JP7496537B2 - Calibration data calculation device and calibration data calculation method - Google Patents

Description

This disclosure relates to a calibration data calculation device and a calibration data calculation method that calculate calibration data for correcting misalignment of a component mounting position based on predetermined data.

A mounting board manufacturing system that manufactures a mounting board by mounting electronic components on a board is configured by connecting multiple component mounting devices such as a solder printing device, a component mounting device, and a reflow device. In a mounting board manufacturing system configured in this way, it has been conventionally considered to prevent mounting defects caused by a deviation in the mounting position of components in the component mounting device. As an example, a position correction technology is used that feeds back component mounting deviation information indicating the deviation of the mounting position of components on a component-mounted board to the previous process. In this position correction based on the feedback of component mounting deviation information, the component mounting deviation obtained by actually measuring the mounting position of the component by a mounted component inspection device is sent to the component mounting device in the previous process. Then, the component mounting device corrects the mounting position based on the component mounting deviation information (for example, see Patent Document 1). In this example, calibration data for correcting position deviations caused by time-dependent fluctuations over the course of operation, such as thermal deformation of the component mounting mechanism over time, is calculated and updated as needed. This makes it possible to prevent a decrease in mounting position accuracy caused by time-dependent fluctuations in the component mounting device.

JP 2016-58604 A

However, in conventional technologies, including the prior art shown in Patent Document 1, proper position correction results may not always be obtained due to the selection of component placement deviation information to be subjected to position correction. In other words, in conventional technologies, the above-mentioned calibration data is calculated for all component placement deviation information acquired in the inspection of a mounted board. For this reason, the component placement deviation information to be used for calculating the calibration data also includes component placement deviation information for components that are placed on solder sections that are not formed properly due to printing defects in the solder printing device.

The calibration that is performed is originally intended to correct positional deviations caused by fluctuations over time that occur in the component mounting device. Therefore, it is not appropriate to subject data on component mounting deviations that occur due to printing defects in a solder printing device to calibration for this purpose, and there is a risk that inappropriate positional correction will be performed, reducing the mounting position accuracy. Thus, in the mounted board manufacturing system and mounted board manufacturing method of the prior art, there are cases in which appropriate positional correction results are not necessarily obtained due to the handling of component mounting deviation information that is fed back to the component mounting device from the mounted board inspection device.

This disclosure provides a calibration data calculation device and a calibration data calculation method that can optimize the handling of component placement deviation information fed back to a component placement device to obtain appropriate position correction results.

The calibration data calculation device disclosed herein is a calibration data calculation device that calculates calibration data for correcting the displacement of the mounting position of a component caused by the time-dependent fluctuation of a component mounting device having a component holding nozzle that mounts components on a solder part at a mounting point of a board, based on component mounting displacement data relating to the displacement of the mounting position of the component obtained by measuring a plurality of boards on which components are mounted, and excludes component mounting displacement data for components mounted on solder parts that are determined to be poor in a solder part inspection from the calculation of the calibration data.

The calibration data calculation method disclosed herein is a calibration data calculation method that calculates calibration data for correcting the displacement of the mounting position of a component caused by the time-dependent fluctuation of a component mounting device having a component holding nozzle that mounts components on a solder part at a mounting point of a board, based on component mounting displacement data relating to the displacement of the mounting position of the component obtained by measuring a plurality of boards on which components are mounted, and excludes component mounting displacement data for components mounted on solder parts that are determined to be poor in a solder part inspection from the calculation of the calibration data.

According to the present disclosure, it is possible to optimize the handling of component placement deviation information fed back to the component placement device, thereby obtaining appropriate position correction results.

FIG. 1 is a diagram showing a configuration of a mounting substrate manufacturing system according to an embodiment of the present disclosure. FIG. 2 is a front view showing the configuration of a screen printing device constituting the mounting board manufacturing system shown in FIG. FIG. 3 is a front view for explaining the function of the screen printing apparatus shown in FIG. FIG. 2 is a front view showing the configuration of a solder joint inspection device and a mounted component inspection device that constitute the mounting board manufacturing system shown in FIG. FIG. 2 is a side view showing the configuration of a component mounting device constituting the mounting board manufacturing system shown in FIG. FIG. 2 is a block diagram showing the configuration of a control system of the mounting board manufacturing system shown in FIG. FIG. 5 is a top view of a substrate for explaining items to be inspected by the solder joint inspection device shown in FIG. FIG. 5 is a top view of another substrate for explaining the items to be inspected by the solder joint inspection device shown in FIG. FIG. 5 is a side view of a circuit board for explaining items to be inspected by the solder joint inspection device shown in FIG. FIG. 5 is a side view of another substrate for explaining items to be inspected by the solder joint inspection device shown in FIG. 1 is a flowchart showing a process in a mounting board manufacturing method according to an embodiment of the present disclosure. A flowchart showing a solder joint inspection process in the mounting board manufacturing method shown in FIG. A flowchart showing a mounted component inspection process in the mounting board manufacturing method shown in FIG. FIG. 2 is a visual representation of calibration reference data in the mounting board manufacturing system shown in FIG. 1 . FIG. 1 is an explanatory diagram showing an example of component mounting misalignment caused by a defective solder joint in a mounting board manufacturing method according to an embodiment of the present disclosure. FIG. 12B is an explanatory diagram showing an example of component mounting deviation caused by a defective solder joint, which is subsequent to FIG. 12A.

