the same effect as that of a bonding device without such an intermediate stage 63.

The present invention is not limited to the above embodiment, and various modifications can be made. For example, in the present bonding apparatus and the bonding method, the present invention is used for manufacturing a semiconductor device, but as a semiconductor device, a plurality of chips 11 may be laminated or one chip 11 may be bonded to the substrate. The semiconductor device refers to all devices that can function by utilizing the semiconductor characteristics, and the electro-optical device, the semiconductor circuit, and the electronic device are all semiconductor devices.

The size of the chip contact surface 13a of the collet 13 is preferably smaller than the size of the collet suction surface 11a of the chip 11, but when manufacturing a product in which a plurality of chips 11 are laminated, the size is higher than that of the lower chip 11. When the chip 11 protrudes (overhangs), it is preferably smaller than the overhang amount. Further, the shape of the chip contact surface 13a of the collet 13 may be a square, a rectangle (rectangle), a triangle, or a pentagon or more. The number of suction holes formed in the collet 13, the arrangement position, the diameter, and the cross-sectional shape can be variously changed according to the size of the chip 11 to be picked up and the like.

By the way, the timing of performing the pre-process shown in FIG. 6 is preferably performed when the collet is replaced, but may be performed after a predetermined time has elapsed.

In the embodiment, for the sake of simplification of the description, the case where the chip contact surface 13a of the collet 13 is tilted is described as a two-dimensional tilt, but the case where the tilt occurs is described as a two-dimensional tilt. There is also a three-dimensional inclination, not limited to. However, even if it is tilted three-dimensionally, with this bonding device and bonding method, as in the case of tilting two-dimensionally, "even if the collet is tilted, the load that can be produced with the set pushing amount" It can be determined whether (production load) has been achieved, and unnecessary work (adjustment) does not occur. "

11 Semiconductor chip 13 Collet 31 Load setting means 32 Load applying means 33 Reaction force detecting means 34 Pushing amount detecting means 35 Judging means 51 Load setting process 52 Load applying process 53 Reaction force detecting process 54 Pushing amount detecting process 55 Judgment step 62 Pickup side Collet 63 Intermediate stage 64 Bonding side collet

Claims (10)

A bonding device equipped with an elastically deformable collet that presses the chip.
A load setting means for setting the production load applied to the chip from the collet,
A load-bearing means for applying a load to the collet,
A reaction force detecting means for detecting the reaction force acting on the collet from the chip side,
A push-in amount detecting means for detecting the push-in amount of the collet when a load is applied to the collet by the load-giving means, and a push-in amount detecting means.
From the pushing amount detected by the pushing amount detecting means and the reaction force detected by the reaction force detecting means, the load applied to the tip from the collet reaches the production load set by the load setting means. A bonding apparatus including a determination means for determining whether or not the presence or absence is provided. The bonding apparatus according to claim 1, wherein the determination means has a function of calculating an elastic modulus of a collet. The elasticity coefficient of the collet can be calculated by the production load, the arbitrarily set minimum load smaller than the production load, the tip contact area of the collet, the collet height at the production load, and the collet height at the minimum load. The bonding apparatus according to claim 2, wherein the bonding apparatus is characterized. It is a bonding device that adsorbs and picks up chips with a collet that elastically deforms at the pickup position, and bonds the chips that are adsorbed by the collet that elastically deforms at the bonding position.
The bonding apparatus according to any one of claims 1 to 3, wherein at least the determination means is determined at the bonding position. The chip is attracted and picked up by the collet that elastically deforms at the pickup position, the chip that is adsorbed by the collet that elastically deforms at the bonding position is bonded, and the chip is conveyed between the pickup position and the bonding position. A bonding device with an intermediate stage
The bonding apparatus according to any one of claims 1 to 3, wherein the determination means is determined at at least one of a pickup position, an intermediate stage, and a bonding position. The bonding apparatus according to claim 5, wherein the production load at the bonding position is larger than the production load at the pickup position and the intermediate stage. A bonding method in which chips are bonded using an elastically deformable collet that presses the chips.
A load setting process that sets the production load applied to the chip from the collet,
The load application process that applies a load to the collet, and
A reaction force detection process that detects the reaction force acting on the collet from the chip side,
A push-in amount detection step that detects the push-in amount of the collet when a load is applied to the collet in the load-applying step, and a push-in amount detection step.
From the indentation amount detected in the indentation amount detection process and the reaction force detected in the reaction force detection process, the load applied to the chip from the collet reaches the production load set in the load setting process. A bonding method characterized by comprising a determination step of determining whether or not it is present. The bonding method according to claim 7, wherein the determination step is performed after the collet is replaced. The bonding method according to claim 7, wherein if the production load is reached in the determination step, a bonding operation is performed. The bonding method according to claim 7, wherein the bonding operation is not performed unless the production load is reached in the determination step.

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