JP7487102B2 - Dmlmビルドプラットフォームおよび表面平坦化 - Google Patents
Dmlmビルドプラットフォームおよび表面平坦化 Download PDFInfo
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- JP7487102B2 JP7487102B2 JP2020521437A JP2020521437A JP7487102B2 JP 7487102 B2 JP7487102 B2 JP 7487102B2 JP 2020521437 A JP2020521437 A JP 2020521437A JP 2020521437 A JP2020521437 A JP 2020521437A JP 7487102 B2 JP7487102 B2 JP 7487102B2
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- 238000000034 method Methods 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 41
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- 239000000654 additive Substances 0.000 claims description 19
- 230000000996 additive effect Effects 0.000 claims description 19
- 238000012876 topography Methods 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 description 15
- 238000011960 computer-aided design Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000005245 sintering Methods 0.000 description 7
- 238000000149 argon plasma sintering Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
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- 239000012254 powdered material Substances 0.000 description 2
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- 238000010146 3D printing Methods 0.000 description 1
- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 1
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical compound [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 description 1
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- 239000010952 cobalt-chrome Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010100 freeform fabrication Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005495 investment casting Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007528 sand casting Methods 0.000 description 1
- 238000000110 selective laser sintering Methods 0.000 description 1
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- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B22F10/20—Direct sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Description
その全体が参照により本明細書に組み込まれる、同時出願された下記の関連出願への参照が行われる:
付加製造により物体を製造する方法であって、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)~(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、方法。
(e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、任意の前項に記載の方法。
前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、任意の前項に記載の方法。
測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、任意の前項に記載の方法。
融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、任意の前項に記載の方法。
物体をビルドするための付加製造装置であって、
少なくとも粉末ディスペンサ、融解機構、およびリコータを含むビルドユニットと、
ビルド面と、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している領域を特定する、測定ユニットと、
を備える、付加製造装置。
前記融解機構は、バインダジェットまたは照射源である、任意の前項に記載の装置。
前記測定ユニットは、ライダまたは格納可能なプローブを含む、任意の前項に記載の装置。
プログラムが具現化されたコンピュータ可読記憶媒体であって、前記プログラムは、プロセッサにより実行された場合、付加製造により物体を製造する方法を実施し、前記方法は、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)~(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、コンピュータ可読記憶媒体。
(e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、任意の前項に記載のコンピュータ可読記憶媒体。
前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、任意の前項に記載のコンピュータ可読記憶媒体。
測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、任意の前項に記載のコンピュータ可読記憶媒体。
融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、任意の前項に記載のコンピュータ可読記憶媒体。
112、204 粉末床