The following describes an embodiment of the present disclosure with reference to the drawings. First, with reference to FIG. 1, the configuration and functions of a mounted board manufacturing system 1 in this embodiment will be described. The mounted board manufacturing system 1 manufactures a mounted board including a board and electronic components mounted on the board. The main component of the mounted board manufacturing system 1 is a component mounting line 1a that connects multiple component mounting devices. The devices that make up the component mounting line 1a are connected to each other by a communication network 2, and are also connected to an information management device 3 via the communication network 2. Of the multiple devices that make up the component mounting line 1a, FIG. 1 shows only a screen printing device M1, a solder part inspection device M2, a component mounting device M3, and a mounted component inspection device M4.

The screen printing device M1 uses screen printing to form solder parts 6 on lands 5 formed on the substrate 4 shown in Figures 7A to 7D, which will be described later. Therefore, the screen printing device M1 functions as a solder part forming device that forms the solder parts 6 on the substrate 4. Note that, in addition to the screen printing device, a solder application device that forms the solder parts 6 by applying solder to the lands 5 may also be used as the solder part forming device.

The solder inspection device M2 inspects the condition of the solder 6 formed on the board 4 by the screen printing device M1. The component mounting device M3 mounts components using a component holding nozzle 37b (see FIG. 5) described below on the board 4 after the solder 6 has been inspected by the solder inspection device M2. In other words, the mounted board manufacturing system 1 includes a component mounting device M3 that holds a component using the component holding nozzle 37b and mounts it at a mounting point on the board 4 on which the solder 6 has been formed.

The mounted component inspection device M4 measures the deviation of the mounting position of components (hereinafter, mounting deviation) for a component-mounted board on which components have been mounted by the component mounting device M3, and outputs component mounting deviation data relating to the mounting deviation. In this embodiment, the mounted component inspection device M4 feeds back this component mounting deviation data to the component mounting device M3. Then, the calibration data calculation unit of the component mounting device M3, which receives the feedback, calculates calibration data based on this component mounting deviation data to perform a calibration to correct the component mounting deviation caused by the aging fluctuation of the component mounting device M3, as described below.

Next, the configuration of the mounting devices that make up the above-mentioned component mounting line 1a will be described with reference to Figures 2 to 5. First, the configuration of the screen printing device M1 will be described with reference to Figure 2. A board positioning unit 12 is installed on the upper surface of a base 11. The board positioning unit 12 has a printing stage table 12a, which is an alignment mechanism, and a lifting mechanism 12b provided on its upper surface. A screen printing control unit 10 that controls each part described below is built into the base 11.

The lifting mechanism 12b holds a printing stage 13 that has a lifting table 13a as its base. The printing stage 13 moves horizontally along the X-axis, Y-axis, and a rotational direction (not shown) by driving the printing stage table 12a, and rises and falls by driving the lifting mechanism 12b. A substrate support section 14 having substrate support pins 14a is provided on the upper surface of the lifting table 13a. The substrate support section 14 rises and falls by driving the lifting mechanism 14b.

The lift table 13a further supports the second conveyor 15b from below, which constitutes the board transport section 15. The board transport section 15 includes a first conveyor 15a and a third conveyor 15c, which are located upstream and downstream of the second conveyor 15b, respectively. The board 4 carried into the screen printing device M1 by the first conveyor 15a is transferred to the second conveyor 15b. The board 4 is screen printed on the second conveyor 15b by the screen printing section 16, which will be described below. After screen printing, the board 4 is carried out via the third conveyor 15c to the downstream solder inspection device M2.

A screen printing unit 16 is disposed above the printing stage 13. The screen printing unit 16 has a screen mask 18. The screen mask 18 is provided with a printing pattern (pattern holes) for printing solder on the substrate 4. A squeegee 17 and a drive mechanism 17a are provided above the screen mask 18 for bringing the squeegee 17 into contact with the screen mask 18 to perform a squeegeeing operation.

