JP7522069B2 - 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ - Google Patents

断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ Download PDF

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Publication number
JP7522069B2
JP7522069B2 JP2021065348A JP2021065348A JP7522069B2 JP 7522069 B2 JP7522069 B2 JP 7522069B2 JP 2021065348 A JP2021065348 A JP 2021065348A JP 2021065348 A JP2021065348 A JP 2021065348A JP 7522069 B2 JP7522069 B2 JP 7522069B2
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Japan
Prior art keywords
sample
pulse rate
rotation
angles
images
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Japanese (ja)
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JP2021168292A5 (enExample
JP2021168292A (ja
Inventor
ヨーゼフ ヤンセン バルト
ヴァーシューレン エドウィン
フランケン エリク
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FEI Co
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FEI Co
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20214—Rotation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/226—Image reconstruction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2021065348A 2020-04-08 2021-04-07 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ Active JP7522069B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024111582A JP7789855B2 (ja) 2020-04-08 2024-07-11 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/843,770 US11257656B2 (en) 2020-04-08 2020-04-08 Rotating sample holder for random angle sampling in tomography
US16/843,770 2020-04-08

Related Child Applications (1)

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JP2024111582A Division JP7789855B2 (ja) 2020-04-08 2024-07-11 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ

Publications (3)

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JP2021168292A JP2021168292A (ja) 2021-10-21
JP2021168292A5 JP2021168292A5 (enExample) 2024-02-28
JP7522069B2 true JP7522069B2 (ja) 2024-07-24

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JP2021065348A Active JP7522069B2 (ja) 2020-04-08 2021-04-07 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ
JP2024111582A Active JP7789855B2 (ja) 2020-04-08 2024-07-11 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ

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JP2024111582A Active JP7789855B2 (ja) 2020-04-08 2024-07-11 断層撮影におけるランダムな角度のサンプリングのための回転するサンプルホルダ

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US (3) US11257656B2 (enExample)
EP (1) EP3892987A1 (enExample)
JP (2) JP7522069B2 (enExample)
CN (2) CN118777338A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11257656B2 (en) * 2020-04-08 2022-02-22 Fei Company Rotating sample holder for random angle sampling in tomography
JP2023067381A (ja) * 2021-11-01 2023-05-16 日新イオン機器株式会社 基板保持装置
EP4471820A1 (en) 2023-06-01 2024-12-04 FEI Company Methods for three-dimensional tomography of elongated samples

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010003617A (ja) 2008-06-23 2010-01-07 Hitachi High-Technologies Corp 試料台，試料回転ホルダ，試料台作製方法，及び試料分析方法
JP2014239039A (ja) 2013-06-06 2014-12-18 エフ イー アイ カンパニＦｅｉ Ｃｏｍｐａｎｙ 電子線トモグラフィ法
JP2016031805A (ja) 2014-07-28 2016-03-07 株式会社日立製作所 試料ホルダ、荷電粒子線装置および観察方法
JP2016051576A (ja) 2014-08-29 2016-04-11 日本電子株式会社 ３次元像構築方法、画像処理装置、および電子顕微鏡
JP2016103387A (ja) 2014-11-28 2016-06-02 株式会社日立ハイテクノロジーズ 荷電粒子線装置

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JP2661752B2 (ja) * 1989-08-31 1997-10-08 アルプス電気株式会社 空間磁界分布の三次元計測方法
US5075623A (en) * 1989-08-31 1991-12-24 Alps Electric Co., Ltd. Method for measuring three-dimensional spatial magnetic field distribution using algebraic reconstruction and convergence
JPH04372887A (ja) 1991-06-24 1992-12-25 Hitachi Ltd 荷電粒子線装置
JP3230618B2 (ja) 1993-03-05 2001-11-19 株式会社日立メディコ 放射線立体像撮影装置
JPH07335165A (ja) * 1994-06-10 1995-12-22 Hitachi Ltd 格子欠陥観察用電子顕微鏡
US5646403A (en) * 1994-10-28 1997-07-08 Nikon Corporation Scanning electron microscope
US7135676B2 (en) * 2000-06-27 2006-11-14 Ebara Corporation Inspection system by charged particle beam and method of manufacturing devices using the system
EP1304717A4 (en) * 2000-07-27 2009-12-09 Ebara Corp FLOOR BEAM ANALYSIS APPARATUS
EP1339100A1 (en) * 2000-12-01 2003-08-27 Ebara Corporation Inspection method and apparatus using electron beam, and device production method using it
JP4991487B2 (ja) 2007-11-01 2012-08-01 株式会社日立製作所 情報記憶装置及び記憶媒体
JP2012008109A (ja) 2010-06-24 2012-01-12 Toshiba It & Control Systems Corp Ｃｔ装置およびｃｔ装置の撮影方法
CN106783496B (zh) 2016-12-23 2018-05-22 北京大学 一种电子显微镜断层成像方法及系统
JP2019158534A (ja) * 2018-03-12 2019-09-19 株式会社ミツトヨ 計測用ｘ線ｃｔ装置、及び、その断層画像生成方法
US10515733B1 (en) 2019-04-24 2019-12-24 Euclid Techlabs, Llc Broad band tunable energy electron beam pulser
US11257656B2 (en) * 2020-04-08 2022-02-22 Fei Company Rotating sample holder for random angle sampling in tomography

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010003617A (ja) 2008-06-23 2010-01-07 Hitachi High-Technologies Corp 試料台，試料回転ホルダ，試料台作製方法，及び試料分析方法
JP2014239039A (ja) 2013-06-06 2014-12-18 エフ イー アイ カンパニＦｅｉ Ｃｏｍｐａｎｙ 電子線トモグラフィ法
JP2016031805A (ja) 2014-07-28 2016-03-07 株式会社日立製作所 試料ホルダ、荷電粒子線装置および観察方法
JP2016051576A (ja) 2014-08-29 2016-04-11 日本電子株式会社 ３次元像構築方法、画像処理装置、および電子顕微鏡
JP2016103387A (ja) 2014-11-28 2016-06-02 株式会社日立ハイテクノロジーズ 荷電粒子線装置

Also Published As

Publication number Publication date
EP3892987A1 (en) 2021-10-13
JP2021168292A (ja) 2021-10-21
US12074007B2 (en) 2024-08-27
US20210319975A1 (en) 2021-10-14
CN113495078B (zh) 2024-08-13
US20220157557A1 (en) 2022-05-19
JP2024153680A (ja) 2024-10-29
JP7789855B2 (ja) 2025-12-22
CN113495078A (zh) 2021-10-12
US11756762B2 (en) 2023-09-12
CN118777338A (zh) 2024-10-15
US11257656B2 (en) 2022-02-22
US20230377835A1 (en) 2023-11-23

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