114、208 ビルドプラットフォーム
116、413 リコータアーム
118 粉末高さ
120 源、レーザ
122 部品
126 リザーバ
128 廃棄容器
132 ガルボスキャナ
134 方向
136 エネルギービーム
202、309、415 物体
300 大規模付加製造装置
301 位置決め機構、ガントリ
302、602 ビルドユニット
303、401 照射放出方向付けデバイス
304 x横桁
305A、305B z横桁
306 (ビルドユニット302をy方向に移動させる)機構
307 層流ガス流区域
308、414 ビルド覆い
330、430、530、604 センサ
400 ビルドユニット、装置
403 ガス流デバイス
403A 加圧出口部分
403B 真空入口部分
404 ガス流区域
405 リコータ
406 ホッパ
407 後方プレート
408 前方プレート
409、509 作動要素
410 ゲートプレート
411、511 リコータブレード
412 アクチュエータ
416、706 粉末
417 ホッパ間隙
418 筐体
419 不活性環境
420 取付けプレート
500 装置
510 要素
521 粉末層
522 均一な粉末層
606、702 ビルド面
704 陥凹領域、陥凹低領域
708 統一層
Claims (13)
- 付加製造により物体を製造する方法であって、
製造中における前記物体の歪んだ表面であるビルド面(702)のトポグラフィーを測定し、前記物体を形成する所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面(702)の前記トポグラフィーの変化を減少させるために、前記陥凹領域(704)を埋めるステップであって、
(a)前記ビルド面(702)の前記陥凹領域(704)の上に所定の粉末層(706)を選択的に堆積させて前記粉末層(706)を平らにするステップ、
(b)前記所定の粉末層(706)を、前記ビルド面(702)の1つの前記陥凹領域(704)において融解するステップ、
および、
(c)前記陥凹領域(704)を埋める前記ステップが完了するまで、前記ステップ(a)及び(b)を反復するステップ
を含み、前記陥凹領域(704)上に前記粉末層(706)と平行な方向にガス流が供給される前記陥凹領域(704)を埋めるステップと、
を含む、方法。 - (d)前記ステップ(c)の後に、前記物体をビルドするステップ
をさらに含む、請求項1に記載の方法。 - 前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域(704)を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、請求項1または2に記載の方法。
- 測定する前記ステップは、パルス状レーザ光を前記ビルド面(702)に照明し、且つセンサを用いて反射パルスを測定することにより前記ビルド面(702)までの距離を測定する測量法を用いて行われる、請求項1から3のいずれか一項に記載の方法。
- 融解する前記ステップは、照射を使用して実施される、請求項1から4のいずれか一項に記載の方法。
- 物体をビルドするための付加製造装置であって、
少なくとも粉末ディスペンサ、融解機構、およびリコータを含むビルドユニット(602)と、
製造中における前記物体の歪んだ表面であるビルド面(702)のトポグラフィーを測定し、前記物体を形成する所望の略平坦な表面に対して陥凹している領域を特定する、測定ユニット(604)と、
を備え、
前記ビルド面(702)の前記陥凹している領域に前記粉末ディスペンサ内の粉末が選択的に堆積されるように、前記ビルドユニット(602)は前記ビルド面の上でx方向、y方向及びz方向に移動可能であり、
前記測定ユニット(604)が前記ビルドユニット(602)に取り付けられており、
前記ビルド面(702)の前記陥凹している領域上に、前記陥凹している領域に堆積されて平らにされた粉末層(706)と平行な方向にガス流が供給される、付加製造装置。 - 前記融解機構は、照射源である、請求項6に記載の装置。
- 前記測定ユニット(604)は、パルス状レーザ光を前記ビルド面(702)に照明し、且つセンサを用いて反射パルスを測定することにより前記ビルド面(702)までの距離を測定する測量法を行う、請求項6または7に記載の装置。
- プログラムが具現化されたコンピュータ可読記憶媒体であって、前記プログラムは、プロセッサにより実行された場合、付加製造により物体を製造する方法を実施し、前記方法は、
製造中における前記物体の歪んだ表面であるビルド面(702)のトポグラフィーを測定し、前記物体を形成する所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面(702)の前記トポグラフィーの変化を減少させるために、前記陥凹領域(704)を埋めるステップであって、
(a)前記ビルド面(702)の前記陥凹領域(704)の上に所定の粉末層(706)を選択的に堆積させて前記粉末層(706)を平らにするステップ、
(b)前記所定の粉末層(706)を、前記ビルド面(702)の1つの前記陥凹領域(704)において融解するステップ、
および、
(c)前記陥凹領域(704)を埋める前記ステップが完了するまで、前記ステップ(a)及び(b)を反復するステップ
を含み、
前記陥凹領域(704)上に前記粉末層(706)と平行な方向にガス流が供給される前記陥凹領域(704)を埋めるステップと
を含む、コンピュータ可読記憶媒体。 - 前記方法は、(d)前記ステップ(c)の後に、前記物体をビルドするステップ
をさらに含む、請求項9に記載のコンピュータ可読記憶媒体。 - 前記方法は、前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域(704)を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、請求項9または10に記載のコンピュータ可読記憶媒体。
- 測定する前記ステップは、パルス状レーザ光を前記ビルド面(702)に照明し、且つセンサを用いて反射パルスを測定することにより前記ビルド面(702)までの距離を測定する測量法を用いて行われる、請求項9から11のいずれか一項に記載のコンピュータ可読記憶媒体。
- 融解する前記ステップは、照射を使用して実施される、請求項9から12のいずれか一項に記載のコンピュータ可読記憶媒体。
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FR3111574B1 (fr) * | 2020-06-19 | 2022-08-12 | Safran | Détection et localisation d’anomalies d’étalements de poudre par mesures d’émissions acoustiques |
US20220154443A1 (en) * | 2020-11-19 | 2022-05-19 | Icon Technology, Inc. | Topologically adaptive toolpath generation system and method for additively constructing a building structure |
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