A camera unit 19 including a mask camera 19a and a substrate camera 19b is disposed between the printing stage 13 and the screen mask 18. The camera unit 19 can be moved along the X-axis and Y-axis by a camera movement mechanism (not shown). The mask camera 19a and the substrate camera 19b capture images of desired positions of the screen mask 18 and the substrate 4, respectively. By recognizing and processing the images acquired by the camera unit 19, the screen printing control unit 10 detects the horizontal positions of the screen mask 18 and the substrate 4. Then, based on the position detection results, the screen printing control unit 10 aligns the substrate 4 and the screen mask 18 by moving the printing stage 13 horizontally.

In screen printing of solder by the screen printing device M1, the screen printing control unit 10 moves the camera unit 19 outward from the position between the screen mask 18 and the board 4. Then, as shown in FIG. 3, while the second conveyor 15b holds the board 4, the screen printing control unit 10 drives the lifting mechanism 12b to raise the printing stage 13 as shown by the arrow a. At the same time, the lifting mechanism 14b is driven to raise the board support unit 14 together with the board support pins 14a as shown by the arrow b. As a result, the board support pins 14a receive the board 4 from below and press it against the underside of the screen mask 18. In this state, the screen printing control unit 10 lowers the squeegee 17 as shown by the arrow c to abut against the screen mask 18. Next, the squeegee 17 is moved in the squeegeeing direction along the Y axis. As a result, the solder is screen printed on the board 4 through the pattern holes formed in the screen mask 18, and the solder portion 6 is formed on the land 5 of the board 4, for example, as shown in FIG. 7A.

Next, the configuration and functions of the solder part inspection device M2 and the mounted component inspection device M4 will be described with reference to Figure 4. Note that since these devices have different inspection and measurement targets, the detailed configurations differ for each device, but since they have in common the point that the inspection and measurement targets are photographed with a camera and optically recognized, for convenience they will be described on the same drawing.

The base 21 has a first inspection processing unit 20A built in for the solder inspection device M2, and a second inspection processing unit 20B built in for the mounted component inspection device M4. The first inspection processing unit 20A and the second inspection processing unit 20B control various work operations and processes in each device, such as board transport operations, image capture processing, recognition processing of images obtained by image capture, and inspection and measurement processing based on the images. These processes will be described later with reference to Figures 6, 9, and 10.

A board transport unit 22 is disposed on the upper surface of the base 21. The board transport unit 22 transports the board 4 to be inspected and measured, which has been brought in from an upstream device, and positions it at the inspection and measurement work position by the inspection head 24. In the solder inspection device M2, the inspection and measurement target is the board 4 on which the solder 6 has already been formed, and in the mounted component inspection device M4, the inspection and measurement target is the board 4P on which components have been mounted. The inspection head 24 includes a lens barrel 24a, a camera 26 built into the lens barrel 24a with the imaging direction facing downward, and an illumination unit 24b provided at the lower end of the lens barrel 24a. The inspection head 24 moves horizontally along the X-axis and Y-axis by a moving mechanism 25 having an XY table. The moving mechanism 25 makes it possible to position the camera 26 above a desired portion of the board 4. The illumination unit 24b has built-in upper illumination 28a and lower illumination 28b.

When imaging with the camera 26, either or both of the upper and lower illuminations 28a and 28b are turned on depending on the lighting conditions appropriate for the imaging subject. In addition, a coaxial illumination 28c is provided on the side of the lens barrel 24a. By turning on the coaxial illumination 28c, the board 4 is illuminated from the same direction as the imaging direction of the camera 26 via the half mirror 27 arranged inside the lens barrel 24a. The upper illumination 28a, lower illumination 28b, and coaxial illumination 28c constitute the illumination light source unit 28.

In this way, by switching the lighting conditions, the same camera 26 can be used to perform inspections and measurements for different purposes. The solder part inspection device M2 inspects the state of the solder parts 6 formed on the board 4. The mounted component inspection device M4 recognizes the relative position of the mounted component with respect to a reference position mark provided on the board 4, for example, and obtains component mounting deviation data by comparing this relative position with the reference position.

Next, the configuration and functions of the component mounting device M3 will be described with reference to FIG. 5. In the component mounting device M3, a component holding nozzle 37b holds a component and mounts it at a mounting point on the board 4. The base 31 has a mounting processing unit 30 built in, which has the function of controlling the work operation of the component mounting device M3 described below and performing recognition processing of images acquired by a camera possessed by the component mounting device M3. The mounting processing unit 30 controls, for example, the board transport operation, the component mounting work by the component mounting mechanism, and the recognition processing by the component recognition camera 36 and the board recognition camera 39.

