JP7499655B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP7499655B2
JP7499655B2 JP2020151354A JP2020151354A JP7499655B2 JP 7499655 B2 JP7499655 B2 JP 7499655B2 JP 2020151354 A JP2020151354 A JP 2020151354A JP 2020151354 A JP2020151354 A JP 2020151354A JP 7499655 B2 JP7499655 B2 JP 7499655B2
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JP
Japan
Prior art keywords
substrate
liquid
etching
control body
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020151354A
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English (en)
Japanese (ja)
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JP2021057581A (ja
JP2021057581A5 (https=
Inventor
淳 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to KR1020200126252A priority Critical patent/KR102376830B1/ko
Priority to TW109133645A priority patent/TWI756850B/zh
Priority to CN202011050857.6A priority patent/CN112582303B/zh
Publication of JP2021057581A publication Critical patent/JP2021057581A/ja
Publication of JP2021057581A5 publication Critical patent/JP2021057581A5/ja
Application granted granted Critical
Publication of JP7499655B2 publication Critical patent/JP7499655B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2020151354A 2019-09-30 2020-09-09 基板処理装置 Active JP7499655B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200126252A KR102376830B1 (ko) 2019-09-30 2020-09-28 기판 처리 장치
TW109133645A TWI756850B (zh) 2019-09-30 2020-09-28 基板處理裝置
CN202011050857.6A CN112582303B (zh) 2019-09-30 2020-09-29 基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019179326 2019-09-30
JP2019179326 2019-09-30

Publications (3)

Publication Number Publication Date
JP2021057581A JP2021057581A (ja) 2021-04-08
JP2021057581A5 JP2021057581A5 (https=) 2023-02-16
JP7499655B2 true JP7499655B2 (ja) 2024-06-14

Family

ID=75271165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020151354A Active JP7499655B2 (ja) 2019-09-30 2020-09-09 基板処理装置

Country Status (1)

Country Link
JP (1) JP7499655B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7814341B2 (ja) * 2023-03-31 2026-02-16 芝浦メカトロニクス株式会社 基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157531A (ja) 2008-12-26 2010-07-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2011238825A (ja) 2010-05-12 2011-11-24 Tokyo Electron Ltd プラズマ処理装置及び半導体装置の製造方法
JP2012094836A (ja) 2010-09-27 2012-05-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2017069353A (ja) 2015-09-29 2017-04-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157531A (ja) 2008-12-26 2010-07-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2011238825A (ja) 2010-05-12 2011-11-24 Tokyo Electron Ltd プラズマ処理装置及び半導体装置の製造方法
JP2012094836A (ja) 2010-09-27 2012-05-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2017069353A (ja) 2015-09-29 2017-04-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JP2021057581A (ja) 2021-04-08

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