JP2021502477A - Dmlmビルドプラットフォームおよび表面平坦化 - Google Patents
Dmlmビルドプラットフォームおよび表面平坦化 Download PDFInfo
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- 238000002844 melting Methods 0.000 claims abstract description 33
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Abstract
Description
その全体が参照により本明細書に組み込まれる、同時出願された下記の関連出願への参照が行われる:
付加製造により物体を製造する方法であって、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)〜(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、方法。
(e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、任意の前項に記載の方法。
前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、任意の前項に記載の方法。
測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、任意の前項に記載の方法。
融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、任意の前項に記載の方法。
物体をビルドするための付加製造装置であって、
少なくとも粉末ディスペンサ、融解機構、およびリコータを含むビルドユニットと、
ビルド面と、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している領域を特定する、測定ユニットと、
を備える、付加製造装置。
前記融解機構は、バインダジェットまたは照射源である、任意の前項に記載の装置。
前記測定ユニットは、ライダまたは格納可能なプローブを含む、任意の前項に記載の装置。
プログラムが具現化されたコンピュータ可読記憶媒体であって、前記プログラムは、プロセッサにより実行された場合、付加製造により物体を製造する方法を実施し、前記方法は、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)〜(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、コンピュータ可読記憶媒体。
(e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、任意の前項に記載のコンピュータ可読記憶媒体。
前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、任意の前項に記載のコンピュータ可読記憶媒体。
測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、任意の前項に記載のコンピュータ可読記憶媒体。
融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、任意の前項に記載のコンピュータ可読記憶媒体。
112、204 粉末床
114、208 ビルドプラットフォーム
116、413 リコータアーム
118 粉末高さ
120 源、レーザ
122 部品
126 リザーバ
128 廃棄容器
132 ガルボスキャナ
134 方向
136 エネルギービーム
202、309、415 物体
300 大規模付加製造装置
301 位置決め機構、ガントリ
302、602 ビルドユニット
303、401 照射放出方向付けデバイス
304 x横桁
305A、305B z横桁
306 (ビルドユニット302をy方向に移動させる)機構
307 層流ガス流区域
308、414 ビルド覆い
330、430、530、604 センサ
400 ビルドユニット、装置
403 ガス流デバイス
403A 加圧出口部分
403B 真空入口部分
404 ガス流区域
405 リコータ
406 ホッパ
407 後方プレート
408 前方プレート
409、509 作動要素
410 ゲートプレート
411、511 リコータブレード
412 アクチュエータ
416、706 粉末
417 ホッパ間隙
418 筐体
419 不活性環境
420 取付けプレート
500 装置
510 要素
521 粉末層
522 均一な粉末層
606、702 ビルド面
704 陥凹領域、陥凹低領域
708 統一層
Claims (13)
- 付加製造により物体を製造する方法であって、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)〜(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、方法。 - (e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、請求項1に記載の方法。 - 前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、請求項2に記載の方法。
- 測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、請求項1に記載の方法。
- 融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、請求項1に記載の方法。
- 物体をビルドするための付加製造装置であって、
少なくとも粉末ディスペンサ、融解機構、およびリコータを含むビルドユニットと、
ビルド面と、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している領域を特定する、測定ユニットと、
を備える、付加製造装置。 - 前記融解機構は、バインダジェットまたは照射源である、請求項6に記載の装置。
- 前記測定ユニットは、ライダまたは格納可能なプローブを含む、請求項6に記載の装置。
- プログラムが具現化されたコンピュータ可読記憶媒体であって、前記プログラムは、プロセッサにより実行された場合、付加製造により物体を製造する方法を実施し、前記方法は、
ビルド面のトポグラフィーを測定し、所望の略平坦な表面に対して陥凹している陥凹領域を特定するステップと、
前記ビルド面の前記トポグラフィーの変化を減少させるために、前記陥凹領域を埋めるステップであって、
(a)前記ビルド面の前記陥凹領域の上に所定の粉末層を堆積させるステップ、
(b)前記所定の粉末層を、前記ビルド面の1つの前記陥凹領域において融解するステップ、
(c)前記ビルド面の前記陥凹領域の上に、後続粉末層を堆積させるステップ、および、
(d)前記陥凹領域を埋める前記ステップが完了するまで、前記ステップ(a)〜(c)を反復するステップ
を含む、前記陥凹領域を埋めるステップと
を含む、コンピュータ可読記憶媒体。 - (e)前記ステップ(d)の後に、前記物体をビルドするステップ
をさらに含む、請求項9に記載の方法。 - 前記物体のCADファイルに前記測定されたトポグラフィーの逆の3D表現を付加して、カスタムCADファイルを生成するステップと、前記カスタムCADファイルを使用して、前記陥凹領域を埋める前記ステップおよび前記物体をビルドする前記ステップを導くステップとをさらに含む、請求項10に記載の方法。
- 測定する前記ステップは、ライダまたは格納可能なプローブを用いて行われる、請求項9に記載の方法。
- 融解する前記ステップは、照射またはバインダジェッティングを使用して実施される、請求項9に記載の方法。
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US11511351B2 (en) * | 2018-08-10 | 2022-11-29 | Canon Kabushiki Kaisha | Additive manufacturing apparatus and method for manufacturing three-dimensionally shaped object |
CN111250716A (zh) * | 2020-03-19 | 2020-06-09 | 广东峰华卓立科技股份有限公司 | 一种砂型三维打印机铺砂装置及铺砂控制方法 |
FR3111574B1 (fr) * | 2020-06-19 | 2022-08-12 | Safran | Détection et localisation d’anomalies d’étalements de poudre par mesures d’émissions acoustiques |
US20220154443A1 (en) * | 2020-11-19 | 2022-05-19 | Icon Technology, Inc. | Topologically adaptive toolpath generation system and method for additively constructing a building structure |
CN112643055A (zh) * | 2020-12-16 | 2021-04-13 | 重庆机电增材制造有限公司 | 一种零件翘曲变形矫正装置 |
FR3133549A1 (fr) * | 2022-03-15 | 2023-09-22 | Safran Additive Manufacturing Campus | Procédé de fonctionnement d’un système de fusion laser sur lit de poudre |
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