On the upper surface of the base 31, a board transport section 35 having a pair of board transport conveyors is arranged along the transport direction of the board 4. That is, the board transport section 35 is arranged along the X-axis. The board transport section 35 transports the board 4 to be worked on along the X-axis. A board under-receiving section 34 is arranged between the board transport sections 35 on the upper surface of the base 31. In the board under-receiving section 34, a lifting mechanism 34b lifts and lowers multiple support pins 34a. When the board 4 is brought into the mounting work position, the mounting processing section 30 drives the lifting mechanism 34b to lift the support pins 34a. As a result, the multiple support pins 34a support the underside of the board 4.

A trolley 32 for supplying components is set on each side of the base 31 on the Y axis. A tape feeder 33, which is a component supply unit, is attached to the upper surface of the trolley 32. The tape feeder 33 feeds the carrier tape containing the components to be mounted on the board 4 at a pitch, thereby supplying the components to a component removal position by the component mounting mechanism described below.

Next, the configuration of the component mounting mechanism will be described. A moving mechanism 38 having an XY table is disposed on a frame portion (not shown) supported by the base 31. A mounting head 37 is attached to the moving mechanism 38 via a moving member 37a. By driving the moving mechanism 38, the mounting head 37 moves along the X-axis and Y-axis. As a result, the mounting head 37 moves between the component removal position of the tape feeder 33 and the board 4 positioned and held by the board transport section 35. The mounting head 37 holds the component removed from the tape feeder 33 by a component holding nozzle 37b provided at its lower end, and mounts it on the board 4.

A component recognition camera 36 is disposed between the board transport section 35 and the tape feeder 33. By positioning the mounting head 37, which has removed a component from the tape feeder 33, above the component recognition camera 36, the component recognition camera 36 captures an image of the component held by the mounting head 37 from below. This allows the component held by the mounting head 37 to be recognized, and the component can be identified and any misalignment in the holding position can be detected.

A board recognition camera 39 is attached to the moving member 37a with its imaging direction facing downward. By moving the board recognition camera 39 together with the mounting head 37 and positioning it above the board 4, the board recognition camera 39 images the board 4 held by the board transport unit 35. The mounting processing unit 30 identifies and detects the position of the board 4 by performing recognition processing on the images of the recognition marks and mounting points of the board 4 acquired by this imaging. When the component mounting device M3 mounts components on the board 4, the component mounting operation by the component mounting mechanism is corrected based on the identification results and position detection results of the board 4 acquired in this manner.

Next, referring to FIG. 6, the configuration of the control system of each device constituting the mounting board manufacturing system 1 will be described. Note that only elements related to the solder part inspection function by the solder part inspection device M2, the mounted component inspection function by the mounted component inspection device M4, and the calibration performed by the component mounting device M3 based on the component mounting deviation data 62a obtained by the mounted component inspection are shown here.

The information management device 3 is connected to the first inspection processing unit 20A of the solder inspection device M2, the mounting processing unit 30 of the component mounting device M3, and the second inspection processing unit 20B of the mounted component inspection device M4 via the communication network 2. The information management device 3 includes a reference data storage unit 3A that stores calibration reference data. The calibration reference data is information required when the calibration data calculation unit 52 of the component mounting device M3 calculates the calibration data. Specifically, the calibration reference data includes the results of the solder inspection and the mounted component inspection recorded for each board, and the mounting deviation of the component measured by the mounted component inspection device. When the information management device 3 receives the inspection results from the solder inspection device M2 or the mounted component inspection device M4, it creates or updates the calibration reference data to which a board ID, which is identification information that specifies the board 4, is assigned.

The first inspection processing unit 20A of the solder inspection device M2 includes an inspection execution unit 41, an inspection result storage unit 42, and a judgment criterion storage unit 43. The inspection execution unit 41 controls the camera 26 to capture an image of the part to be inspected on the board 4, and performs recognition processing on the acquired image. Through this processing, the solder part 6 is inspected for specified inspection target items related to the state of the formed solder part 6. The inspection result storage unit 42 stores the inspection results by the inspection execution unit 41. Furthermore, the inspection execution unit 41 transmits the inspection results to the information management device 3 via the communication network 2.

The criterion memory unit 43 stores the criterion used for judgment in the inspection of the solder part 6 performed by the inspection execution unit 41. As an example, the criterion memory unit 43 has two types of reference values set therein: a first criterion 43a and a second criterion 43b. The first criterion 43a is set to judge whether the solder part formed on the board 4 is in an appropriate state for mounting a component, that is, to judge whether the state of the solder part 6 is acceptable or not from the viewpoint of whether or not the component can be mounted.

For example, there may be cases where no solder is formed at the mounting point of the inspection target, or the amount of solder is extremely small, and there is a high probability that the solder joint will be defective even if a component is mounted and reflow is performed. In such cases, the solder joint of the inspection target is judged to be unsatisfactory based on the first judgment criterion 43a. Also, if the solder joint of the inspection target is in a state where there is a certain or higher probability that the solder joint will be a good product if a component is mounted on the solder joint of the inspection target and reflow is performed, the solder joint of the inspection target is judged to be pass based on the first judgment criterion 43a. In contrast, the second judgment criterion 43b is set to judge whether the condition of the solder joint of the inspection target is good from the viewpoint of solder joint. In other words, whether the condition of the solder joint that is judged to be pass in the judgment using the first judgment criterion 43a is good is judged based on the second judgment criterion 43b.

In this way, the solder inspection device M2 judges that the condition of the solder 6 formed on the board 4 is acceptable based on the first judgment criterion 43a, and then judges whether the condition of the solder 6 is good or not based on the second judgment criterion 43b. The first judgment criterion 43a and the second judgment criterion 43b are both thresholds for judgment in the inspection parameters, and are set for each inspection target item described below.

Figures 7A to 7D show examples of items to be inspected in solder inspection by the solder inspection device M2. First, Figure 7A shows inspection of print position misalignment. That is, the inspection target is the position misalignment of the solder 6 formed by screen printing on the board 4 with respect to the land 5. The deviations ΔX and ΔY between the center 5c of the land 5 and the center 6c of the solder 6 are found by recognition processing of the image captured by the camera 26. Next, Figure 7B shows inspection of the print area. That is, the inspection target is the area 6S of the solder 6 formed by screen printing on the board 4. In this case as well, the area 6S is found by recognition processing of the image captured by the camera 26.

Figure 7C shows inspection of print height. That is, the height 6H of the solder part 6 formed by screen printing on the substrate 4 is inspected. In this case, the height 6H is obtained by three-dimensional inspection of the image acquired by the camera 26. Figure 7D shows inspection of print volume. That is, the volume 6V of the solder part 6 formed by screen printing on the substrate 4 is inspected. In this case, the volume 6V is similarly obtained by three-dimensional inspection of the image acquired by the camera 26.

In the solder part inspection for the above-mentioned inspection items, the inspection results obtained for each inspection item are compared with the first judgment criterion 43a and the second judgment criterion 43b for each inspection item. That is, the first judgment criterion 43a and the second judgment criterion 43b are referenced for each of the deviations ΔX and ΔY in the print position misalignment inspection, the solder area 6S in the print area inspection, the solder height 6H in the print height inspection, and the solder volume 6V in the print volume inspection. The inspection execution unit 41 then judges whether the solder part 6 passes or fails, and further judges whether the condition of the solder part 6 that is judged to pass is good or not.

Next, the mounting processing unit 30 of the component mounting device M3 will be described. The mounting processing unit 30 includes a mounting control unit 51 and a calibration data calculation unit 52. The mounting control unit 51 controls the component mounting operation by the component mounting mechanism in the component mounting device M3 shown in FIG. 5. The calibration data calculation unit 52 calculates calibration data for correcting component mounting deviations caused by aging fluctuations in the component mounting device M3.

This calibration data is calculated based on the component mounting deviation data. As described below, the component mounting deviation data relates to component mounting deviations measured by the mounted component inspection device M4 for multiple component-mounted boards 4P and fed back to the component mounting device M3. In this embodiment, a configuration example is shown in which the calibration data calculation unit 52 having the above-mentioned functions is provided in the component mounting device M3, but the calibration data calculation unit 52 may be provided in another device other than the component mounting device M3, such as the information management device 3. That is, in a configuration example in which the calibration data calculation unit 52 is provided in the component mounting device M3, the component mounting device M3 functions as the calibration data calculation device. Also, in a configuration example in which the calibration data calculation unit 52 is provided in the information management device 3, the information management device 3 functions as the calibration data calculation device.

During component mounting work, the component mounting device M3 uses the calibration data to correct the stopping position of the component holding nozzle 37b when mounting a component on a mounting point. In this embodiment, the calibration data calculation unit 52 excludes component mounting deviation data for components mounted on solder parts for which the solder part condition inspection result determined by the solder part inspection device M2 to be poor from the calculation of the calibration data.

Next, the second inspection processing unit 20B of the mounted component inspection device M4 will be described. The second inspection processing unit 20B includes an inspection execution unit 61, an inspection result storage unit 62, and a judgment criterion storage unit 63. The inspection execution unit 61 inspects the specified inspection target items by imaging the part to be inspected on the board 4 with the camera 26 and performing recognition processing on the acquired image. This inspection includes a component mounting deviation measurement that measures the mounting deviation of the component mounted board 4P on which the component is mounted by the component mounting device M3. The judgment criterion storage unit 63 stores a position deviation judgment criterion 63a that judges whether the mounting deviation of the component is acceptable or not. The inspection execution unit 61 judges whether the component mounting deviation exceeds the position deviation judgment criterion 63a (allowable position deviation) set for the component. If the component mounting deviation is within the range, the inspection execution unit 61 judges it as acceptable, and if it exceeds the range, it judges it as unacceptable (position deviation defect). The inspection result storage unit 62 stores the inspection result by the inspection execution unit 61. This inspection result includes component placement deviation data 62a obtained by the component placement deviation measurement described above.

The judgment criteria storage units 43 and 63 are composed of RAM (random access memory) or ROM (read only memory), etc. The reference data storage unit 3A and the inspection result storage units 42 and 62 are composed of rewritable RAM or hard disk, etc. The inspection execution units 41 and 61, the on-board control unit 51, and the calibration data calculation unit 52 are composed of a CPU (central processing unit) or an LSI (large scale integrated circuit). The information management device 3 also includes a CPU or an LSI. The components other than the storage unit may be composed of dedicated circuits, or general-purpose hardware may be controlled by software read from a transient or non-transient storage device. Two or more of these may be integrated together. Furthermore, one or more of the first inspection processing unit 20A, the on-board processing unit 30, and the second inspection processing unit 20B may be integrated with the information management device 3.

Next, the process flow of the mounting board manufacturing method executed by the mounting board manufacturing system 1 configured as described above will be described with reference to FIG. 8. Here, the mounting board manufacturing method is shown using a screen printing device M1 that forms solder parts 6 on the board 4, and a component mounting device M3 that holds components with a component holding nozzle 37b and mounts them on mounting points on the board 4.

First, the solder joints 6 are formed on the board 4 using the screen printing device M1 (ST1: solder joint formation process). Next, the board 4 is transported to the solder joint inspection device M2, and the state of the solder joints 6 formed on the board 4 is inspected in ST1 (ST2: solder joint inspection process). Next, the board 4 is transported to the component mounting device M3, and a component is mounted by the component holding nozzle 37b at the target position on the board 4 after the inspection of the solder joints 6 in ST2 has been completed (ST3: component mounting process).

Next, the board 4 is transported to the mounted component inspection device M4, and the component mounting displacement of the component-mounted board 4P on which the components are mounted in ST3, i.e., the positional displacement from the target mounting position of the component in ST3, is measured (ST4: mounted component inspection process). The measured component mounting displacement data is sent to the information management device 3 via the communication network 2.

Note that ST1 and ST2 do not have to be performed consecutively. For example, a board 4 with solder parts 6 already formed thereon may be purchased from another company, and ST2 to ST5 may be performed using such a board 4. Alternatively, solder parts 6 may be formed on the board 4 the previous day, and ST2 to ST5 may be performed the following day or later. In such a case, the solder part inspection device M2, component mounting device M3, mounted component inspection device M4, and information management device 3 constitute a component mounting system according to this embodiment. Also, in FIG. 8, ST2 to ST5 show a component mounting method according to this embodiment.

Next, the solder inspection process executed in ST2 will be described with reference to FIG. 9. Here, the part to be inspected on the board 4 is imaged and the acquired image is subjected to recognition processing to inspect the specified inspection target items related to the state of the formed solder 6.

In this inspection, the inspection execution unit 41 acquires an image of the solder part 6 to be inspected from the image captured by the camera 26 (ST11). Next, the inspection execution unit 41 reads out the first judgment criterion 43a and the second judgment criterion 43b stored in the judgment criterion memory unit 43 (ST12). Next, the inspection execution unit 41 determines the print position deviation, print area, print height, and print volume by performing a recognition process on the image (ST13). Next, the inspection execution unit 41 judges whether the condition of the solder part 6 is pass or fail based on the first judgment criterion 43a (ST14). If it is fail, the inspection result of this solder part is stored as fail in the inspection result memory unit 42 (ST18).

On the other hand, if ST14 is passed, the inspection execution unit 41 judges whether the condition of the solder parts 6 is good or bad based on the second judgment criterion 43b (ST15). The judgment result is then stored in the inspection result memory unit 42 (ST16, ST17). The inspection execution unit 41 then checks whether inspection of all solder parts 6 on the board 4 has been completed (ST19), and if there are any solder parts 6 that have not been inspected, returns to ST11 and repeats the process. When inspection of all solder parts 6 is completed, the solder part inspection device M2 outputs the board ID of the inspected board 4 and the inspection results of all solder parts 6 to the information management device 3 (ST20).

In the above description, the pass/fail judgment of the solder parts 6 is made in ST14, and the condition of the solder parts 6 that pass is judged in ST15. However, the judgment in ST15 may be made without going through ST14. However, by making the judgment in ST14 before ST15, the boards 4 that include solder parts that fail the inspection in ST14 can be excluded from being targets for component mounting.

Next, the mounted component inspection process executed in ST4 will be described with reference to FIG. 10. First, the inspection execution unit 61 acquires an image of the component to be inspected from the captured image (ST31). Next, the inspection execution unit 61 reads out the positional deviation judgment criterion 63a stored in the judgment criterion storage unit 63 (ST32). Next, the inspection execution unit 61 measures the component mounting deviation by performing a recognition process on the acquired image (ST33). Then, the inspection execution unit 61 judges whether the measured component mounting deviation exceeds the positional deviation judgment criterion 63a set for the component (ST34). The judgment result is stored in the inspection result storage unit 62 (ST35, ST36). Then, the inspection execution unit 61 checks whether the inspection of all the components mounted on the board 4 is completed (ST37), and if there are any uninspected components, the process returns to ST31 and is repeated. When the inspection of all the components is completed, the mounted component inspection device M4 outputs the board ID of the component-mounted board 4P for which the inspection has been completed and the inspection results of all the components to the information management device 3 (ST38). Note that ST32 may be performed before ST31 or after ST33.

In the reference data storage unit 3A of the information management device 3, a part of the inspection results transmitted from the solder inspection device M2 and the mounted component inspection device M4 is stored as calibration reference data. FIG. 11 visually shows the calibration reference data. The calibration reference data includes the solder inspection results of multiple components (mounting points) on the board, the mounted component inspection results, and the component mounting deviation. The mounting points are identified by component IDs. As the number of component-mounted boards 4P that have completed the mounted component inspection process increases, the amount of calibration reference data becomes sufficient to obtain valid calibration data. When a sufficient amount of calibration reference data is accumulated in this way, the calibration data calculation unit 52 acquires the component mounting deviation from the reference data storage unit 3A. Then, the calibration data calculation unit 52 calculates calibration data for each component (mounting point) to correct the component mounting deviation caused by the aging fluctuation of the component mounting device M3. For example, the average component mounting deviation for each component for several boards is calculated, and the calibration data is calculated by multiplying this by a coefficient, etc.

When creating calibration data, the calibration data calculation unit 52 excludes component mounting misalignment data of components that are determined to be poor in the solder part inspection and are mounted on the solder part from the calibration data calculation. Specifically, component mounting misalignment of components that are determined to be poor in the solder part inspection results in the calibration reference data is not used in the calibration data calculation.

The reason for this is explained below. The calibration performed by component mounting device M3 is originally intended to correct positional deviations caused by fluctuations over time in component mounting device M3. Therefore, it is not appropriate to use data on component mounting deviations caused by printing defects in screen printing device M1 as the subject of calibration data creation. Creating calibration data including such data may result in inappropriate position correction, which could reduce mounting position accuracy. Note that printing defects here refer to the state of the solder part that meets the first judgment criterion 43a shown in FIG. 6 but does not meet the second judgment criterion 43b.

Figures 12A and 12B show an example of component mounting misalignment caused by printing defects in such a screen printing device M1. A solder portion 6 is formed by screen printing on a pair of lands 5 provided on a substrate 4, and a chip-type component 7 having connection terminals 7a at both ends is mounted on the land 5 on which the solder portion 6 is formed. However, in Figure 12A, a defective solder portion 6N is formed on one of the pair of lands 5, with the solder height being uneven and the upper surface tilted to one side.

Figure 12B shows a state in which a chip-type component 7 is mounted on a land 5 with a defective solder section 6N and a land 5 with a normal solder section 6, and the terminal 7a is landed on the land 5 from above via the defective solder section 6N and the solder section 6. At this time, the terminal 7a approaching the defective solder section 6N from above is unable to land in the correct position, and lands with a lateral positional deviation dm due to the inclination of the upper surface of the defective solder section 6N. As a result, the chip-type component 7 is mounted shifted from the reference position by the positional deviation dm.

When the mounted component inspection device M4 performs a mounted component inspection on a chip-type component 7 in this state, in the conventional technology, the above-mentioned positional deviation dm is treated as a component mounting deviation regardless of the cause of the deviation. Therefore, the positional deviation dm is also used in the calculation of the calibration data. However, the positional deviation dm occurs completely unrelated to deterioration over time in the component mounting device M3. Therefore, in the present embodiment, component mounting deviations caused by such printing defects are excluded from the calculation of the calibration data. This makes it possible to optimize the handling of the component mounting deviation information fed back to the component mounting device M3 and obtain appropriate position correction results.

The embodiment of the present disclosure has been described above, but modifications may be made without departing from the scope of the present disclosure. For example, AI (artificial intelligence) may be used to calculate the calibration data, and the calibration data calculation unit 52 may be configured with an artificial intelligence having a learning function. In this case, the component mounting misalignment of the component mounted on the solder part whose inspection result is determined to be poor in the solder part inspection process may be excluded from the target of the calculation of the calibration data by excluding it from the learning data of the AI from the learning target of the artificial intelligence. Note that the present disclosure excludes the component mounting misalignment of the component mounted on the solder part whose inspection result is determined to be poor in the solder part inspection process from the target of the calculation of the calibration data. In addition to this, it is not prohibited to exclude other problematic component mounting misalignments. For example, the component mounting misalignment of the component whose inspection result of the mounted component is determined to be poor may be included in the target of exclusion.

The calibration data calculation device and calibration data calculation method disclosed herein can optimize the handling of component mounting deviation information fed back to a component mounting device, thereby obtaining appropriate position correction results. This makes them useful in the technical field of manufacturing mounted boards by mounting electronic components on a board.

1 Mounted board manufacturing system 1a Component mounting line 2 Communication network 3 Information management device 3A Reference data storage unit 4 Board 4P Board with components mounted 5 Land 5c Center 6 Solder part 6c Center 6H Height 6N Defective solder part 6S Area 6V Volume 7 Chip type component 7a Terminal 10 Screen printing control unit 11, 21, 31 Base 12 Board positioning unit 12a Print stage table 12b, 14b Lifting mechanism 13 Print stage 13a Lifting table 14 Board support unit 14a Board support pin 15, 35 Board transport unit 15a First conveyor 15b Second conveyor 15c Third conveyor 16 Screen printing unit 17 Squeegee 17a Drive mechanism 18 Screen mask 19 Camera unit 19a Mask camera 19b Board camera 20A First inspection processing unit 20B Second inspection processing unit 22 Board transport unit 24 Inspection head 24a Lens barrel section 24b Illumination unit 25, 38 Movement mechanism 26 Camera 27 Half mirror 28 Illumination light source section 28a Upper level illumination 28b Lower level illumination 28c Coaxial illumination 30 Mounting processing section 32 Cart 33 Tape feeder 34 Board under-receiving section 34a Support pin 34b Lifting mechanism 36 Component recognition camera 37 Mounting head 37a Moving member 37b Component holding nozzle 39 Board recognition camera 41, 61 Inspection execution section 42, 62 Inspection result storage section 43, 63 Judgment criterion storage section 43a First judgment criterion 43b Second judgment criterion 51 Mounting control section 52 Calibration data calculation section 62a Component mounting deviation data 63a Position deviation judgment criterion M1 Screen printing device M2 Solder portion inspection device M3 Component mounting device M4 Mounted component inspection device

Claims (6)

A calibration data calculation device that calculates calibration data for correcting a displacement of a mounting position of a component caused by a time-dependent change in a component mounting device having a component holding nozzle that mounts components on a solder part of a mounting point of a board, based on component mounting displacement data relating to a displacement of the mounting position of the component obtained by measuring a plurality of boards on which components are mounted, comprising:
A calibration data calculation device that excludes component mounting misalignment data for components mounted on solder joints that have been determined to be unsatisfactory in a solder joint inspection from the calculation of the calibration data. The calibration data calculation device according to claim 1, which uses artificial intelligence to calculate the calibration data, and excludes component mounting misalignment data for components mounted on solder parts whose inspection results are determined to be poor from the learning data of the artificial intelligence. The calibration data calculation device according to claim 1, wherein, in the calculation of the calibration data, component mounting deviations determined to be defective among the component mounting deviation data are excluded from the calculation of the calibration data. A calibration data calculation method for calculating calibration data for correcting a displacement of a mounting position of a component caused by a time-dependent change in a component mounting device having a component holding nozzle that mounts components on a solder part of a mounting point of a board, based on component mounting displacement data relating to a displacement of the mounting position of the component obtained by measuring a plurality of boards on which components are mounted, comprising:
A calibration data calculation method, comprising excluding component mounting misalignment data for components mounted on solder joints that have been determined to be poor in a solder joint inspection from the calculation of the calibration data. The calibration data calculation method according to claim 4, wherein artificial intelligence is used to calculate the calibration data, and component mounting deviation data for components mounted on solder parts determined to have poor inspection results is excluded from the learning data of the artificial intelligence. The calibration data calculation method according to claim 4, wherein, in the calculation of the calibration data, component mounting deviations determined to be defective among the component mounting deviation data are excluded from the calculation of the calibration data.

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